Abstract:
An improved ceramic dielectric composition for preparing multilayer ceramic structures for electronic devices and a method of enhancing the sinterability of such compositions at low firing temperatures by improving the distribution of zinc borate based sintering flux uniformly throughout the composition.
Abstract:
A DIELECTRIC MATERIAL IS FORMULATED BY FIRING AN ADMIXTURE OF FROM ABOUT 2-55% BY WEIGHT ZIRCON (ZIRCONIUM SILICATE) AND ABOUT 45-98% BY WEIGHT OF A LEAD BARIUM BOROSILICATE GLASS. IN FINAL FORM, THE DIELECTRIC MATERIAL EXHIBITS A LOW K (APPROXIMATELY 6) AND A HIGH Q VALUE. THE PASTE COMPOSITION IS FORMULATED BY ADMIXING THE AFOREMENTIONED INGREDIENTS IN AN ORGANIC VEHICLE, DRYING THE PASTE AND FIRING THE PASTE AT A TEMPERATURE OF FROM ABOUT 800-1,000*C. THE PASTE IS USUALLY APPLIED BY A SCREEN PRINTING TECHNIQUE PREFERABLY USING A MESH SIZE IN THE RANGE OF ABOUT 165.
Abstract:
A frit capacitor of either the discrete or integrated microcircuit variety having a ferroelectric glass-ceramic dielectric whose dielectric constant is of intermediate value between about 20 and 400. The desired value of dielectric constant is accurately obtained in a readily reproducible manner by mixing a batch containing appropriate quantities of stable non-crystallizable glass particles and glass particles capable of forming a ferroelectric crystal phase. The desired dielectric constant is obtained by subjecting the batch to heat treatment. By controlling the weight ratio of the two glass components during the batch preparation, individual capacitor dielectrics having different dielectric constants can be provided utilizing the same firing schedule for each.
Abstract:
UNIQUE DIELECTRIC COMPOSITIONS MAY BE USED TO FORMULATE THICK FILM PASTES FOR PRINTING MICROELECTRONIC CAPACITORS. THE RESULTING DIELECTRICS EXHIBIT DIELECTRIC CONSTANTS GREATER THAN ABOUT 500 AND CAPACITANCES GREATER THAN ABOUT 80,000 PICOFARADS PER SQUARE INCH AT A THICKNESS OF AT LEAST ABOUT 1.0 MIL. THE UNIQUE DIELECTRIC COMPOSITIONS COMPRISE ABOUT 55-76 PERCENT BY WEIGHT OF A FERROELECTRIC MATERIAL AND 45-24 PERCENT OF A GLASS BINDER. THE GLASS BINDER EMPLOYED COMPRISES A LEAD BARIUM BOROSILICATE GLASS AND A FERROELECTRIC MATERIAL PREVIOUSLY DISSOLVED THEREIN. THE COMPOSITION IS FORMULATED INTO A PRINTING PASTE BY FIRST DISSOLVING 20-30 PERCENT BY WEIGHT FERROELECTRIC INTO 70-80 PERCENT BY WEIGHT LEAD BARIUM BOROSILICATE GLASS BINDER, COOLING THE NEWLY FORMED GLASS TO A SOLID STATE COMMINUTING THE GLASS TO A PARTICLE SIZE OF LESS THAN ABOUT 1 MICRON AND THEREAFTER ADMIXING THE COMMINUTED GLASS WITH THE SAME PARTICULATE FERROELECTRIC IN AN AMOUNT AS INDICATED. THIS ADMIXTURE IS THEN ADDED TO A LIQUID ORGANIC CARRIER VEHICLE TO FORMULATE THE PRINTING PASTE. THE PRINTING PASTE IS THEN PRINTED INTO A CHOSEN DESIGN AND FIRED AT A TEMPERATURE OF APPROXIMATELY 1,0001,050*C. TO PRODUCE A HIGHLY DENSE, UNIFORM, AND SUBSTANTIALLY CRACK-FREE DIELECTRIC MATERIAL.
Abstract:
Novel glass-ceramics are prepared from glasses which consist essentially of critical proportionate amounts of SiO2, PbO, Al2O3, TiO2 and BaO; optional components thereof include ZnO, PbF2, SrO, ZrO2, Ta2O5, WO3, CdO, SnO2 and Sb2O3. The glasses are used, e.g., in particulate form, in preparing screen-printable crossover dielectric compositions, and as the inorganic binder component in preparing screen-printable conductor or resistor compositions, each of which may be fired to produce these novel glass-ceramics.
Abstract translation:由玻璃制成新型玻璃陶瓷,其基本上由主要成分量的SiO 2,PbO,Al 2 O 3,TiO 2和BaO组成; 其任选的组分包括ZnO,PbF 2,SrO,ZrO 2,Ta 2 O 5,WO 3,CdO,SnO 2和Sb 2 O 3。 玻璃用于制备丝网印刷交联电介质组合物中的颗粒形式的玻璃,以及制备可丝网印刷导体或电阻组合物中的无机粘合剂组分,其中每一种可被烧制以制备这些新型玻璃陶瓷。
Abstract:
The capacitor includes at least one pair of electrodes separated by high-energy storage material consisting essentially of 85-95 percent by volume of an antiferroelectric ceramic and 5-15 percent by volume of nonreactive glass fired into a coherent body.
Abstract:
AN ALUMINA DIELECTRIC OF FINE GRAINED STRUCTURE AND HIGH TENSILE STRENGTH CONTAINING FROM ABOUT 2% TO ABOUT 12% BY WEIGHT OF A GLASSY PHASE WHICH BONDS THE FINELY DIVIDED ALUMINA GRANS TOGETHER, THE GLASSY PHASE CONTAINING AT LEAST U% CALCIUM PHOSPHATE AND ONE OR MORE FLUX ADDITIVES, CONSISTING OF LITHIUM SILICATE, ZINC SILICATE, CALCIUM SILICATE OR MAGNESIUM SILICATE IN AN AMOUNT EQUAL TO THE CALDIUM PHOSPHATE AND FORMED THROUGH REACTIVE SINTERING AT FROM ABOUT 1350*C. UP TO 1460*C. WHICH IS 50-200* LESS THAN THAT OF ALUMINA PER SE (1550*C.). THE DIELECTRIC WHICH ADHERES TO NOBLE METALS IS CHARACTERIZED BY HIGH ELECTRICAL VOLUME RESISTIVITY OF 10**12-10**14 OHM-CM., LOW DISSIPATION FACTOR, LOW THERMAL EXPANSION FROM 65 TO 67.6 IN./IN.*C. AND HIGH DENSITY FROM 3.40 TO 3.86 GM.-CU. CC. THE SHRINKAGE OF THE PREFERRED EMBODIMENTS IS ABOUT 17.0-18.0% IN COMPARISON WITH A SHRINKAGE 18.5% FOR ALUMINA TO WHICH NO FLUX IS ADDED. SURFACE ROUGHNESS VALUES AS LOW AS 2 TO 4 MICROINCHES ARE ACHIEVED.