Abstract:
A method of processing memory, suitable for loading an executable object code compiled from a source code into the memory that includes defective memory cells. At first, set up a plurality of pre-compiled object codes that correspond to a source code, each pre-compiled object code having at least a skipped-code-address range. Then, test the memory and locate the defective addresses therein. According to the result of the test, the code-loading system selects an executable object that has the matching skipped-code-address range from the pre-compiled object codes, and loads the executable code into the memory. Since the skipped-code-address range covers the defective addresses in the memory, the defective memory cells in the memory won't affect the operation of loading a program.
Abstract:
A method of processing a partially defective memory for loading a machine code program into a memory device that includes at least one defective memory cell. At first the machine code program is scanned. In addition, a movable code block between two break points, which is ready to be loaded to the defective memory cell of the memory device, is determined. Then the block code is moved to a memory space between a first address and a second address in which there is no defective memory cell. Finally, the moved code block should be linked in the execution sequence with the unmoved portion of the machine code program and the addressing references correlated between the moved code block and the unmoved portion of the machine code program should be modified is and corrected. The resulting machine code program can be properly loaded and executable.
Abstract:
A driver circuit for use in driving displays has an input receiving a digital input data having n bits for selecting one of a plurality of voltage levels for driving the circuit. The circuit also has an output, a plurality of digital signal lines coupled to the digital input data, and a plurality of active regions coupled to a first side of the output. Each of the plurality of active regions is coupled to a separate voltage level. The circuit further includes a plurality of pass transistors at a first subset of locations where the plurality of digital signal lines overlap the plurality of active regions, and a plurality of depletion-implanted transistors at a second subset of locations where the plurality of digital signal lines overlap the plurality of active regions. The number of the plurality of digital signal lines on one side of the output can be odd number, such as 2n−1, or can be 2n−2. A plurality of blocking transistors can positioned between the input and selected digital signal lines, with at least one of the digital signal lines being coupled to a gate of each of the blocking transistors for controlling each of the blocking transistors. A level-shifter can also be positioned between selected active regions for one or more digital signal line.
Abstract:
An integrated semiconductor device includes a substrate having a buried shallow trench isolation structure and an epitaxial layer disposed over the substrate and the buried shallow trench isolation structure. The epitaxial layer includes a shallow trench isolation structure that extends over the buried shallow trench isolation structure in the substrate to substantially reduce leakage current in the substrate to prevent device latch-up.
Abstract:
A computer system is provided that loads a computer program, in a reverse order, into a memory device having one or more defective memory cells. The program is organized into code modules with each code module including at least one complete instruction, or data block. The last code module of the program is loaded first into the last or highest addresses of the address space allocated in the memory for the program. Thereafter, the code module preceding the last loaded code module of the program is loaded into the addresses preceding the previously-loaded addresses. The subsequent code modules are loaded into successively lower memory addresses in a reverse fashion until the first code module of the program is loaded into memory. As each code module, or the codes that make up the code module, are loaded, each loaded memory address is checked for a defective cell. A JUMP instruction is created and inserted into the original program code preceding the defective memory address to bypass any defective memory cell without interrupting the intended operation of the instruction steps that are loaded into the memory. In addition, a JUMP instruction is inserted into the memory start address so that a processor is forced to begin execution at the memory address containing the first byte of the first code module. Certain byte codes that include referenced addresses are then modified to correct any address-referencing that may be changed due to the insertion of the JUMP instructions, and then loaded into the appropriate addresses in the memory.
Abstract:
A transient negative voltage pump circuit pumps the ESD voltage to a negative voltage. The negative voltage with the ESD voltage are used for early triggering of an SCR structure on the integrated circuit. In one version of the present invention, a pn junction diode of the SCR device is used as part of the negative voltage pump circuit. This saves the layout area while improving the ESD performance. The present invention improves the ESD performance of an SCR ESD protection circuit which is used for protecting the power bus or an IC pin during an ESD event.
Abstract:
For low-voltage and high-speed operation of a MOSFET in an integrated circuit, a small voltage is applied to a source node, causing slight forward bias of the source junction and thereby reducing its threshold voltage. Due to the combined effects of the bias at the source node and a body effect, the reduction in threshold voltage is larger than the absolute value of the source voltage being applied. A performance improvement over simply applying a bias voltage to the body (well) results. Detection of an event can be used to apply the performance boost to a critical path in the integrated circuit only when needed. Upon detection of a logic event, which determines that a signal will propagate through the critical path shortly thereafter, the source-node bias for circuit elements in the critical path can be adjusted in time for a speed improvement. However, the source remains at another potential when no signal is passing through the critical-path, to save power when not boosting speed.
Abstract:
An ESD protective device for protection of an integrated circuit (IC) package from electrostatic discharge damage. The ESD protective device protects the internal circuit of the IC connected to wired pins of the IC package against ESD damage due to ESD stress in neighboring no-connect pins. The ESD protective device includes an ESD protective unit coupled to the power bus and a bonding pad coupled between this ESD protective device and the no-connect pin. The ESD protective unit causes ESD stress applied to the no-connect pin to be diverted to the power bus, thus preventing ESD transfer between a no-connect pin and an active pin, which could damage the internal circuit.
Abstract:
A transient voltage-pump circuit pumps the ESD voltage to a higher voltage. The pumped-high transient voltage is used for early triggering of an SCR. In one version of the present invention, a pn junction of the SCR device is used as part of the voltage-pump circuit. This saves the layout area while improving the ESD performance. The present invention improves the ESD performance of an SCR ESD protection circuit which is used for protecting the power bus or an IC pin during an ESD event.
Abstract:
A pin-assignment method is provided for use on an IC package to arrange pin connections. The pin-assignment method can allow an improvement in the electro-static discharge (ESD) protection capability for the IC chip packed in the IC package. Specifically, the pin-assignment method organizes the no-connect pins of the IC package into groups and then assigns each of the two pins that bound each no-connect pin group to be connected to a power bus of the IC chip. This allows for an increased ESD protective capability for the no-connect pins. Moreover, the pin-assignment method can simplify the wiring complexity of the IC package.