Single NMOS device memory cell and array
    63.
    发明授权
    Single NMOS device memory cell and array 有权
    单个NMOS器件存储单元和阵列

    公开(公告)号:US07221608B1

    公开(公告)日:2007-05-22

    申请号:US10957986

    申请日:2004-10-04

    IPC分类号: G11C7/00

    摘要: The snapback characteristics of the parasitic NPN structure inside an NMOS device are used to write and store information in the device by periodically triggering the device from the high impedance state to the low impedance state using the self turn-on characteristics of the device under elevated voltage. To minimize power consumption, and thus overheating, in the “on” state, a pulsed mode operation is combined with dV/dt triggering powering the device at a constant Vdd pulse amplitude.

    摘要翻译: NMOS器件内的寄生NPN结构的快速恢复特性用于通过在高电压下使器件的自启动特性周期性地将器件从高阻抗状态触发到低阻抗状态来将信息写入和存储在器件中 。 为了最小化功率消耗并因此过热,在“导通”状态下,将脉冲模式操作与dV / dt触发相结合,以恒定的Vdd脉冲幅度向器件供电。

    Substrate independent multiple input bi-directional ESD protection structure
    66.
    发明授权
    Substrate independent multiple input bi-directional ESD protection structure 有权
    基板独立多输入双向ESD保护结构

    公开(公告)号:US07145187B1

    公开(公告)日:2006-12-05

    申请号:US10735500

    申请日:2003-12-12

    CPC分类号: H01L29/747 H01L27/0262

    摘要: In a multiple input ESD protection structure, the inputs are isolated from the substrate by highly doped regions of opposite polarity to the input regions. Dual polarity is achieved by providing a symmetrical structure with n+ and p+ regions forming each dual polarity input. The inputs are formed in a p-well which, in turn, is formed in a n-well. Each dual polarity input is isolated by a PBL under the p-well, and a NISO underneath the n-well. An isolation ring separates and surrounds the inputs. The isolation ring comprises a p+ ring or a p+ region, n+ region, and p+ region formed into adjacent rings.

    摘要翻译: 在多输入ESD保护结构中,输入通过与输入区域相反极性的高度掺杂区域与衬底隔离。 通过提供形成每个双极性输入的n +和p +区域的对称结构来实现双极性。 输入形成在p阱中,其又形成在n阱中。 每个双极性输入由p-p下的PBL隔离,并在n阱下面隔开一个NISO。 隔离环分隔并围绕输入。 隔离环包括形成相邻环的p +环或p +区,n +区和p +区。

    Silicon controlled rectifier structures with reduced turn on times
    67.
    发明授权
    Silicon controlled rectifier structures with reduced turn on times 有权
    可控硅整流器结构,减少了开启次数

    公开(公告)号:US07126168B1

    公开(公告)日:2006-10-24

    申请号:US10821287

    申请日:2004-04-09

    IPC分类号: H01L29/49

    CPC分类号: H01L27/0262 H01L29/87

    摘要: The turn on time of an electrostatic discharge (ESD) structure, such as a silicon controlled rectifier (SCR), a low-voltage triggering SCR (LVTSCR), and a bipolar SCR (BSCR), is reduced by turning on the structure in two steps: a first step that locally turns on the pnp and npn transistors, and a second step that, over time, fully turns on the structure.

    摘要翻译: 静电放电(ESD)结构的导通时间,例如可控硅整流器(SCR),低电压触发SCR(LVTSCR)和双极SCR(BSCR))通过打开两个结构 步骤:第一步,在本地打开pnp和npn晶体管,第二步,随着时间的推移,完全打开结构。

    Electrostatic discharge (ESD) protection structure
    69.
    发明授权
    Electrostatic discharge (ESD) protection structure 有权
    静电放电(ESD)保护结构

    公开(公告)号:US07067852B1

    公开(公告)日:2006-06-27

    申请号:US09660386

    申请日:2000-09-12

    IPC分类号: H01L29/74 H01L23/62

    摘要: An ESD protection structure includes a semiconductor substrate of a first conductivity type, and first and second well regions of a second conductivity type disposed in the substrate. The first and second well regions are separated by a gap region of the substrate. Also included are first and second floating regions (of the second conductivity type) disposed in the first and second well regions adjacent to the gap region, respectively. The ESD protection structure also includes first and second contact regions of the first conductivity type disposed on the first and second well regions, respectively, and spaced apart from the first and second floating regions, respectively. The ESD protection structure also includes first and second contact regions of the second conductivity type disposed on the first and second well regions, respectively, and spaced apart from the first and second floating regions, respectively.

    摘要翻译: ESD保护结构包括第一导电类型的半导体衬底和设置在衬底中的第二导电类型的第一和第二阱区。 第一和第二阱区域被衬底的间隙区域分开。 还包括设置在与间隙区域相邻的第一和第二阱区域中的第一和第二浮动区域(第二导电类型)。 ESD保护结构还包括分别设置在第一和第二阱区上并分别与第一和第二浮动区分开的第一导电类型的第一和第二接触区域。 ESD保护结构还包括分别设置在第一和第二阱区上并分别与第一和第二浮动区隔开的第二导电类型的第一和第二接触区域。