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公开(公告)号：US09112253B2
公开(公告)日：2015-08-18
申请号：US13854956
申请日：2013-04-01
Applicant: Texas Instruments Incorporated
Inventor： Robert Floyd Payne , Juan Alejandro Herbsommer , Gerd Schuppener
IPC: H01P11/00 , H01P3/16 , H01P5/08 , G02B6/44 , H01P5/00 , H01Q1/50 , H01Q19/10 , H04B1/40 , H01Q19/30 , H01P3/12 , H01P5/107
CPC classification number: H01P3/16 , G02B6/4416 , H01L2223/6677 , H01L2224/16227 , H01L2224/73204 , H01L2924/15192 , H01L2924/15311 , H01P3/121 , H01P3/165 , H01P5/00 , H01P5/087 , H01P5/107 , H01P5/184 , H01P11/001 , H01P11/002 , H01Q1/50 , H01Q19/108 , H01Q19/30 , H04B1/40 , Y10T29/49016 , Y10T29/49826
Abstract: A communication cable includes one or more conductive elements surrounded by a dielectric sheath. The sheath member has a first dielectric constant value. A dielectric core member is placed longitudinally adjacent to and in contact with an outer surface of the sheath member. The core member has a second dielectric constant value that is higher than the first dielectric constant value. A cladding surrounds the sheath member and the dielectric core member. The cladding has a third dielectric constant value that is lower than the second dielectric constant value. A dielectric wave guide is formed by the dielectric core member surrounded by the sheath and the cladding.
Abstract translation: 通信电缆包括由电介质护套包围的一个或多个导电元件。 护套构件具有第一介电常数值。 电介质芯构件被纵向地邻近鞘构件的外表面并与其接触。 芯构件具有比第一介电常数值高的第二介电常数值。 包层围绕护套构件和电介质芯构件。 包层具有低于第二介电常数值的第三介电常数值。 电介质波导由被护套和包层包围的介质芯构件形成。
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公开(公告)号：US20140287703A1
公开(公告)日：2014-09-25
申请号：US13854958
申请日：2013-04-02
Applicant: Texas Instruments Incorporated
Inventor： Juan Alejandro Herbsommer , Gerd Schuppener , Robert Floyd Payne
CPC classification number: H01P3/16 , G02B6/4416 , H01L2223/6677 , H01L2224/16227 , H01L2224/73204 , H01L2924/15192 , H01L2924/15311 , H01P3/121 , H01P3/165 , H01P5/00 , H01P5/087 , H01P5/107 , H01P5/184 , H01P11/001 , H01P11/002 , H01Q1/50 , H01Q19/108 , H01Q19/30 , H04B1/40 , Y10T29/49016 , Y10T29/49826
Abstract: A system includes an integrated circuit that has a substrate with a top surface and a bottom surface. Semiconductor circuitry is including a radio frequency (RF) amplifier configured to produce an RF signal or an RF receiver configured to receive an RF signal is formed on the top surface of the substrate. A through-substrate via is coupled to an output of the RF amplifier. A metalized antenna formed on the bottom surface of the substrate is coupled to the through-substrate via. The metalized antenna is configured to launch an electromagnet wave representative of the RF signal into a dielectric waveguide (DWG) when the DWG is coupled to the bottom side of the substrate.
Abstract translation: 一种系统包括具有顶表面和底表面的基底的集成电路。 半导体电路包括被配置为产生RF信号的射频（RF）放大器或被配置为接收RF信号的RF接收器，该RF接收器被形成在衬底的顶表面上。 穿通基板通孔耦合到RF放大器的输出端。 形成在基板的底表面上的金属化天线与穿通基板通孔相连。 当DWG耦合到衬底的底侧时，金属化天线被配置为将代表RF信号的电磁波发射到电介质波导（DWG）中。
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公开(公告)号：US20140285292A1
公开(公告)日：2014-09-25
申请号：US13854951
申请日：2013-04-01
Applicant: Texas Instruments Incorporated
Inventor： Juan Alejandro Herbsommer , Gerd Schuppener , Robert Floyd Payne
CPC classification number: H01P3/16 , G02B6/4416 , H01L2223/6677 , H01L2224/16227 , H01L2224/73204 , H01L2924/15192 , H01L2924/15311 , H01P3/121 , H01P3/165 , H01P5/00 , H01P5/087 , H01P5/107 , H01P5/184 , H01P11/001 , H01P11/002 , H01Q1/50 , H01Q19/108 , H01Q19/30 , H04B1/40 , Y10T29/49016 , Y10T29/49826
Abstract: A dielectric wave guide (DWG) has a longitudinal dielectric core member. The core member has a first dielectric constant value. A cladding surrounds the dielectric core member and has a second dielectric constant value that is lower than the first dielectric constant. A portion of the DWG is configured as a corner having a radius. A conductive layer formed on an outer radius of the corner.
Abstract translation: 电介质波导（DWG）具有纵向介质芯构件。 芯构件具有第一介电常数值。 包层围绕介质芯构件并具有低于第一介电常数的第二介电常数值。 DWG的一部分被配置为具有半径的角。 形成在拐角的外半径上的导电层。
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公开(公告)号：US20140240062A1
公开(公告)日：2014-08-28
申请号：US13854948
申请日：2013-04-01
Applicant: Texas Instruments Incorporated
Inventor： Juan Alejandro Herbsommer , Gerd Schuppener , Robert Floyd Payne
IPC: H01P3/16
CPC classification number: H01P3/16 , H01L2223/6677 , H01L2224/16227 , H01L2924/15311 , H01P1/04 , H01P3/121 , H01Q13/00 , H05K1/0239 , H05K1/024 , H05K2201/0187 , H05K2201/0195 , H05K2201/09618 , H05K2201/10098 , Y10T29/49826 , Y10T29/49908
Abstract: A dielectric wave guide (DWG) has a dielectric core member that has a first dielectric constant value. A cladding surrounding the dielectric core member has a second dielectric constant value that is lower than the first dielectric constant. A mating end of the DWG is configured for mating with a second DWG having a matching non-planar shaped mating end. A deformable material is disposed on the surface of the mating end of the DWG, such that when mated to a second DWG, the deformable material fills a gap region between the mating ends of the DWG and the second DWG
Abstract translation: 电介质波导（DWG）具有第一介电常数值的介质芯构件。 围绕介电芯构件的包层具有低于第一介电常数的第二介电常数值。 DWG的配合端配置成与具有匹配的非平面形状配合端的第二DWG配合。 可变形材料设置在DWG的配合端的表面上，使得当与第二DWG配合时，可变形材料填充DWG的配合端和第二DWG之间的间隙区域
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