摘要:
An optical module controls its output characteristics electrically and an optical switch constitutes the optical module. An optical waveguide circuit (PLC) and an electronic circuit (IC) for driving the PLC are mounted on the same substrate. The IC is composed of a bare chip to be molded afterward. Wiring of the IC is grouped and integrated on the PLC substrate to achieve higher density and miniaturization of the optical module.
摘要:
An optical disc cartridge is provided, which can accommodate an optical disc having a substrate and a light-transmitting layer thinner than the substrate and can suppress warpage of the optical disc within a predetermined limit value. The optical disc cartridge 32 is provided with an opening 20 on one side in a thickness direction and an opening 34 on the other side. An area of each opening is set to be ¼ or more of an area of the optical disc 16. Moreover, a ratio of the area of the opening 20 to the area of the opening 34 is set to be larger than ¼ and smaller than 4.
摘要:
A semiconductor chip includes a base substrate, a bulk device region having a bulk growth layer on a part of the base substrate, an SOI device region having a buried insulator on the base substrate and a silicon layer on the buried insulator, and a boundary layer located at the boundary between the bulk device region and the SOI device region. The bulk device region has a first device-fabrication surface in which a bulk device is positioned on the bulk growth layer. The SOI device region has a second device-fabrication surface in which an SOI device is positioned on the silicon layer. The first and second device-fabrication surfaces are positioned at a substantially uniform level.
摘要:
An optical recording medium includes a substrate, a protective layer, three or more information recording layers formed between the substrate and the protective layer and transparent intermediate layers each formed between neighboring information recording layers and capable of recording data in the three or more information recording layers and reproducing data recorded in the three or more information recording layers by projecting a laser beam onto the three or more information recording layers via a light incidence plane constituted by the surface of either the substrate or the protective layer, wherein neighboring transparent intermediate layers facing each other across an information recording layer have different thicknesses. According to the thus constituted optical recording medium, it is possible to reduce interlayer cross-talk.
摘要:
A method of manufacturing a semiconductor device substrate includes forming a mask layer pattern on a semiconductor layer insulated from a surface of a semiconductor substrate by an electrically insulating layer, etching the semiconductor layer according to the pattern of the mask layer to form a trench leading to the insulating layer, etching a protective layer on the semiconductor substrate having a thickness less than the thickness of the insulating layer to form a sidewall protective film which covers a side surface of the trench, etching the insulating layer from a bottom surface of the trench to the semiconductor substrate; and growing a single-crystalline layer from the surface of the semiconductor substrate exposed as a result of etching the insulating layer.
摘要:
An optical recording medium includes a recording layer provided on a substrate. The recording layer includes first and second information layers and a spacer layer therebetween. The optical recording medium also includes a warpage adjusting layer provided on the side of the substrate opposite to the recording layer to reduce the warpage of the spacer layer caused by curing. A moisture proof layer is formed on the surface of the warpage adjusting layer opposite to the recording layer to reduce the warpage of the warpage adjusting layer caused by moisture absorption and releasing by the warpage adjusting layer.
摘要:
A semiconductor device according to an aspect of the present invention comprises a first semiconductor layer and a plurality of second semiconductor layers. The first semiconductor layer is formed in a first region of a semiconductor substrate with one of an insulating film and a cavity interposed between the semiconductor substrate and the first semiconductor layer. The plurality of second semiconductor layers is formed in second regions of the semiconductor substrate.
摘要:
An ROM type optical recording medium including a substrate 2, a reflecting layer 3 formed on one of the surfaces of the substrate 2, a first resin layer 4 formed on the reflecting layer 3, a first hard coat layer 5 formed on the first resin layer 4, a moisture-proof layer 6 formed on the other surface of the substrate 2, a second resin layer 7 formed on the moisture-proof layer 6, and a second hard coat layer 8 formed on the second resin layer 7, wherein the moisture-proof layer 6 contains, as a principal component, the same element as that contained as a principal component in the reflecting layer 3.
摘要:
An optical recording medium includes a support substrate, a first resin layer and a second resin layer formed on opposite surface sides of the support substrate, an information recording layer formed between the first resin layer and the support substrate and containing a recording film, and a moisture-proof layer formed between the second resin layer and the support substrate and the moisture-proof layer contains at least one element among elements contained in the recording film. According to the present invention, since the first resin layer is formed on the moisture-proof layer containing at least one element among elements contained in the recording film, on the information recording layer and the second resin layer is formed on the moisture-proof layer, it is possible to form the first resin layer and the second resin layer having substantially the same physical properties on the opposite sides of the support substrate and it is therefore possible to suppress the warpage of the optical recording medium due to heat and moisture to the minimum.
摘要:
A front and back glass substrates are placed on either side of a discharge spaces. A plurality of sustain electrode pairs extend in a row direction and are regularly arranged in a column direction on the front glass substrate. A dielectric layer covering the sustain electrode pairs is formed on the front glass substrate. A plurality of address electrodes initiating a discharge in conjunction with the sustain electrodes in each discharge cell formed in the discharge space extend in the column direction and are regularly arranged in the row direction. A first metallic partition wall unit defining the discharge cells is formed on the front glass substrate. A second metallic partition wall unit defining the discharge cells adjoined to the first partition wall unit is formed on the back glass substrate.