公开(公告)号：US11081476B1

公开(公告)日：2021-08-03

申请号：US16458085

申请日：2019-06-30

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama ,  Matthew Moe

IPC: H01L27/02 ,  H01L21/66 ,  G01R31/303 ,  H01L21/8234 ,  H01L23/522 ,  H01L27/088 ,  H01L27/118 ,  G06F30/392 ,  G06F30/398

Abstract: An IC that includes a contiguous standard cell area with a 4×3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.

公开(公告)号：US11018126B1

公开(公告)日：2021-05-25

申请号：US16458082

申请日：2019-06-30

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama ,  Matthew Moe

IPC: H01L27/02 ,  H01J37/26 ,  H01L21/66 ,  H03K19/0944 ,  H01L23/528 ,  H01L27/088 ,  H01L23/522 ,  H01L21/3213 ,  H01L29/08 ,  H01L29/45 ,  G01R31/28 ,  H01L21/8234 ,  G06F30/39

Abstract: An IC that includes a contiguous standard cell area with a 4×3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.

公开(公告)号：US10978438B1

公开(公告)日：2021-04-13

申请号：US16458042

申请日：2019-06-29

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama ,  Matthew Moe

IPC: H01L21/66 ,  H01L27/02 ,  H01L23/528 ,  H01L23/522 ,  H01L29/417 ,  H01L21/8234 ,  H01L21/3213 ,  G01R31/28 ,  H01L27/088 ,  H01L29/45 ,  H01L29/08

Abstract: An IC that includes a contiguous standard cell area with a 4×3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.

公开(公告)号：US10854522B1

公开(公告)日：2020-12-01

申请号：US15942475

申请日：2018-03-31

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC: H01L23/528 ,  H01L21/66 ,  H01L27/118 ,  H01L29/417 ,  H01L27/02 ,  G06F11/07 ,  H01L29/06 ,  G06F30/30 ,  G06F30/39 ,  G06F30/392 ,  G06F30/398

Abstract: A method for processing a semiconductor wafer uses non-contact electrical measurements indicative of at least one tip-to-side short or leakage, at least one corner short or leakage, and at least one via open or resistance, where such measurements are obtained from non-contact pads associated with respective tip-to-side short, corner short, and via open test areas.

公开(公告)号：US10199294B1

公开(公告)日：2019-02-05

申请号：US16024856

申请日：2018-06-30

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC: H01L23/58 ,  H01L21/66 ,  H01L23/528 ,  H01L27/02 ,  H01L27/118 ,  H01L29/06

Abstract: A method for processing a semiconductor wafer uses non-contact electrical measurements indicative of at least one side-to-side short or leakage, at least one via-chamfer short or leakage, and at least one corner short or leakage, where such measurements are obtained from cells with respective side-to-side short, via-chamfer short, and corner short test areas, using a charged particle-beam inspector with a moving stage and beam deflection to account for motion of the stage.

公开(公告)号：US10199285B1

公开(公告)日：2019-02-05

申请号：US15937356

申请日：2018-03-27

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC: H01L21/66 ,  H01L27/02 ,  H01L23/528 ,  H01L29/06

Abstract: A method for processing a semiconductor wafer uses non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one side-to-side short or leakage, and at least one via open or resistance, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, side-to-side short, and via open test areas.

公开(公告)号：US10199283B1

公开(公告)日：2019-02-05

申请号：US15857691

申请日：2017-12-29

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC: H01L23/58 ,  H01L21/66 ,  H01L23/528

Abstract: A method for processing a semiconductor wafer uses non-contact electrical measurements indicative of a resistance through a stitch, where such measurements are obtained by scanning a pad comprised of at least three electrically connected, parallel conductive stripes using a moving stage with beam deflection to account for motion of the stage.

公开(公告)号：US10096529B1

公开(公告)日：2018-10-09

申请号：US15634888

申请日：2017-06-27

Applicant: PDF Solutions, inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC: H01L29/00 ,  H01L21/66 ,  G06F17/50 ,  H01L27/02 ,  G06F11/07 ,  H01L29/06

Abstract: A process for making and using a semiconductor wafer includes instantiating first and second designs of experiments (DOES), each comprised of at least two fill cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The first DOE contains fill cells configured to enable non-contact (NC) detection of via opens, and the second DOE contains fill cells configured to enable NC detection of metal island opens. The process may further include obtaining NC measurements from the first and/or second DOE(s) and using such measurements, at least in part, to selectively perform additional processing, metrology or inspection steps on the wafer, and/or on other wafer(s) currently being manufactured.

公开(公告)号：US09953889B1

公开(公告)日：2018-04-24

申请号：US15281491

申请日：2016-09-30

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC: H01L21/00 ,  H01L21/66 ,  H01L27/02

CPC classification number: H01L22/26 ,  G01R31/2884 ,  G06F11/079 ,  G06F17/5045 ,  G06F17/5068 ,  G06F17/5072 ,  G06F17/5081 ,  H01L22/20 ,  H01L22/34 ,  H01L23/5226 ,  H01L23/528 ,  H01L27/0207 ,  H01L27/11803 ,  H01L27/11807 ,  H01L29/0649 ,  H01L29/0684 ,  H01L29/41725 ,  H01L29/45 ,  H01L2027/11866 ,  H01L2027/11875 ,  H01L2027/11885 ,  H01L2027/11887

Abstract: Improved processes for manufacturing semiconductor wafers, chips, or dies utilize in-line data obtained from non-contact electrical measurements (“NCEM”) of fill cells that contain structures configured to target/expose a variety of open-circuit, short-circuit, leakage, and/or excessive resistance failure modes. Such processes include evaluating one or more Designs of Experiments (“DOEs”), each comprised of multiple NCEM-enabled fill cells, in at least two variants, targeted to the same failure mode. Such DOEs include multiple means/steps for enabling non-contact (NC) detection of GATECNT-GATE via opens.

公开(公告)号：US09947601B1

公开(公告)日：2018-04-17

申请号：US15719513

申请日：2017-09-28

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC: H01L29/00 ,  H01L21/66 ,  H01L27/118 ,  H01L29/417 ,  H01L27/02 ,  H01L23/528 ,  G06F11/07 ,  G06F17/50 ,  H01L29/06

CPC classification number: H01L22/20 ,  G01R31/303 ,  G06F11/079 ,  G06F17/5045 ,  G06F17/5068 ,  G06F17/5072 ,  G06F17/5081 ,  G06F2217/06 ,  H01L21/823437 ,  H01L21/823475 ,  H01L22/26 ,  H01L22/32 ,  H01L22/34 ,  H01L23/5226 ,  H01L23/528 ,  H01L27/0207 ,  H01L27/088 ,  H01L27/11803 ,  H01L27/11807 ,  H01L28/00 ,  H01L29/0649 ,  H01L29/0684 ,  H01L29/0847 ,  H01L29/41725 ,  H01L29/45 ,  H01L2027/11866 ,  H01L2027/11875 ,  H01L2027/11888

Abstract: An integrated circuit, in the form of a wafer, die, or chip, includes multiple standard cell-compatible fill cells, configured to enable non-contact electrical measurements. Such fill cells include mesh pads that contain at least three conductive stripes disposed between adjacent gate stripes. Such fill cells further include geometry to enable non-contact evaluation of side-to-side shorts and/or leakages.