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公开(公告)号:US09741703B1
公开(公告)日:2017-08-22
申请号:US15391884
申请日:2016-12-28
Applicant: PDF Solutions, Inc.
Inventor: Stephen Lam , Dennis Ciplickas , Tomasz Brozek , Jeremy Cheng , Simone Comensoli , Indranil De , Kelvin Doong , Hans Eisenmann , Timothy Fiscus , Jonathan Haigh , Christopher Hess , John Kibarian , Sherry Lee , Marci Liao , Sheng-Che Lin , Hideki Matsuhashi , Kimon Michaels , Conor O'Sullivan , Markus Rauscher , Vyacheslav Rovner , Andrzej Strojwas , Marcin Strojwas , Carl Taylor , Rakesh Vallishayee , Larg Weiland , Nobuharu Yokoyama
IPC: H01L29/00 , H01L27/02 , H01L21/66 , H01L29/417 , H01L29/06 , H01L23/528 , G06F17/50 , G06F11/07
CPC classification number: H01L22/20 , G01R31/303 , G06F11/079 , G06F17/5045 , G06F17/5068 , G06F17/5072 , G06F17/5081 , G06F2217/06 , H01L21/823437 , H01L21/823475 , H01L22/26 , H01L22/32 , H01L22/34 , H01L23/5226 , H01L23/528 , H01L27/0207 , H01L27/088 , H01L27/11803 , H01L27/11807 , H01L28/00 , H01L29/0649 , H01L29/0684 , H01L29/0847 , H01L29/41725 , H01L29/45 , H01L2027/11866 , H01L2027/11875 , H01L2027/11888
Abstract: An IC includes logic cells, selected from a standard cell library, and fill cells, configured for compatibility with the standard logic cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The IC includes such NCEM-enabled fill cells configured to enable detection and/or measurement of a variety of open-circuit and short-circuit failure modes, including at least one via-open-related failure mode, one GATE-short-related failure mode, one TS-short-related failure mode, and one AA-short-related failure mode.
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公开(公告)号:US09728553B1
公开(公告)日:2017-08-08
申请号:US15371955
申请日:2016-12-07
Applicant: PDF Solutions, Inc.
Inventor: Stephen Lam , Dennis Ciplickas , Tomasz Brozek , Jeremy Cheng , Simone Comensoli , Indranil De , Kelvin Doong , Hans Eisenmann , Timothy Fiscus , Jonathan Haigh , Christopher Hess , John Kibarian , Sherry Lee , Marci Liao , Sheng-Che Lin , Hideki Matsuhashi , Kimon Michaels , Conor O'Sullivan , Markus Rauscher , Vyacheslav Rovner , Andrzej Strojwas , Marcin Strojwas , Carl Taylor , Rakesh Vallishayee , Larg Weiland , Nobuharu Yokoyama
IPC: H01L29/00 , H01L27/02 , H01L27/118 , H01L23/528 , H01L23/522 , H01L29/45 , G01R31/28
CPC classification number: H01L22/26 , G01R31/2884 , G06F11/079 , G06F17/5045 , G06F17/5068 , G06F17/5072 , G06F17/5081 , H01L22/20 , H01L22/34 , H01L23/5226 , H01L23/528 , H01L27/0207 , H01L27/11803 , H01L27/11807 , H01L29/0649 , H01L29/0684 , H01L29/41725 , H01L29/45 , H01L2027/11866 , H01L2027/11875 , H01L2027/11885 , H01L2027/11887
Abstract: An IC includes logic cells, selected from a standard cell library, and fill cells, configured for compatibility with the standard logic cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The IC includes such NCEM-enabled fill cells configured to enable detection and/or measurement of a variety of open-circuit and short-circuit failure modes, including at least one via-open-related failure mode, one AACNT-short-related failure mode, one GATE-short-related failure mode, and one TS-short-related failure mode.
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公开(公告)号:US11081476B1
公开(公告)日:2021-08-03
申请号:US16458085
申请日:2019-06-30
Applicant: PDF Solutions, Inc.
Inventor: Stephen Lam , Dennis Ciplickas , Tomasz Brozek , Jeremy Cheng , Simone Comensoli , Indranil De , Kelvin Doong , Hans Eisenmann , Timothy Fiscus , Jonathan Haigh , Christopher Hess , John Kibarian , Sherry Lee , Marci Liao , Sheng-Che Lin , Hideki Matsuhashi , Kimon Michaels , Conor O'Sullivan , Markus Rauscher , Vyacheslav Rovner , Andrzej Strojwas , Marcin Strojwas , Carl Taylor , Rakesh Vallishayee , Larg Weiland , Nobuharu Yokoyama , Matthew Moe
IPC: H01L27/02 , H01L21/66 , G01R31/303 , H01L21/8234 , H01L23/522 , H01L27/088 , H01L27/118 , G06F30/392 , G06F30/398
Abstract: An IC that includes a contiguous standard cell area with a 4×3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.
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公开(公告)号:US11018126B1
公开(公告)日:2021-05-25
申请号:US16458082
申请日:2019-06-30
Applicant: PDF Solutions, Inc.
Inventor: Stephen Lam , Dennis Ciplickas , Tomasz Brozek , Jeremy Cheng , Simone Comensoli , Indranil De , Kelvin Doong , Hans Eisenmann , Timothy Fiscus , Jonathan Haigh , Christopher Hess , John Kibarian , Sherry Lee , Marci Liao , Sheng-Che Lin , Hideki Matsuhashi , Kimon Michaels , Conor O'Sullivan , Markus Rauscher , Vyacheslav Rovner , Andrzej Strojwas , Marcin Strojwas , Carl Taylor , Rakesh Vallishayee , Larg Weiland , Nobuharu Yokoyama , Matthew Moe
IPC: H01L27/02 , H01J37/26 , H01L21/66 , H03K19/0944 , H01L23/528 , H01L27/088 , H01L23/522 , H01L21/3213 , H01L29/08 , H01L29/45 , G01R31/28 , H01L21/8234 , G06F30/39
Abstract: An IC that includes a contiguous standard cell area with a 4×3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.
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公开(公告)号:US10978438B1
公开(公告)日:2021-04-13
申请号:US16458042
申请日:2019-06-29
Applicant: PDF Solutions, Inc.
Inventor: Stephen Lam , Dennis Ciplickas , Tomasz Brozek , Jeremy Cheng , Simone Comensoli , Indranil De , Kelvin Doong , Hans Eisenmann , Timothy Fiscus , Jonathan Haigh , Christopher Hess , John Kibarian , Sherry Lee , Marci Liao , Sheng-Che Lin , Hideki Matsuhashi , Kimon Michaels , Conor O'Sullivan , Markus Rauscher , Vyacheslav Rovner , Andrzej Strojwas , Marcin Strojwas , Carl Taylor , Rakesh Vallishayee , Larg Weiland , Nobuharu Yokoyama , Matthew Moe
IPC: H01L21/66 , H01L27/02 , H01L23/528 , H01L23/522 , H01L29/417 , H01L21/8234 , H01L21/3213 , G01R31/28 , H01L27/088 , H01L29/45 , H01L29/08
Abstract: An IC that includes a contiguous standard cell area with a 4×3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.
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公开(公告)号:US10854522B1
公开(公告)日:2020-12-01
申请号:US15942475
申请日:2018-03-31
Applicant: PDF Solutions, Inc.
Inventor: Stephen Lam , Dennis Ciplickas , Tomasz Brozek , Jeremy Cheng , Simone Comensoli , Indranil De , Kelvin Doong , Hans Eisenmann , Timothy Fiscus , Jonathan Haigh , Christopher Hess , John Kibarian , Sherry Lee , Marci Liao , Sheng-Che Lin , Hideki Matsuhashi , Kimon Michaels , Conor O'Sullivan , Markus Rauscher , Vyacheslav Rovner , Andrzej Strojwas , Marcin Strojwas , Carl Taylor , Rakesh Vallishayee , Larg Weiland , Nobuharu Yokoyama
IPC: H01L23/528 , H01L21/66 , H01L27/118 , H01L29/417 , H01L27/02 , G06F11/07 , H01L29/06 , G06F30/30 , G06F30/39 , G06F30/392 , G06F30/398
Abstract: A method for processing a semiconductor wafer uses non-contact electrical measurements indicative of at least one tip-to-side short or leakage, at least one corner short or leakage, and at least one via open or resistance, where such measurements are obtained from non-contact pads associated with respective tip-to-side short, corner short, and via open test areas.
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公开(公告)号:US10199294B1
公开(公告)日:2019-02-05
申请号:US16024856
申请日:2018-06-30
Applicant: PDF Solutions, Inc.
Inventor: Stephen Lam , Dennis Ciplickas , Tomasz Brozek , Jeremy Cheng , Simone Comensoli , Indranil De , Kelvin Doong , Hans Eisenmann , Timothy Fiscus , Jonathan Haigh , Christopher Hess , John Kibarian , Sherry Lee , Marci Liao , Sheng-Che Lin , Hideki Matsuhashi , Kimon Michaels , Conor O'Sullivan , Markus Rauscher , Vyacheslav Rovner , Andrzej Strojwas , Marcin Strojwas , Carl Taylor , Rakesh Vallishayee , Larg Weiland , Nobuharu Yokoyama
IPC: H01L23/58 , H01L21/66 , H01L23/528 , H01L27/02 , H01L27/118 , H01L29/06
Abstract: A method for processing a semiconductor wafer uses non-contact electrical measurements indicative of at least one side-to-side short or leakage, at least one via-chamfer short or leakage, and at least one corner short or leakage, where such measurements are obtained from cells with respective side-to-side short, via-chamfer short, and corner short test areas, using a charged particle-beam inspector with a moving stage and beam deflection to account for motion of the stage.
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公开(公告)号:US10199285B1
公开(公告)日:2019-02-05
申请号:US15937356
申请日:2018-03-27
Applicant: PDF Solutions, Inc.
Inventor: Stephen Lam , Dennis Ciplickas , Tomasz Brozek , Jeremy Cheng , Simone Comensoli , Indranil De , Kelvin Doong , Hans Eisenmann , Timothy Fiscus , Jonathan Haigh , Christopher Hess , John Kibarian , Sherry Lee , Marci Liao , Sheng-Che Lin , Hideki Matsuhashi , Kimon Michaels , Conor O'Sullivan , Markus Rauscher , Vyacheslav Rovner , Andrzej Strojwas , Marcin Strojwas , Carl Taylor , Rakesh Vallishayee , Larg Weiland , Nobuharu Yokoyama
IPC: H01L21/66 , H01L27/02 , H01L23/528 , H01L29/06
Abstract: A method for processing a semiconductor wafer uses non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one side-to-side short or leakage, and at least one via open or resistance, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, side-to-side short, and via open test areas.
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公开(公告)号:US10199283B1
公开(公告)日:2019-02-05
申请号:US15857691
申请日:2017-12-29
Applicant: PDF Solutions, Inc.
Inventor: Stephen Lam , Dennis Ciplickas , Tomasz Brozek , Jeremy Cheng , Simone Comensoli , Indranil De , Kelvin Doong , Hans Eisenmann , Timothy Fiscus , Jonathan Haigh , Christopher Hess , John Kibarian , Sherry Lee , Marci Liao , Sheng-Che Lin , Hideki Matsuhashi , Kimon Michaels , Conor O'Sullivan , Markus Rauscher , Vyacheslav Rovner , Andrzej Strojwas , Marcin Strojwas , Carl Taylor , Rakesh Vallishayee , Larg Weiland , Nobuharu Yokoyama
IPC: H01L23/58 , H01L21/66 , H01L23/528
Abstract: A method for processing a semiconductor wafer uses non-contact electrical measurements indicative of a resistance through a stitch, where such measurements are obtained by scanning a pad comprised of at least three electrically connected, parallel conductive stripes using a moving stage with beam deflection to account for motion of the stage.
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公开(公告)号:US10096529B1
公开(公告)日:2018-10-09
申请号:US15634888
申请日:2017-06-27
Applicant: PDF Solutions, inc.
Inventor: Stephen Lam , Dennis Ciplickas , Tomasz Brozek , Jeremy Cheng , Simone Comensoli , Indranil De , Kelvin Doong , Hans Eisenmann , Timothy Fiscus , Jonathan Haigh , Christopher Hess , John Kibarian , Sherry Lee , Marci Liao , Sheng-Che Lin , Hideki Matsuhashi , Kimon Michaels , Conor O'Sullivan , Markus Rauscher , Vyacheslav Rovner , Andrzej Strojwas , Marcin Strojwas , Carl Taylor , Rakesh Vallishayee , Larg Weiland , Nobuharu Yokoyama
Abstract: A process for making and using a semiconductor wafer includes instantiating first and second designs of experiments (DOES), each comprised of at least two fill cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The first DOE contains fill cells configured to enable non-contact (NC) detection of via opens, and the second DOE contains fill cells configured to enable NC detection of metal island opens. The process may further include obtaining NC measurements from the first and/or second DOE(s) and using such measurements, at least in part, to selectively perform additional processing, metrology or inspection steps on the wafer, and/or on other wafer(s) currently being manufactured.
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