Substrate processing method
    63.
    发明授权
    Substrate processing method 有权
    基板加工方法

    公开(公告)号:US08449785B2

    公开(公告)日:2013-05-28

    申请号:US12717545

    申请日:2010-03-04

    申请人: Takashi Kondo

    发明人: Takashi Kondo

    IPC分类号: C23F1/00

    摘要: A substrate processing method is provided to process a substrate having a structure in which a lower photoresist layer, a hard mask layer containing silicon, and an upper photoresist layer are sequentially formed on a target layer to be processed. The substrate processing method includes reducing by using a plasma a width of a first opening formed in the upper photoresist layer, so that the hard mask layer is exposed; reducing by using a plasma a width of a second opening formed in the hard mask layer through the first opening having the reduced width so that the lower photoresist layer is exposed; forming a third opening through the second opening having the reduced width so that the target layer is exposed; and a third width reducing step of reducing a width of the third opening by using a plasma.

    摘要翻译: 提供了一种基板处理方法,用于处理具有其中下部光致抗蚀剂层,含有硅的硬掩模层和上部光致抗蚀剂层的结构的基板在待处理的目标层上顺序地形成。 基板处理方法包括通过使用等离子体来减少形成在上光致抗蚀剂层中的第一开口的宽度,使得硬掩模层暴露; 通过使用形成在硬掩模层中的第二开口的宽度通过具有减小的宽度的第一开口使等离子体减少,使得下光致抗蚀剂层暴露; 通过具有减小的宽度的第二开口形成第三开口,使得目标层被暴露; 以及通过使用等离子体来减小第三开口的宽度的第三宽度减小步骤。

    Surface emitting semiconductor laser
    64.
    发明授权
    Surface emitting semiconductor laser 有权
    表面发射半导体激光器

    公开(公告)号:US08422531B2

    公开(公告)日:2013-04-16

    申请号:US12832590

    申请日:2010-07-08

    申请人: Takashi Kondo

    发明人: Takashi Kondo

    IPC分类号: H01S3/08 H01S5/00

    摘要: A surface emitting semiconductor laser includes a substrate, an n-type lower DBR, an n-type cavity extending region formed on the lower DBR, an active region formed on the cavity extending region, and an upper DBR formed on the active region. A difference in refractive index between a relatively high refractive index layer and a relatively low refractive in the upper DBR is smaller than that in the lower DBR.

    摘要翻译: 表面发射半导体激光器包括衬底,n型下DBR,形成在下DBR上的n型腔延伸区域,形成在腔延伸区域上的有源区和形成在有源区上的上DBR。 上部DBR中相对较高的折射率层和相对较低的折射率之间的折射率差小于下部DBR中的折射率差。

    Medical image interpreting apparatus and cursor-moving method
    65.
    发明授权
    Medical image interpreting apparatus and cursor-moving method 有权
    医学图像解释装置和光标移动方法

    公开(公告)号:US08330717B2

    公开(公告)日:2012-12-11

    申请号:US12889236

    申请日:2010-09-23

    IPC分类号: G06F3/033

    摘要: In the medical image interpreting apparatus having a pointing device for moving a cursor, medical image, interpretation report, and cursor are displayed on a display screen, and initial movement information and information on the destination of movement of the cursor are linked and stored, via the pointing device when the cursor begins to move, said initial movement information relevant to the initial movement is retrieved to obtain the linked information on the destination of movement and the cursor is moved to the destination of movement indicated in the obtained information on the destination of movement. Due to this, just by slightly moving the cursor, the cursor jumps to the desired destination of movement, therefore, it becomes possible to omit an operation of the pointing device in between. Due to this, the operation load of the pointing device is reduced, thus preventing an operator's thought in creating an interpretation report from being destructed, and the enhancement in interpreting efficiency and the reduction of interpretation mistakes are achieved.

    摘要翻译: 在具有用于移动光标的指示装置的医疗图像解释装置中,医疗图像,解释报告和光标显示在显示屏幕上,并且经由以下方式链接并存储关于光标的移动目的地的初始移动信息和信息,经由 指示装置当光标开始移动时,检索与初始移动相关的所述初始移动信息,以获得关于移动目的地的链接信息,并且将光标移动到获得的关于目的地的信息中指示的移动目的地 运动。 由于这个原因,只要轻轻移动光标,光标跳到所需的移动目的地,因此可以省略指示装置之间的操作。 由此,指示装置的操作负荷减少,从而防止操作者创造解释报告的思想被破坏,并且提高了解释效率和减少解释错误。

    Composition for thermosetting silicone resin
    66.
    发明授权
    Composition for thermosetting silicone resin 失效
    热固性硅树脂组合物

    公开(公告)号:US08318854B2

    公开(公告)日:2012-11-27

    申请号:US13151366

    申请日:2011-06-02

    IPC分类号: C08L83/04 B32B9/04

    摘要: The present invention relates to a composition for a thermosetting silicone resin, including: (1) an organopolysiloxane having a silanol group at an end thereof; (2) an alkenyl group-containing silicon compound; (3) an epoxy group-containing silicon compound; (4) an organohydrogensiloxane; (5) a condensation catalyst; (6) a hydrosilylation catalyst; and (7) a silica particle, in which the (7) silica particle has a 50% volume cumulative diameter of from 2 to 50 μm, a content of particles having a particle size of 1 μm or less of 15% by number or less and a content of particles having a particle size of 60 μm or more of 15% by number or less.

    摘要翻译: 本发明涉及一种热固性硅树脂组合物,包括:(1)一端具有硅烷醇基的有机聚硅氧烷; (2)含烯基的硅化合物; (3)含环氧基的硅化合物; (4)有机氢硅氧烷; (5)缩合催化剂; (6)氢化硅烷化催化剂; 和(7)二氧化硅粒子,其中,(7)二氧化硅粒子的体积累积直径为50〜50μm,粒径为1μm以下的粒子的含量为15个数量%以下 粒径为60μm以上的粒子的含量为15数量%以下。

    Packaging apparatus
    67.
    发明授权
    Packaging apparatus 有权
    包装设备

    公开(公告)号:US08307618B2

    公开(公告)日:2012-11-13

    申请号:US12694822

    申请日:2010-01-27

    IPC分类号: B65B35/44

    CPC分类号: B65B35/405 B65B35/44

    摘要: A packaging apparatus includes a conveyance unit having first and second position control plates. The first position control plate is arranged to selectively move forward or backward so as to obstruct or pass the group of packaged objects conveyed on the conveyance unit. When positions of the packaged objects are adjusted, the second position control plate is arranged to move from a downstream-side portion of the conveyance unit toward the first position control plate, rotate in a direction toward the first position control plate. or move from the downstream-side portion of the conveyance unit toward the first position control plate and simultaneously rotate in the direction toward the first position control plate. A subsequent process step delivery unit is arranged to deliver the group of packaged objects after the positions thereof are adjusted by the first and second position control plates, to a subsequent process device.

    摘要翻译: 包装设备包括具有第一和第二位置控制板的输送单元。 第一位置控制板被布置成选择性地向前或向后移动,以阻止或通过在输送单元上传送的一组包装物体。 当调整包装物的位置时,第二位置控制板被布置成从输送单元的下游侧朝向第一位置控制板移动,朝向第一位置控制板的方向旋转。 或者从输送单元的下游侧向第一位置控制板移动,同时沿朝向第一位置控制板的方向旋转。 随后的处理步骤递送单元被布置成在其位置被第一和第二位置控制板调整到随后的处理装置之后将包装对象组递送。

    Method for measuring characteristic of object to be measured, structure causing diffraction phenomenon, and measuring device
    69.
    发明授权
    Method for measuring characteristic of object to be measured, structure causing diffraction phenomenon, and measuring device 有权
    用于测量待测物体的特性的方法,引起衍射现象的结构和测量装置

    公开(公告)号:US08269967B2

    公开(公告)日:2012-09-18

    申请号:US13239830

    申请日:2011-09-22

    IPC分类号: G01J3/28

    CPC分类号: G01N21/4788 G01N33/54373

    摘要: A method of attaching an object to be measured to a structure causing a diffraction phenomenon; irradiating the structure to which the object to be measured is attached and which causes the diffraction phenomenon with an electromagnetic wave; detecting the electromagnetic wave scattered by the structure causing the diffraction phenomenon; and measuring a characteristic of the object to be measured from the frequency characteristic of the detected electromagnetic wave. The object to be measured is attached directly to the surface of the structure causing the diffraction phenomenon. Thus, the method for measuring the characteristic of an object to be measured exhibits an improved measurement sensitivity and high reproducibility. A structure causing a diffraction phenomenon and used for the method, and a measuring device are provided.

    摘要翻译: 将测量对象附着到引起衍射现象的结构的方法; 照射被测定对象物的结构,并用电磁波引起衍射现象; 检测由结构散射的电磁波引起的衍射现象; 并根据检测到的电磁波的频率特性来测量待测物体的特性。 要测量的物体直接附着在结构的表面,引起衍射现象。 因此,用于测量待测物体的特性的方法具有改进的测量灵敏度和高再现性。 提供引起衍射现象并用于该方法的结构和测量装置。

    OPTICAL SEMICONDUCTOR DEVICE
    70.
    发明申请
    OPTICAL SEMICONDUCTOR DEVICE 失效
    光学半导体器件

    公开(公告)号:US20120153345A1

    公开(公告)日:2012-06-21

    申请号:US13325850

    申请日:2011-12-14

    IPC分类号: H01L33/56 H01L33/52

    摘要: The present invention relates to an optical semiconductor device including: a substrate having mounted thereon an LED chip; an encapsulation resin layer embedding the LED chip; an inorganic high-heat conductive layer; and a wavelength conversion layer containing an inorganic phosphor powder, in which the encapsulation resin layer, the inorganic high-heat conductive layer and the wavelength conversion layer are laminated in this order on the substrate either directly or indirectly.

    摘要翻译: 本发明涉及一种光学半导体器件,包括:其上安装有LED芯片的衬底; 嵌入LED芯片的封装树脂层; 无机高导热层; 以及包含无机荧光体粉末的波长转换层,其中密封树脂层,无机高热传导层和波长转换层按顺序直接或间接地层压在基板上。