Abstract:
A semiconducting structure comprising at least three contiguous charge regions induced by electrodes insulated from each other and from the semiconductor, which is operable as a bipolar transistor, as a field effect transistor, or as a generally lateral charge transfer device, depending on the potentials applied to the inducing electrodes.
Abstract:
A ceramic dielectric body, resistant to reduction in atmospheres of low oxygen content, has terminations comprising a sponge like matrix of base metal particles bound by an interspersed matrix of a glass that is also resistant to reduction, as for example, the barium alumino borate glasses. A method for making the capacitor comprises prefiring the ceramic body in air or other atmosphere, depositing an ink composed of base metal particles and glass frit, an organic binder and firing in an atmosphere of low oxygen content.
Abstract:
An FM receiver sound channel network is presented wherein a single capacitor serves the dual roles of, filtering out amplifier bias circuit ripple, and providing a.c. interstage coupling between the detector and the audio amplifier. This circuit is especially suitable where most of the components of the sound channel take the form of an integrated circuit.
Abstract:
A plastic film is double metallized in a vacuum metallizer and a freshly metallized film surface is exposed to air before it is wound into a roll.
Abstract:
A temperature regulating heating element comprises a PTCR body having a surface with a pair of adjacent electrodes oppositely connected to a voltage source by two lead wires, respectively. Thus in the PTCR body the electrical current and the source of heat is concentrated near the electroded surface. An electrically insulating layer may cover the electroded surface of the body to prevent shorting of the electrodes by a conducting object that is to be heated by thermal connection to the electroded surface.
Abstract:
A PNP and an NPN transistor are combined with a few resistors to form a buffer switch that is particularly useful for interfacing transistor logic circuits with remote mechanical switches in a high noise environment. Noise voltages that may be generated in chassis or common ground circuits leading to the logic inputs, must reach a level almost as large as the switching circuit power supply voltage, to cause abnormal switching.
Abstract:
A low temperature fired glass-ceramic system encompassing a series of temperature compensating bodies having temperature coefficients that cover a wide range and possessing dielectric constants of from 30 to 125. This system consists of a mixture of a prefired blend of baria, titania and rare earth oxides, and a low firing glass formulation wherein the mixture is fired within the temperature range of 1,800*F to 2,100*F. A slip suspension of this mixture can be used to manufacture monolithic capacitors that utilize a relatively inexpensive palladium-silver electrode.
Abstract:
In a multilayer ceramic capacitor having base metal electrodes, a thin film of gold covers the electrode edges that are flush with the ceramic body faces. The capacitor terminals consist in silver coverings that are bonded to each of these faces and the gilded electrode edges. A method of immersion plating is employed to accomplish a selective deposition of gold on only the electrode edges.
Abstract:
AN ALUMINUM CAPACITOR ELECTRODE HAS A PARTIALLY CRYSTALLINE ANODIC OXIDE STRUCTURE FORMED THEREON THAT IS HYDRATION-RESISTANT, AND POSSESES A STABLE CAPACITANCE VALUE, DISSIPATION FACTOR AND A LEAKAGE CURRENT EVEN UNDER HIGH HUMIDITY CONDITIONS. THIS HYDRATION-RESISTANT OXIDE STRUCTURE IS ADVABTAGEOUSLY FORMED WHEN AN ALUMINUM ELECTRODE IS TREATED IN A FORMATION ELECTROLYTE AT A TEMPERATURE IN EXCESS OF 150*C. THE ELECTROLYTE MAY BE ANY SUITABLE SOLVENT/SOLUTE SYSTEM WHEREIN THE SOLVENT IS A HHIGH BIOLING ORGANIC MATERIAL CONTAINING A SMALL PERCENTAGE OF WATER AND THE SOLUTE IS A SALT HAVING A CONCENTRATION THAT IMPARTS A CONDUCTIVITY OF 10,000 OHM-CM.OR LESS TO THE ELECTROLYTE.
Abstract:
An electronic component package is disclosed comprising a metal tube upon whose surfaces is grown an oxide insulative film. A metal layer covers each end of the tube including a portion of the tube''s inside and outside surfaces. A component such as a solid tantalum capacitor, mounted inside the tube is contacted by a conductive plug in each end of the tube. The conductive layers, form the terminals of the package by which the component may be electrically and physically mounted by soldering to a hybrid integrated circuit substrate.