公开(公告)号：US20090294942A1

公开(公告)日：2009-12-03

申请号：US12132085

申请日：2008-06-03

申请人： Eric C. Palmer ,  John S. Guzek

发明人： Eric C. Palmer ,  John S. Guzek

IPC分类号： H01L23/28

CPC分类号： H01L23/3157 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18162 ,  H01L2924/00

摘要： In some embodiments, package on package using a bump-less build up layer (BBUL) package is presented. In this regard, an apparatus is introduced comprising a microelectronic die having an active surface, an inactive surface parallel to said active surface, and at least one side, an encapsulation material adjacent said at least one microelectronic die side, wherein said encapsulation material includes a bottom surface substantially planar to said microelectronic die active surface and a top surface substantially planar to said microelectronic die inactive surface, a through via connection in said encapsulation material extending from said top surface to said bottom surface, a first dielectric material layer disposed on at least a portion of said microelectronic die active surface and said encapsulation material surface, a plurality of build-up layers disposed on said first dielectric material layer, and a plurality of conductive traces disposed on said first dielectric material layer and said build-up layers and in electrical contact with said microelectronic die active surface. Other embodiments are also disclosed and claimed.

摘要翻译： 在一些实施例中，提供了使用无凸起建立层（BBUL）封装的封装封装。 在这方面，引入一种装置，其包括具有活性表面的微电子管芯，与所述有源表面平行的非活性表面，以及至少一个侧面，与所述至少一个微电子管芯侧相邻的封装材料，其中所述封装材料包括 底表面与所述微电子管芯有效表面基本上平面，并且与所述微电子管芯非活性表面基本平面的顶表面，从所述顶表面延伸到所述底表面的所述封装材料中的通孔连接，至少设置在第一介电材料层 所述微电子管芯有源表面和所述封装材料表面的一部分，设置在所述第一介电材料层上的多个堆积层以及设置在所述第一介电材料层和所述堆积层上的多个导电迹线 与所述微电子管芯有源表面电接触。 还公开并要求保护其他实施例。

公开(公告)号：US20090072382A1

公开(公告)日：2009-03-19

申请号：US11857418

申请日：2007-09-18

申请人： John S. Guzek

发明人： John S. Guzek

IPC分类号： H01L23/36 ,  H01L21/56

CPC分类号： H01L23/4334 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/42 ,  H01L24/24 ,  H01L24/82 ,  H01L24/92 ,  H01L24/97 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/16 ,  H01L2224/73267 ,  H01L2224/82005 ,  H01L2224/8385 ,  H01L2224/9222 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/16195 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2224/82 ,  H01L2224/83 ,  H01L2924/00

摘要： A microelectronic package includes a carrier (110, 210, 410, 1110) having a first surface (111, 211, 411, 1111) and an opposing second surface (112, 212, 412, 1112), an adhesive layer (120, 220, 221, 520, 1220, 1221) at the first surface of the carrier, a die (130, 230, 231, 530, 531, 1230, 1231) attached to the first surface of the carrier by the adhesive layer, an encapsulation material (140, 240, 640, 1340) at the first surface of the carrier and at least partially surrounding the die and the adhesive layer, and a build-up layer (150, 250, 750, 1450) adjacent to the encapsulation material, wherein the die and the build-up layer are in direct physical contact with each other. In one embodiment the carrier is a heat spreader having a first surface and a second surface the second surface being a top surface of the microelectronic package.

摘要翻译： 微电子封装包括具有第一表面（111,211,411,1111）和相对的第二表面（112,212,412,1112）的载体（110,210,410,1110），粘合层（120,220） ，221,520,1220,1221），通过所述粘合剂层附接到所述载体的第一表面的模具（130,230,231,530,531,1230,1231），封装材料 （140,240,640,1340）在载体的第一表面处并且至少部分地围绕模具和粘合剂层，以及邻近封装材料的堆积层（150,250,750,1450），其中 管芯和堆积层彼此直接物理接触。 在一个实施例中，载体是具有第一表面和第二表面的散热器，第二表面是微电子封装的顶表面。