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公开(公告)号：US10917978B2
公开(公告)日：2021-02-09
申请号：US16364730
申请日：2019-03-26
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Yoshiharu Hirakata , Yasuhiro Jinbo , Shunpei Yamazaki
Abstract: A light-emitting device can be folded in such a manner that a flexible light-emitting panel is supported by a plurality of housings which are provided spaced from each other and the light-emitting panel is bent so that surfaces of adjacent housings are in contact with each other. Furthermore, in the light-emitting device, in which part or the whole of the housings have magnetism, the two adjacent housings can be fixed to each other by a magnetic force when the light-emitting device is used in a folded state.
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公开(公告)号：US10583641B2
公开(公告)日：2020-03-10
申请号：US15804319
申请日：2017-11-06
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Masakatsu Ohno , Yoshiharu Hirakata , Shingo Eguchi , Yasuhiro Jinbo , Hisao Ikeda , Kohei Yokoyama , Hiroki Adachi , Satoru Idojiri
Abstract: A yield in the step of bonding two members together is improved. A bonding apparatus includes a stage capable of supporting a first member having a sheet-like shape, a fixing mechanism capable of fixing one end portion of a second member having a sheet-like shape so that the second member overlaps with the first member, and a pressurizing mechanism capable of moving from a side of the one end portion of the second member to a side of the other end portion and spreading a bonding layer under pressure between the first member and the second member. The first member and the second member are bonded to each other.
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公开(公告)号：US10514137B2
公开(公告)日：2019-12-24
申请号：US15890396
申请日：2018-02-07
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Tomoya Aoyama , Yasuhiro Jinbo , Yoshiharu Hirakata , Shunpei Yamazaki
IPC: F21L4/02 , F21V21/005 , F21L4/00 , F21V21/14 , F21S4/22 , H05B37/02 , F21V15/015 , F21W121/00 , F21Y105/00 , F21Y115/10 , F21Y115/20 , F21Y107/40
Abstract: An object of this invention is to provide a highly portable light-emitting device or a highly browsable light-emitting device. The light-emitting device includes a joint portion, and a plurality of light-emitting units apart from each other with the joint portion positioned therebetween. The joint portion and the light-emitting units are flexible. The joint portion can be bent to a curvature radius smaller than a curvature radius to which the light-emitting unit can be bent. The light-emitting unit is supplied with a signal through a side not adjacent to the joint portion or is supplied with a signal by wireless communication.
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公开(公告)号：US10367014B2
公开(公告)日：2019-07-30
申请号：US14922658
申请日：2015-10-26
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Shunpei Yamazaki , Yoshiharu Hirakata , Takashi Hamada , Kohei Yokoyama , Yasuhiro Jinbo , Tetsuji Ishitani , Daisuke Kubota
IPC: G02F1/1333 , H01L27/12 , H01L51/52 , G02F1/1368 , G02F1/1362 , G02F1/1335 , G02F1/1339 , H01L29/786 , H01L27/32 , H01L51/00
Abstract: A display device in which a peripheral circuit portion has high operation stability is provided. The display device includes a first substrate and a second substrate. A first insulating layer is provided over a first surface of the first substrate. A second insulating layer is provided over a first surface of the second substrate. The first surface of the first substrate and the first surface of the second substrate face each other. An adhesive layer is provided between the first insulating layer and the second insulating layer. A protective film in contact with the first substrate, the first insulating layer, the adhesive layer, the second insulating layer, and the second substrate is formed in the vicinity of a peripheral portion of the first substrate and the second substrate.
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公开(公告)号：US10229940B2
公开(公告)日：2019-03-12
申请号：US15782249
申请日：2017-10-12
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Yasuhiro Jinbo , Masafumi Morisue , Hajime Kimura , Shunpei Yamazaki
IPC: H01L27/12 , H01L27/15 , H01L33/62 , G02F1/1333 , G02F1/1335 , H01L21/683 , H01L33/00 , H01L51/00
Abstract: The present invention provides a manufacturing technique of a semiconductor device and a display device using a peeling process, in which a transfer process can be conducted with a good state in which a shape and property of an element before peeling are kept. Further, the present invention provides a manufacturing technique of more highly reliable semiconductor devices and display devices with high yield without complicating the apparatus and the process for manufacturing. According to the present invention, an organic compound layer including a photocatalyst substance is formed over a first substrate having a light-transmitting property, an element layer is formed over the organic compound layer including a photocatalyst substance, the organic compound layer including a photocatalyst substance is irradiated with light which has passed through the first substrate, and the element layer is peeled from the first substrate.
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Patent Agency Ranking
公开(公告)号：US10228807B2
公开(公告)日：2019-03-12
申请号：US15698901
申请日：2017-09-08
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Yasuhiro Jinbo , Kenichi Okazaki
IPC: G06F3/044 , H01L27/32 , H01L51/52 , H01L31/0203 , H01L31/02 , H01L31/042 , G06F3/01 , H01L51/00
Abstract: A functional panel is provided. The functional panel includes a first substrate, a second substrate, a bonding layer, a functional element, a protective layer, and a terminal. The bonding layer is positioned between the first and second substrates. The functional element is surrounded by the first substrate, the second substrate, and the bonding layer. The terminal is electrically connected to the functional element and provided not to overlap with one of the first and second substrates. The protective layer is provided to be in contact with side surfaces of the first and second substrates and an exposed surface of the bonding layer. A surface of the terminal is partly exposed without being covered with the protective layer. The surface of the terminal partly includes a material having a lower ionization tendency than hydrogen.
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公开(公告)号：US10170600B2
公开(公告)日：2019-01-01
申请号：US15860001
申请日：2018-01-02
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Yasuhiro Jinbo
Abstract: A manufacturing method of a semiconductor device including a step of forming a silicon layer over a formation substrate, a step of forming a resin layer over the silicon layer, a step of forming a transistor over the resin layer, a step of forming a conductive layer over the silicon layer and the resin layer, and a step of separating the formation substrate and the transistor. The resin layer has an opening over the silicon layer. The conductive layer is in contact with the silicon layer through the opening in the resin layer. In the step of separating the formation substrate and the transistor, the silicon layer is irradiated with light, so that silicon contained in the silicon layer reacts with a metal contained in the conductive layer, and a metal silicide layer is formed.
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公开(公告)号：US09925749B2
公开(公告)日：2018-03-27
申请号：US14468818
申请日：2014-08-26
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Masakatsu Ohno , Yoshiharu Hirakata , Shingo Eguchi , Yasuhiro Jinbo , Hisao Ikeda , Kohei Yokoyama , Hiroki Adachi , Satoru Idojiri
CPC classification number: B32B37/0046 , B32B17/10431 , B32B27/08 , B32B27/20 , B32B27/36 , B32B37/0015 , B32B37/003 , B32B37/1284 , B32B38/0008 , B32B38/18 , B32B38/1841 , B32B38/1858 , B32B2264/102 , B32B2264/105 , B32B2309/68 , B32B2457/14 , B32B2457/20 , H01L2224/01 , Y10T156/15 , Y10T156/1798
Abstract: A yield in the step of bonding two members together is improved. A bonding apparatus includes a stage capable of supporting a first member having a sheet-like shape, a fixing mechanism capable of fixing one end portion of a second member having a sheet-like shape so that the second member overlaps with the first member, and a pressurizing mechanism capable of moving from a side of the one end portion of the second member to a side of the other end portion and spreading a bonding layer under pressure between the first member and the second member. The first member and the second member are bonded to each other.
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公开(公告)号：US09865837B2
公开(公告)日：2018-01-09
申请号：US15046753
申请日：2016-02-18
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Shunpei Yamazaki , Yasuhiro Jinbo , Shingo Eguchi
CPC classification number: H01L51/5246 , H01L27/323 , H01L27/3244 , H01L33/56 , H01L51/0097 , H01L51/5237 , H01L51/5253 , H01L51/5256 , H01L2251/5338 , H01L2251/5361 , Y02E10/549
Abstract: A lightweight flexible light-emitting device that is less likely to be broken is provided. The light-emitting device includes a first flexible substrate, a second flexible substrate, an element layer, a first bonding layer, and a second bonding layer. The element layer includes a light-emitting element. The element layer is provided between the first flexible substrate and the second flexible substrate. The first bonding layer is provided between the first flexible substrate and the element layer. The second bonding layer is provided between the second flexible substrate and the element layer. The first and second bonding layers are in contact with each other on the outer side of an end portion of the element layer. The first and second flexible substrates are in contact with each other on the outer side of the end portions of the element layer, the first bonding layer, and the second bonding layer.
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公开(公告)号：US09766763B2
公开(公告)日：2017-09-19
申请号：US14978357
申请日：2015-12-22
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Yasuhiro Jinbo , Kenichi Okazaki
IPC: H01L33/00 , G06F3/044 , H01L27/32 , H01L51/52 , H01L31/0203 , H01L31/02 , H01L31/042 , G06F3/01 , H01L51/00
CPC classification number: G06F3/044 , G06F3/012 , G06F3/013 , G06F2203/04112 , H01L27/323 , H01L27/3251 , H01L27/3276 , H01L31/02005 , H01L31/0203 , H01L31/042 , H01L51/0096 , H01L51/5203 , H01L51/524 , H01L51/5253 , H01L2251/301 , H01L2251/303 , H01L2251/5338 , H01L2924/0002 , Y02E10/549 , H01L2924/00
Abstract: A functional panel is provided. The functional panel includes a first substrate, a second substrate, a bonding layer, a functional element, a protective layer, and a terminal. The bonding layer is positioned between the first and second substrates. The functional element is surrounded by the first substrate, the second substrate, and the bonding layer. The terminal is electrically connected to the functional element and provided not to overlap with one of the first and second substrates. The protective layer is provided to be in contact with side surfaces of the first and second substrates and an exposed surface of the bonding layer. A surface of the terminal is partly exposed without being covered with the protective layer. The surface of the terminal partly includes a material having a lower ionization tendency than hydrogen.
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