公开(公告)号：US06494956B2

公开(公告)日：2002-12-17

申请号：US09921839

申请日：2001-08-02

申请人： Gary L. Curtis ,  Raymon F. Thompson

发明人： Gary L. Curtis ,  Raymon F. Thompson

IPC分类号： C23C1600

CPC分类号： H01L21/67017 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/6708 ,  Y10S134/902

摘要： An apparatus for processing a workpiece in a micro-environment includes a workpiece housing connected to a motor for rotation. The workpiece housing forms a substantially closed processing chamber where processing fluids are distributed across at least one face of the workpiece by centrifugal force generated during rotation of the housing. The housing may also be detached from the motor and moved to another location. The housing consequently serves as a processing chamber, as well as a storage or transport chamber.

摘要翻译： 用于在微环境中处理工件的装置包括连接到用于旋转的电动机的工件壳体。 工件壳体形成基本封闭的处理室，其中处理流体通过在壳体旋转期间产生的离心力分布在工件的至少一个表面上。 壳体也可以从电动机分离并移动到另一位置。 壳体因此用作处理室，以及存储或运输室。

公开(公告)号：US06413436B1

公开(公告)日：2002-07-02

申请号：US09437926

申请日：1999-11-10

申请人： Brian Aegerter ,  Curt T. Dundas ,  Michael Jolley ,  Tom L. Ritzdorf ,  Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson

发明人： Brian Aegerter ,  Curt T. Dundas ,  Michael Jolley ,  Tom L. Ritzdorf ,  Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson

IPC分类号： C23F102

CPC分类号： H01L21/67017 ,  C23F1/18 ,  H01L21/32134 ,  H01L21/6708 ,  Y10S438/928 ,  Y10S438/963

摘要： In a process for treating a workpiece such as a semiconductor wafer, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides of the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece while the workpiece and a reactor holding the workpiece are spinning. The flow rate of the processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.

公开(公告)号：US5882168A

公开(公告)日：1999-03-16

申请号：US881553

申请日：1997-06-24

申请人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright

发明人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright

IPC分类号： B65G49/07 ,  H01L21/00 ,  H01L21/673 ,  H01L21/677 ,  B65B21/02

CPC分类号： H01L21/67754 ,  H01L21/67173 ,  H01L21/67313 ,  H01L21/67326 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  H01L21/67781 ,  Y10S414/138 ,  Y10S414/141

摘要： A processor for processing semiconductor articles, such as integrated circuit wafers, flat panel displays, semiconductor substrates, and data disks. The processor has an interface section which receives articles in article carriers. The interface section transfers the articles from carriers into processing arrays. A conveyor having an automated arm assembly moves article arrays to and between processing stations. The processing stations are accessed from an enclosed area adjoining the interface section.

摘要翻译： 用于处理诸如集成电路晶片，平板显示器，半导体衬底和数据盘的半导体产品的处理器。 处理器具有接收物品载体中的物品的接口部分。 接口部分将物品从载体转移到处理阵列中。 具有自动臂组件的输送机将物品阵列移动到处理站之间和处理站之间。 处理站从与接口部分相邻的封闭区域进行访问。

公开(公告)号：US5784802A

公开(公告)日：1998-07-28

申请号：US881682

申请日：1997-06-24

申请人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright

发明人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright

IPC分类号： B65G49/07 ,  H01L21/00 ,  H01L21/673 ,  H01L21/677 ,  F26B5/08

CPC分类号： H01L21/67754 ,  H01L21/67173 ,  H01L21/67313 ,  H01L21/67326 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  H01L21/67781 ,  Y10S414/138 ,  Y10S414/141

摘要： A processor for processing semiconductor articles, such as integrated circuit wafers, flat panel displays, semiconductor substrates, and data disks. The processor has an interface section which receives articles in article carriers. The interface section transfers the articles from carriers into processing arrays. A conveyor having an automated arm assembly moves article arrays to and between processing stations. The processing stations are accessed from an enclosed area adjoining the interface section.

公开(公告)号：US5660517A

公开(公告)日：1997-08-26

申请号：US415927

申请日：1995-03-31

申请人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright ,  Darryl S. Byle ,  John M. Pedersen

发明人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright ,  Darryl S. Byle ,  John M. Pedersen

IPC分类号： B65G49/07 ,  H01L21/00 ,  H01L21/673 ,  H01L21/677

CPC分类号： H01L21/67781 ,  H01L21/67173 ,  H01L21/67313 ,  H01L21/67326 ,  H01L21/67742 ,  H01L21/67754 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  Y10S134/902 ,  Y10S414/138 ,  Y10S414/14 ,  Y10S414/141

摘要： A processor for processing integrated circuit wafers, semiconductor substrates, data disks and similar units requiring very low contamination levels. The processor has an interface section which receives wafers in standard wafer carriers. The interface section transfers the wafers from carriers onto novel trays for improved processing. The interface unit can hold multiple groups of multiple trays. A conveyor having an automated arm assembly moves wafers supported on a tray. The conveyor moves the trays from the interface along a track to several processing stations. The processing stations are accessed from an enclosed area adjoining the interface section.

摘要翻译： 用于处理集成电路晶片，半导体衬底，数据盘以及需要非常低的污染水平的类似单元的处理器。 处理器具有在标准晶片载体中接收晶片的接口部分。 接口部分将晶片从载体转移到新的托盘上以改进处理。 接口单元可以容纳多组多个托盘。 具有自动臂组件的输送机移动支撑在托盘上的晶片。 输送机将托盘从接口沿轨道移动到多个处理站。 处理站从与接口部分相邻的封闭区域进行访问。

公开(公告)号：US5230743A

公开(公告)日：1993-07-27

申请号：US922197

申请日：1992-07-30

申请人： Raymon F. Thompson ,  Robert W. Gordon ,  Daniel Durado

发明人： Raymon F. Thompson ,  Robert W. Gordon ,  Daniel Durado

IPC分类号： H01L21/00 ,  H01L21/687

CPC分类号： H01L21/68785 ,  H01L21/67023

摘要： A single wafer processor supports a semiconductor wafer having at least one surface that is to be subjected to contact with a fluid. The equipment includes a portable module including a gripper assembly that is rotatable about the axis of a portable housing and is capable of mechanically engaging or disengaging the edge of an individual wafer. The portable module is complementary to a receiving base having an open bowl provided with liquid jets for discharging processing liquids or reagents in parallel streams directed toward the outer surface of a rotating wafer. The bowl can also be filled with liquid for immersion treatment of a wafer, which can be held stationary or rotated at slow speeds. The portable unit is moved between base units by a robotic arm. All elements associated with holding of the wafer are physically shielded to minimize wafer contamination from environmental contact.

摘要翻译： 单个晶片处理器支持具有至少一个要与流体接触的表面的半导体晶片。 该设备包括便携式模块，其包括能够围绕便携式壳体的轴线旋转的夹持器组件，并且能够机械地接合或脱离单个晶片的边缘。 便携式模块与接收基座互补，该接收基座具有设置有液体射流的开口碗，用于排出指向旋转晶片的外表面的平行流中的处理液体或试剂。 碗也可以填充用于浸没处理晶片的液体，其可以保持静止或以低速旋转。 便携式单元通过机器臂在基座单元之间移动。 与保持晶片相关联的所有元件被物理屏蔽以最小化来自环境接触的晶片污染。

公开(公告)号：US5174045A

公开(公告)日：1992-12-29

申请号：US703266

申请日：1991-05-17

申请人： Raymon F. Thompson ,  Aleksander Owczarz

发明人： Raymon F. Thompson ,  Aleksander Owczarz

IPC分类号： F26B5/08 ,  F26B25/00 ,  H01L21/00

CPC分类号： H01L21/67028 ,  F26B25/004 ,  F26B5/08 ,  Y10S414/135

摘要： A processor for centrifugal processing of semiconductor wafers and similar units without a wafer carrier. The processor is specially constructed to provide an automatically extendible and retractable rotor head to allow automated loading and unloading of discrete wafers onto the rotor head. The rotor head includes means for holding the wafers in spaced discrete relationship without a carrier. The processor includes a novel shaft assembly construction which includes an axially extendible shaft controlled using pressurized fluid. The pressurized fluid is supplied to the shaft assembly by a pressure supply which is controllably extendible and retractable for engagement with the shaft assembly when rotation is stopped. The shaft assembly also preferably incorporates an axial locking mechanism which holds the axially movable components of the shaft assembly in fixed axial position during rotation, while allowing release when rotation is stopped so that movable portions of the shaft assembly can be axially extended.

摘要翻译： 一种用于离心处理半导体晶片和类似单元而没有晶片载体的处理器。 该处理器是特别构造的，以提供可自动伸缩的转子头，以允许将离散晶片自动加载和卸载到转子头上。 转子头包括用于将晶片保持在间隔离散的关系中而没有载体的装置。 该处理器包括新颖的轴组件结构，其包括使用加压流体控制的可轴向延伸的轴。 加压流体通过压力供应器供应到轴组件，该压力供应器在旋转停止时可控制地伸缩并用于与轴组件接合。 轴组件还优选地包括轴向锁定机构，其将轴组件的可轴向移动的部件在旋转期间保持在固定的轴向位置，同时当旋转停止时允许释放，使得轴组件的可动部分可以轴向延伸。

公开(公告)号：US5168887A

公开(公告)日：1992-12-08

申请号：US526243

申请日：1990-05-18

申请人： Raymon F. Thompson ,  Aleksander Owczarz

发明人： Raymon F. Thompson ,  Aleksander Owczarz

IPC分类号： B08B11/02 ,  G11B7/26 ,  H01L21/00 ,  H01L21/304 ,  H01L21/306 ,  H01L21/677 ,  H01L21/683 ,  H01L21/687

CPC分类号： H01L21/6719 ,  H01L21/6708 ,  H01L21/67086 ,  H01L21/68707 ,  H01L21/68728 ,  H01L21/68785 ,  H01L21/68792 ,  G11B7/26 ,  Y10S134/902

摘要： A single wafer processing apparatus includes a portable processing head that can be a portable module or a movable unit mounted to a supporting machine frame. The processing head has movable fingers adapted to grip a wafer. The fingers protrude from a protective wafer plate. Indexing and rotation monitoring assemblies are provided for automation of the wafer processing steps. A complementary processing base includes an upwardly-open bowl that receives a wafer held by the portable processing head. It has a full-diameter movable bottom wall for rapid draining purposes. Liquid and/or gas jets and nozzles supply fluids required within the bowl for processing of wafers.

摘要翻译： 单个晶片处理装置包括便携式处理头，其可以是安装到支撑机架的便携式模块或可移动单元。 处理头具有适于夹紧晶片的活动指状物。 指状物从保护性晶片板突出。 提供分度和旋转监测组件用于晶片处理步骤的自动化。 补充处理基座包括接收由便携式处理头保持的晶片的向上开口的碗。 它具有用于快速排水的全直径可移动底壁。 液体和/或气体喷嘴和喷嘴提供碗内所需的流体用于处理晶片。

公开(公告)号：US5168886A

公开(公告)日：1992-12-08

申请号：US328888

申请日：1989-03-27

申请人： Raymon F. Thompson ,  Robert W. Gordon ,  Daniel Durado

发明人： Raymon F. Thompson ,  Robert W. Gordon ,  Daniel Durado

IPC分类号： H01L21/00 ,  H01L21/687

CPC分类号： H01L21/68707 ,  H01L21/67023 ,  H01L21/68728 ,  Y10S134/902

摘要： A single wafer processor supports a semiconductor wafer having at least one surface that is to be subjected to contact with a fluid. The equipment includes a portable module including a gripper assembly that is rotatable about the axis of a portable housing and is capable of mechanically engaging or disengaging the edge of an individual wafer. The portable module is complementary to a receiving base having an open bowl provided with liquid jets for discharging processing liquids or reagents in parallel streams directed toward the outer surface of a rotating wafer. The bowl can also be filled with liquid for immersion treatment of a wafer, which can be held stationary or rotated at slow speeds. The portable unit is moved between base units by a robotic arm. All elements associated with holding of the wafer are physically shielded to minimize wafer contamination from environmental contact.

摘要翻译： 单个晶片处理器支持具有至少一个要与流体接触的表面的半导体晶片。 该设备包括便携式模块，其包括能够围绕便携式壳体的轴线旋转的夹持器组件，并且能够机械地接合或脱离单个晶片的边缘。 便携式模块与接收基座互补，该接收基座具有设置有液体射流的开口碗，用于排出指向旋转晶片的外表面的平行流中的处理液体或试剂。 碗也可以填充用于浸没处理晶片的液体，其可以保持静止或以低速旋转。 便携式单元通过机器臂在基座单元之间移动。 与保持晶片相关联的所有元件被物理屏蔽以最小化来自环境接触的晶片污染。

公开(公告)号：US5154199A

公开(公告)日：1992-10-13

申请号：US653491

申请日：1991-02-08

申请人： Raymon F. Thompson ,  Aleksander Owczarz

发明人： Raymon F. Thompson ,  Aleksander Owczarz

IPC分类号： H01L21/304 ,  B08B3/02 ,  G03F1/08 ,  H01L21/00

CPC分类号： H01L21/67028 ,  B08B3/02 ,  Y10S134/902

摘要： Rinser dryer system for rising process chemical from silicon or gallium arsenide wafers, substrates, masks or disks and drying of silicon or gallium arsenide wafers, substrates, masks or disks positioned in a wafer cassette. A wafer cassette is positioned in a rotor assembly and the rotor assembly positioned within a removable heated chamber bowl. The wafer cassette rotates past rising and drying manifold nozzles. The removable chamber bowl is secured to a rinser mounting plate by quick disconnect hardware for removal and for external cleansing. A broken chip collector in a lower portion of an exhaust manifold assembly removes small broken chip remains. An acidity sensor is positioned in a bottom portion of the exhaust manifold assembly for monitoring rinse effluent during the rising process. A gated exhaust valve in an exhaust gas manifold of the exhaust manifold assembly provides for gases to exhaust to an external location. A computer controls cycling of the process modes as the silicon or gallium arsenide wafers, substrates, masks or disks are sprayed, washed, rinsed, and dried.