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公开(公告)号:US20240427542A1
公开(公告)日:2024-12-26
申请号:US18339849
申请日:2023-06-22
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Syed S. Azam , Timothy Paul Guynes , Gregory Staten
Abstract: Devices and methods for updating display device settings include generating a machine-readable code corresponding to settings of a display device and exporting the machine-readable code to a storage medium. The devices and methods further include initiating import of the machine-readable code to the display device and executing the machine-readable code via control circuitry of the display device to update the settings of the display device.
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公开(公告)号:US20240424558A1
公开(公告)日:2024-12-26
申请号:US18575181
申请日:2021-07-09
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: John Samuel Dilip Jangam , Thomas Anthony , Ben Pon , Lihua Zhao
Abstract: A method of three-dimensional printing can include iteratively applying metal particles having a heat fusion temperature as individual build material layers, and based on a 3D object model, iteratively and selectively applying a metallic binding agent onto the individual build material layers so that the individual build material layers are built up and bound together to form a green-body object. The metallic binding agent includes an aqueous liquid vehicle and metal salt or metal oxide nanoparticles that are thermally reducible to a metal or metal alloy at an elevated metal reducing temperature that is lower than the heat fusion temperature. The method also includes iteratively and selectively applying a polymeric binding agent onto the individual build material layers at an interface between the green-body object and a support structure for the green-body object, leaving a residue at the interface.
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公开(公告)号:US20240419563A1
公开(公告)日:2024-12-19
申请号:US18703791
申请日:2022-10-04
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Suyong LEE , Young Kang KONG , Myung Won KIM , Kiyoun KIM
Abstract: An example image forming apparatus includes a main board having a processor, a power unit to provide driving power to the main board, a wired interface to connect with an external apparatus through a wired connection, a detection circuit to detect an operation status of the power unit, a display, and a processor. The processor, based on the power unit being detected to be in a non-operating status by the detection circuit in a state wherein a turn-on instruction was input, is to be provided with power from the external apparatus through the wired interface and is booted, and, based on the booting being completed, is to control the display to display a status of the power unit.
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公开(公告)号:US20240418459A1
公开(公告)日:2024-12-19
申请号:US18704249
申请日:2021-10-27
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Wei HUANG , Thomas Craig ANTHONY , Harish IRRINKI , Ben PON
Abstract: Examples of lattice structures are described herein. In some examples, a heat exchanger may include a three-dimensional (3D) lattice structure. In some examples, the heat exchanger may include a spiral structure transecting the 3D lattice structure. In some examples, the spiral structure is to mix fluid to pass through the 3D lattice structure.
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公开(公告)号:US20240418236A1
公开(公告)日:2024-12-19
申请号:US18704887
申请日:2021-10-29
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Lluis HIERRO DOMENECH , Cristina DOMINGUEZ MANCHADO , Bernat POLL CRESPO , Davinia FONT CALAFELL , Jordi CASELLAS LOPEZ , Jordi ARCAS MANRIQUE
IPC: F16F15/067 , B29C64/386 , B33Y80/00 , F16F3/04
Abstract: In an example, a flexible structure comprises a plurality of interlinked spring units. Each spring unit may comprise at least three coaxial coiled springs, and each spring of a spring unit may comprise a first end and second end. In some examples, an end of one spring adjoins an end of a spring of an adjacent spring unit.
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公开(公告)号:US20240416423A1
公开(公告)日:2024-12-19
申请号:US18704875
申请日:2021-10-29
Applicant: Hewlett-Packard Development Company, L.P.
IPC: B22F10/80 , B22F10/28 , B28B1/00 , B29C64/153 , B29C64/386 , B29K23/00 , B29K75/00 , B29K77/00 , B29K105/00 , B29K105/16 , B29K505/00 , B29K509/00 , B29L31/00 , B33Y10/00 , B33Y50/00 , B33Y70/10 , B33Y80/00
Abstract: In an example, a method includes defining, for an interior portion of an object to be generated in additive manufacturing, an imaging characteristic in a radiation environment. In some examples the method further includes deriving object model data for generating the interior portion of the object by determining an amount of a first contrast agent and an amount of a second contrast agent to deposit such that the object generated according to the object model data comprises the defined imaging characteristic apparent in an image of at least a part of the object comprising the interior portion captured in the radiation environment. The first contrast agent and the second contrast agent may have different imaging characteristics in the radiation environment.
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公开(公告)号:US20240402635A1
公开(公告)日:2024-12-05
申请号:US18695790
申请日:2022-05-18
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Sunhyung LEE , Hojin RYU
IPC: G03G15/20
Abstract: An example fuser includes a flexible fusing belt, a backup member located outside the fusing belt to form a fusing nip with the fusing belt, a heater substrate having a first surface including a heating element pattern and a second surface, opposite to the first surface, to heat the fusing belt in the fusing nip, and a heat conduction member in contact with the first surface of the heater substrate to distribute the heat of the heater substrate. The heating element pattern includes a first heating element having a first length greater than a width of a first print medium, and a second heating element having a second length greater than a width of a second print medium and greater than the first length.
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公开(公告)号:US20240401272A1
公开(公告)日:2024-12-05
申请号:US18700244
申请日:2021-10-14
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Mary Louise Gray BAKER , Nathan Eric SHIRLEY , Ronnie George Parsons , Matthew A. SHEPHERD
IPC: D21F1/66 , B29C64/386 , B33Y50/00 , B33Y80/00 , D21J3/00
Abstract: In some examples, a tool for manufacturing parts includes a body formed using an additive manufacturing process, where the body includes a plurality of repeating structures, and where the plurality of repeating structures include a first subset of repeating structures each having a first physical property as specified by a digital representation of the tool used in the additive manufacturing process, and a second subset of repeating structures each having a different second physical property as specified by the digital representation of the tool used in the additive manufacturing process.
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公开(公告)号:US20240392143A1
公开(公告)日:2024-11-28
申请号:US18685495
申请日:2021-09-09
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Bo Song , Zhuqing Zhang
IPC: C09D5/24 , B29C43/00 , B29C43/18 , B29C70/54 , B29K63/00 , B29K105/00 , B29K105/16 , B29K105/20 , B29K507/00 , B29K507/04 , B29K707/00 , B29L31/00 , C08K3/04 , C08K3/36 , C09D7/40 , C09D7/61 , C09D163/04
Abstract: An epoxy resin compound is provided. The epoxy resin compound includes a hardener, an inorganic based filler, a catalyst, and a conductive additive. The amount of inorganic based filler is greater than 80 weight percent (wt %) of the epoxy resin compound. The catalyst is to accelerate curing of the epoxy resin compound. The amount of conductive additive is 0.1 to 5 wt % of the epoxy resin compound.
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公开(公告)号:US20240385672A1
公开(公告)日:2024-11-21
申请号:US18691734
申请日:2021-10-13
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Wen-Bin Lin , Chao-Wen Cheng , Chien-Cheng Su
IPC: G06F1/3215 , G06F1/3234 , G06F13/42
Abstract: In example implementations, an apparatus is provided. The apparatus includes an expansion slot, a peripheral device connected to the expansion slot, and a processor communicatively coupled to the expansion slot. The processor is to determine that a compatibility of the peripheral device with active state power management (ASPM) is unknown, provide a notification to indicate that the compatibility of the peripheral device with ASPM is unknown, wherein the notification provides a selection between disabling ASPM for the peripheral device or enabling ASPM for the peripheral device, and configure a basic input/output system (BIOS) setting in accordance with the selection to control the ASPM for the peripheral device.
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