摘要:
A package allowing both electrical and optical coupling between one or more integrated circuits and a printed circuit board (PCB) has optical waveguide structures in addition to electrical connections. An optically active device may be flip-bonded directly to an integrated circuit using solder bump technology. The integrated circuit then flip-bonded or wire-bonded to a BGA package. The package has alignment rails or balls and V-grooves to anchor the alignment rails/balls to align the BGA package to the PCB. The BGA package is bonded to the PCB using solder reflow technology.
摘要:
A reduced capacitance interconnect system. A first metal layer is formed to a predetermined level above a first dielectric layer which is formed on a semiconductor substrate. The first metal layer level forms multiple interconnect lines wherein each interconnect line is separated from each adjacent interconnect line by a trench including a trench having a highest aspect ratio. A second dielectric layer is formed on the first metal layer and in the trenches between the interconnect lines such that an enclosed void having a void tip substantially level with the top of the metal layer is formed in at least each trench having an aspect ratio above a predetermined minimum aspect ratio, wherein the enclosed void in the trench having the highest aspect ratio has a void volume which is at least 15% of the volume of the trench.
摘要:
The invention in one embodiment is a semiconductor device including a logic unit capable of receiving a first clock signal having a first frequency and generating from the first clock signal a second clock signal having a second frequency higher than the first frequency.
摘要:
A memory device having test circuitry incorporated into its design to enable direct external access to the bit lines of a single cell is described. When the device is put in test mode by applying external control signals, peripheral I/O circuitry is disabled. Once the I/O circuitry is disabled the test circuitry selects and enables the section of the array in which the selected cell is located through transfer circuits. The enabled transfer circuit for the selected section couples data between the selected cell and a set of predetermined I/O terminals.
摘要:
A folded cascode configured current steering decoder circuit for coupling a column of memory cells of a static random access memory for reading by a sense amplifier. A pair of cascode configured p-channel transistors turn on to couple memory bit lines to output lines so that the sense amplifier can provide the reading of contents of the selected memory cell. A second pair of p-channel transistors are each coupled to each of the bit lines for providing a steady state current source when the first pair of transistors are turned on for transferring information from the bit line to the output line pairs. The cascode configured transistors are MOSFET switches which are biased to cause a current inbalance when data from the memory cell are placed on the bit lines. The inbalanced current passing through the cascoded transistor pairs causes a current difference which can then sensed by a low input impedence sense amplifier. The cascoded MOSFETS provide for an isolation of the bit line capacitance from the output line capacitance to reduce the amount of time required for transferring information from the bit line to the sense amplifier.
摘要:
A differential amplifier (24, 26, 10 and 12) having a feedback network (30, 34, 32, 36 and 38) for increasing common output without loss of gain. Also disclosed is a constant current source (60), and a level shifting network (48, 50, 52 and 54) for shifting the D.C. level of the output signal to a D.C. voltage substantially near that of second current source (44). An output stage (84, 86, 90, 92 and 94) provides low output impedance, low D.C. bias power consumption and high current drive capability.