公开(公告)号：US20150041845A1

公开(公告)日：2015-02-12

申请号：US14382578

申请日：2013-02-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Stefan Illek

IPC: H01L33/54 ,  H01L33/64 ,  H01L33/62

CPC classification number: H01L33/54 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0075 ,  H01L2924/00

Abstract: The invention relates to a light-emitting semiconductor component comprising a light-emitting semiconductor chip with a semiconductor layer series, a light out-coupling surface, a rear surface lying opposite said light out-coupling surface and lateral surfaces, and a support body with a shaped body that directly covers the lateral surfaces in form-locked manner, two electric contact layers and a thermal contact layer being provided on the rear surface. The thermal contact layer is electrically insulated from the electric contact layers and the semiconductor layer series, the support body has electric connection elements in direct contact with the electric contact layers and a thermal connection element in direct contact with the thermal contact layer on the rear surface and the thermal connection element at least partially forms an assembly surface of the semiconductor component facing away from the semiconductor chip. The invention further relates to a method for producing a semiconductor component.

Abstract translation: 本发明涉及一种发光半导体元件，其包括具有半导体层系列的发光半导体芯片，发光耦合表面，与所述发光耦合表面相对的后表面和侧表面，以及支撑体， 以形状锁定的方式直接覆盖侧表面的成形体，在后表面上设置有两个电接触层和热接触层。 热接触层与电接触层和半导体层系列电绝缘，支撑体具有与电接触层直接接触的电连接元件和与后接触层上的热接触层直接接触的热连接元件 并且热连接元件至少部分地形成半导体元件背离半导体芯片的组装表面。 本发明还涉及半导体元件的制造方法。

公开(公告)号：US20150014737A1

公开(公告)日：2015-01-15

申请号：US14378610

申请日：2013-01-17

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Stefan Illek ,  Walter Wegleiter ,  Karl Weidner ,  Stefan Stegmeier

IPC: H01L33/64 ,  H01L33/36 ,  H01L33/52 ,  H01L27/15 ,  H01L33/00 ,  H01L33/62

CPC classification number: H01L33/64 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/005 ,  H01L33/36 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014

Abstract: In at least one embodiment, the semiconductor component includes at least one optoelectronic semiconductor chip having a radiation exit side. The surface-mountable semiconductor component comprises a shaped body that covers side surfaces of the semiconductor chip directly and in a positively locking manner. The shaped body and the semiconductor chip do not overlap, as seen in a plan view of the radiation exit side.

Abstract translation: 在至少一个实施例中，半导体部件包括具有辐射出射侧的至少一个光电子半导体芯片。 可表面安装的半导体部件包括直接覆盖半导体芯片的侧表面并以正锁定方式覆盖的成形体。 成形体和半导体芯片不重叠，如在辐射出口侧的平面图中所见。