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公开(公告)号：US20210116478A1
公开(公告)日：2021-04-22
申请号：US17038642
申请日：2020-09-30
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
Abstract: Proposed is a multilayer wiring substrate having excellent joining strength, a method of manufacturing the multilayer wiring substrate, and a probe card having the multilayer wiring substrate.
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公开(公告)号：US20200251373A1
公开(公告)日：2020-08-06
申请号：US16777794
申请日：2020-01-30
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
IPC: H01L21/683 , H01L33/00 , H05K13/04
Abstract: The present invention relates to a micro LED transfer head transferring a micro light-emitting diode (micro LED) from a first substrate to a second substrate. More particularly, the present invention relates to a micro LED transfer head, in which the lowering position of the micro LED transfer head is limited.
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公开(公告)号：US20200065545A1
公开(公告)日：2020-02-27
申请号：US16546108
申请日：2019-08-20
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
IPC: G06K9/00 , H01L27/146
Abstract: Disclosed is a biometric sensor capable of reliably obtaining a biometric image optically. Further disclosed is a display device including the biometric sensor. The biometric sensor includes a photo-detector and an anodic oxide film. The anodic oxide film is provided with a through hole vertically extending through the anodic oxide film from an upper surface to a lower surface, having a larger width than pores formed in the anodic oxide film during anodic oxidation, and providing an optical path leading to the photo-detector.
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公开(公告)号：US20200013648A1
公开(公告)日：2020-01-09
申请号：US16459457
申请日：2019-07-01
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
IPC: H01L21/67 , H01L21/683 , B65G47/91
Abstract: The present invention relates to a micro LED transfer head improving efficiency of transferring micro LEDs.
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公开(公告)号：US20200006110A1
公开(公告)日：2020-01-02
申请号：US16447852
申请日：2019-06-20
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
IPC: H01L21/683 , H01L33/00
Abstract: The present invention relates to a micro LED transfer head transferring micro LEDs from a first substrate to a second substrate. According to the present invention, vacuum pressure of a grip region where the micro LEDs are gripped is uniformized, so that the micro LED transfer head transfers the micro LEDs efficiently. In addition, the vacuum pressure is distributed over a grip surface where the micro LEDs are gripped, thereby improving efficiency of transferring the micro LEDs.
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Patent Agency Ranking
公开(公告)号：US20190314533A1
公开(公告)日：2019-10-17
申请号：US16383406
申请日：2019-04-12
Applicant: POINT ENGINEERING CO.,LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Moon Hyun KIM
Abstract: The present invention relates generally to an ultraviolet sterilization module for sterilizing a fluid using ultraviolet light. More particularly, the present invention relates to an ultraviolet sterilization module, configured such that an increase in amount of ultraviolet irradiation is achieved, thus efficiently sterilizing a fluid inside a light transmission member without requiring an increase in size of the light transmission member.
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公开(公告)号：US20190304854A1
公开(公告)日：2019-10-03
申请号：US16369802
申请日：2019-03-29
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK
IPC: H01L21/66 , H01L25/075
Abstract: The present invention relates to an inspection and replacement method for a micro LED, the method being configured to inspect whether the micro LED is defective and replace a defective micro LED with a normal micro LED. More particularly, the present invention relates to an inspection and replacement method for a micro LED in which when micro LEDs are transferred to a display substrate, the micro LEDs are inspected so as to detect and remove a defective micro LED, and a normal micro LED is placed at a position where the defective micro LED is removed so as to be replaced with the defective micro LED.
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公开(公告)号：US20190165219A1
公开(公告)日：2019-05-30
申请号：US16198383
申请日：2018-11-21
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Tae Hwan SONG
Abstract: Disclosed is a substrate for an optical device. The substrate has a cavity for mounting an optical element. The cavity has a sloped wall surface having a surface roughness Ra controlled to fall within a range of 1 nm≤Ra≤100 nm, thereby increasing the surface reflectance inside the cavity in which the optical element is mounted and thus minimizing the loss of light emitted from the optical element. Further disclosed is an optical device package including the same substrate.
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公开(公告)号：US20180074033A1
公开(公告)日：2018-03-15
申请号：US15702666
申请日：2017-09-12
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Tae Hwan SONG
Abstract: Disclosed is a microsensor package. Particularly, disclosed is a microsensor package configured such that a substrate with a sensor electrode is formed with a plurality of pores penetrating vertically therethrough, the lower surface of the substrate is formed with a bonding portion, and the pores under the sensor electrode pad are provided therein with respective connecting portions electrically connecting the sensor electrode pad and the bonding portion, whereby it is possible to provide a light, slim, and compact microsensor package, and it is possible to mount the microsensor package to a printed circuit board (PCB) without wire bonding.
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公开(公告)号：US20180045664A1
公开(公告)日：2018-02-15
申请号：US15674463
申请日：2017-08-10
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
IPC: G01N27/12
CPC classification number: G01N27/128 , G01N27/123
Abstract: Disclosed is a micro sensor. Particularly, disclosed is a micro sensor capable of changing a resistance value of a resistance unit connected to a sensor electrode depending on a sensing material, the resistance unit having at least two resistors.
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