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公开(公告)号：US6033520A
公开(公告)日：2000-03-07
申请号：US728070
申请日：1996-10-09
申请人： Norio Kimura , Hozumi Yasuda
发明人： Norio Kimura , Hozumi Yasuda
IPC分类号： B24B37/005 , B24B37/04 , B24B37/30 , B24B37/32 , C23F1/02
摘要： A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring for holding a workpiece and pressing the workpiece against the abrasive cloth under a first pressing force to polish the workpiece. A guide ring is vertically movably disposed around the top ring, and pressed against the abrasive cloth under a variable second pressing force. The first and second pressing forces are variable independently of each other, and the second pressing force is determined based on the first pressing force.
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公开(公告)号：USD711330S1
公开(公告)日：2014-08-19
申请号：US29384219
申请日：2011-01-28
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公开(公告)号：US20120058709A1
公开(公告)日：2012-03-08
申请号：US13226800
申请日：2011-09-07
CPC分类号： B24B37/005 , B24B37/015 , B24B37/10 , B24B37/30 , H01L21/67017 , H01L21/67092 , H01L21/6838
摘要： A polishing is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a substrate holding apparatus configured to hold the substrate and to press the substrate against the polishing surface, and a controller. The substrate holding apparatus includes an elastic membrane configured to form a substrate holding surface which is brought into contact with the substrate, a carrier provided above the elastic membrane, at least one pressure chamber formed between the elastic membrane and the carrier, and an infrared light detector configured to measure thermal energy from the elastic membrane. The controller calculates an estimate value of a temperature of the elastic membrane using a measured value of the infrared light detector.
摘要翻译： 抛光用于将诸如半导体晶片的基板抛光到平面镜面。 抛光装置包括具有抛光表面的抛光台，配置成保持基板并将基板压靠在抛光表面上的基板保持装置和控制器。 基板保持装置包括：弹性膜，其构造成形成与基板接触的基板保持面，设置在弹性膜上方的载体，形成在弹性膜与载体之间的至少一个压力室，以及红外线 检测器被配置为测量来自弹性膜的热能。 控制器使用红外光检测器的测量值来计算弹性膜的温度的估计值。
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公开(公告)号：US20080318499A1
公开(公告)日：2008-12-25
申请号：US12222909
申请日：2008-08-19
申请人： Hozumi Yasuda , Tetsuji Togawa , Osamu Nabeya , Kenichiro Saito , Makoto Fukushima , Tomoshi Inoue
发明人： Hozumi Yasuda , Tetsuji Togawa , Osamu Nabeya , Kenichiro Saito , Makoto Fukushima , Tomoshi Inoue
IPC分类号： B24B1/00
CPC分类号： B24B37/32
摘要： A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.
摘要翻译： 基板保持装置防止基板滑出并允许基板被稳定地抛光。 基板保持装置具有用于将基板保持并压靠在研磨面上的顶环体，以及用于按压研磨面的保持环，保持环设置在顶环体的外周部。 保持环包括由磁性材料制成的第一构件和具有设置在其表面上的磁体的第二构件，该磁体保持抵靠第一构件。
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公开(公告)号：US20080299880A1
公开(公告)日：2008-12-04
申请号：US12136424
申请日：2008-06-10
IPC分类号： B24B41/06
摘要： A substrate holding apparatus has a substrate holder body with a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periphery of the substrate held by the substrate holder body so that the retainer ring engages with the polishing surface radially outside the substrate as the polishing of the substrate is effected. The substrate holder body is provided with a membrane having inside and outside surfaces. The inside surface cooperates with a surface of the substrate holder body to define a fluid pressure chamber to which a fluid pressure is applied. The outer surface engages with the substrate held by the substrate holder body.
摘要翻译： 基板保持装置具有基板保持体，基板保持面朝向研磨面，并且将基板保持在基板保持侧，并且保持环固定地固定到基板保持体。 保持环被布置成围绕由基板保持器主体保持的基板的外周，使得当基板的抛光实现时，保持环与基板的径向外侧的抛光表面接合。 衬底保持器主体设置有具有内表面和外表面的膜。 内表面与衬底保持器主体的表面配合以限定施加流体压力的流体压力室。 外表面与由基板保持体保持的基板接合。
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公开(公告)号：US20080066862A1
公开(公告)日：2008-03-20
申请号：US11979019
申请日：2007-10-30
IPC分类号： C23F1/00
摘要： A substrate holding apparatus has a substrate holder body with a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periphery of the substrate held by the substrate holder body so that the retainer ring engages with the polishing surface radially outside the substrate as the polishing of the substrate is effected. The substrate holder body is provided with a membrane having inside and outside surfaces. The inside surface cooperates with a surface of the substrate holder body to define a fluid pressure chamber to which a fluid pressure is applied. The outer surface engages with the substrate held by the substrate holder body.
摘要翻译： 基板保持装置具有基板保持体，基板保持面朝向研磨面，并且将基板保持在基板保持侧，并且保持环固定地固定到基板保持体。 保持环被布置成围绕由基板保持器主体保持的基板的外周，使得当基板的抛光实现时，保持环与基板的径向外侧的抛光表面接合。 衬底保持器主体设置有具有内表面和外表面的膜。 内表面与衬底保持器主体的表面配合以限定施加流体压力的流体压力室。 外表面与由基板保持体保持的基板接合。
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公开(公告)号：US20060234609A1
公开(公告)日：2006-10-19
申请号：US11452218
申请日：2006-06-14
申请人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
发明人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
CPC分类号： B24B37/30 , B24B41/061
摘要： The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further comprises a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for being brought into contact with the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus further comprises a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.
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公开(公告)号：US06890402B2
公开(公告)日：2005-05-10
申请号：US09917732
申请日：2001-07-31
IPC分类号： H01L21/304 , B24B37/30 , B24B37/32 , B24B37/04 , B24B41/06
摘要： A substrate holding apparatus comprises a substrate holder body having a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periphery of the substrate held by the substrate holder body so that the retainer ring engages with the polishing surface radially outside the substrate as the polishing of the substrate is effected. The substrate holder body is provided with a membrane having inside and outside surfaces. The inside surface cooperates with a surface of the substrate holder body to define a fluid pressure chamber to which a fluid pressure is applied. The outer surface engages with the substrate held by the substrate holder body.
摘要翻译： 基板保持装置包括：基板保持体，其具有面向抛光表面的基板保持侧，并且将基板保持在基板保持侧;以及保持环，其固定地固定到基板保持体。 保持环被布置成围绕由基板保持器主体保持的基板的外周，使得当进行基板的抛光时，保持环与基板的径向外侧的抛光表面接合。 衬底保持器主体设置有具有内表面和外表面的膜。 内表面与衬底保持器主体的表面配合以限定施加流体压力的流体压力室。 外表面与由基板保持体保持的基板接合。
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公开(公告)号：US06416384B1
公开(公告)日：2002-07-09
申请号：US09126088
申请日：1998-07-30
IPC分类号： B24B4900
CPC分类号： H01L21/02024 , B24B37/015
摘要： A polishing apparatus can improve the uniformity of thickness within a workpiece or reduce thickness variation between serially polished workpieces. The polishing apparatus comprises a polishing unit having a polishing tool for providing a polishing surface and a workpiece holding device for holding the workpiece. A polishing solution or liquid supplying device is provided for supplying a polishing solution or liquid into a polishing interface between the surface of the workpiece and the polishing surface. A temperature of the polishing interface is controlled according to at least an ambient temperature of a polishing space surrounding the polishing unit, as a variable parameter.
摘要翻译： 抛光装置可以改善工件内的厚度均匀性或减少连续抛光的工件之间的厚度变化。 抛光装置包括具有用于提供抛光表面的抛光工具和用于保持工件的工件保持装置的抛光单元。 提供抛光溶液或液体供应装置，用于将抛光溶液或液体供应到工件表面和抛光表面之间的抛光界面。 作为可变参数，抛光界面的温度根据抛光单元周围的抛光空间的至少环境温度进行控制。
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公开(公告)号：US6019868A
公开(公告)日：2000-02-01
申请号：US28661
申请日：1998-02-24
申请人： Norio Kimura , Hozumi Yasuda
发明人： Norio Kimura , Hozumi Yasuda
CPC分类号： B24B37/32
摘要： A polishing apparatus for polishing a workpiece to a flat mirror finish includes a turntable with a polishing cloth attached to an upper surface thereof, and a top ring for holding a workpiece thereon and pressing the workpiece against the polishing cloth to polish the workpiece. A retainer ring or a presser ring is disposed around the top ring. The retainer ring or the presser ring is vertically movable independently of the top ring, and pressed against the polishing cloth by a pressing mechanism. A stabilizing mechanism is disposed between an inner circumferential surface of the retainer ring or the presser ring, and an outer circumferential surface of the top ring, for holding the top ring substantially stabilized within the retainer ring or the presser ring.
摘要翻译： 用于将工件抛光到平面镜面的抛光装置包括具有安装在其上表面上的抛光布的转盘和用于在其上保持工件的顶环，并将工件压靠在抛光布上以抛光工件。 保持环或压环设置在顶环周围。 保持环或压环可以独立于顶环垂直移动，并通过按压机构压靠在抛光布上。 稳定机构设置在保持环的内周表面或压环之间，以及顶环的外圆周表面之间，用于将顶环保持基本稳定在保持环或压环内。
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