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公开(公告)号：US09476657B1
公开(公告)日：2016-10-25
申请号：US14085066
申请日：2013-11-20
申请人： Google Inc.
CPC分类号： F28F27/02 , F28D1/024 , F28D15/00 , F28D2021/0019 , G05D23/1917 , G05D23/1932 , H05K7/2079 , H05K7/208 , H05K7/20836
摘要： Techniques for controlling a data center cooling system include polling a plurality of control devices associated with the data center cooling system for a respective state of each of the control devices; receiving, from each of the plurality of control devices, a response that includes the respective state; aggregating the responses from the plurality of control devices; executing a control algorithm that includes the aggregated responses as an input to the algorithm and an output that includes a setpoint of the plurality of control devices; and transmitting the output to the plurality of control devices.
摘要翻译： 用于控制数据中心冷却系统的技术包括轮询与数据中心冷却系统相关联的多个控制装置，用于每个控制装置的相应状态; 从所述多个控制装置中的每一个接收包括所述相应状态的响应; 聚合来自多个控制装置的响应; 执行包括所述聚合响应作为所述算法的输入的控制算法和包括所述多个控制设备的设定点的输出; 以及将所述输出发送到所述多个控制装置。
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62.发明申请公开(公告)号：US20160066468A1
公开(公告)日：2016-03-03
申请号：US14474780
申请日：2014-09-02
申请人： Dell Products L.P.
IPC分类号： H05K7/20
摘要： In accordance with embodiments of the present disclosure, a system may include a structural element and a heat pipe. The structural element may be for mechanically supporting an information handling resource. The heat pipe may be thermally and mechanically coupled to the structural element, such that the heat pipe conducts heat generated by an information handling resource supported by the structural element to the structural element.
摘要翻译： 根据本公开的实施例，系统可以包括结构元件和热管。 结构元件可以用于机械地支撑信息处理资源。 热管可以热和机械地联接到结构元件，使得热管将由结构元件支撑的信息处理资源产生的热量传导到结构元件。
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公开(公告)号：US20150136362A1
公开(公告)日：2015-05-21
申请号：US14580443
申请日：2014-12-23
申请人： NEC Corporation
发明人： Minoru Yoshikawa
IPC分类号： H05K7/20
CPC分类号： H05K7/20809 , H01L23/427 , H01L23/473 , H01L2924/0002 , H05K7/20309 , H05K7/20318 , H05K7/20327 , H05K7/20336 , H05K7/208 , H01L2924/00
摘要： A heat conveying structure for an electronic device, the heat conveying structure including an evaporating section that has a chamber structure with first fins erected therein, is thermally connected to the electronic device, evaporates a liquid coolant on the surfaces of the first fins to thereby change the liquid coolant to a vapor coolant, and sends out liquid coolant present near the first fins along with the vapor coolant as a gas-liquid two-phase flow coolant, a condensing section that has a chamber structure with second fins erected therein, and changes the gas-liquid two-phase flow coolant in contact with the second fins to a liquid coolant, a vapor pipe that connects the evaporating section and the condensing section, and moves the gas-liquid two-phase flow coolant sent out from the evaporating section to the condensing section, and a liquid pipe that connects the evaporating section and the condensing section.
摘要翻译： 一种用于电子设备的传热结构，所述传热结构包括具有其中竖立有第一散热片的腔室结构的蒸发部分，其与所述电子设备热连接，从而使所述第一翅片表面上的液体冷却剂蒸发，从而改变 将液体冷却剂输送到蒸气冷却剂，并将与第一散热片相邻的液体冷却剂与蒸气冷却剂一起作为气液两相流冷却剂发出，冷凝部分具有其中架设有第二散热片的室结构，并且改变 与第二散热片接触的气液两相流冷却剂至液体冷却剂，连接蒸发部和冷凝部的蒸汽管，使从蒸发部送出的气液二相流冷却器移动 连接到冷凝部，以及连接蒸发部和冷凝部的液体管。
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公开(公告)号：US20150135746A1
公开(公告)日：2015-05-21
申请号：US14369867
申请日：2013-01-15
CPC分类号： F24F11/30 , F24F11/46 , F24F11/70 , F24F2110/00 , F24F2140/50 , F24F2140/60 , F25B5/02 , F25B23/006 , F25B41/04 , F25B49/02 , F25B2341/0653 , F25B2600/2501 , F25B2600/2513 , F25B2700/197 , F25B2700/21175 , F28D15/0266 , F28F27/02 , H05K7/208 , H05K7/20836 , Y02B30/72
摘要： Provided is a pumped loop system (10) for cooling a heat-generating components without relying on a maximum heat load, the system including first and second evaporators (14a-14n) in parallel with one another and first and second valves (22a-22n) upstream of the first and second evaporators respectively, wherein the valves (22a-22n) are controllable to vary the flow rate of fluid to the respective evaporator (14a-14n) based on the amount of flow needed to control the respective heat-generating component. By cooling the heat-generating components without relying on the maximum heat load, adequate flow may be provided to an evaporator operating under a high heat low while reduced flow is provided to an evaporator operating under a low head load.
摘要翻译： 提供了一种用于在不依赖于最大热负荷的情况下冷却发热部件的泵送回路系统（10），所述系统包括彼此平行的第一和第二蒸发器（14a-14n）以及第一和第二阀（22a-22n） ）分别在第一和第二蒸发器的上游，其中阀（22a-22n）是可控制的，以基于控制相应的发热所需的流量来改变流体到相应的蒸发器（14a-14n）的流速 零件。 通过在不依赖于最大热负荷的情况下冷却发热部件，可以向在高热量低的温度下运行的蒸发器提供足够的流量，同时向在低负载下运行的蒸发器提供减少的流量。
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公开(公告)号：US20140326016A1
公开(公告)日：2014-11-06
申请号：US14370194
申请日：2012-12-21
申请人： NEC Corporation
发明人： Akira Shoujiguchi , Minoru Yoshikawa , Hitoshi Sakamoto , Masaki Chiba , Kenichi Inaba , Arihiro Matsunaga
CPC分类号： H05K7/208 , F25B39/00 , G06F1/20 , G06F2200/201 , H01L23/427 , H01L23/467 , H01L2924/0002 , H05K7/20309 , H05K7/20318 , H05K7/20809 , H01L2924/00
摘要： A cooling device of the present invention is a cooling device arranged in a chassis equipped with an upper surface, and comprises: a refrigerant; a vaporizer that includes an evaporative vessel having a side face of a curved surface shape, and performs heat-absorption by making the refrigerant change its phase from a liquid phase state to a vapor phase state; a condenser that performs heat-radiation by making the refrigerant change its phase from a vapor phase state to a liquid phase state; a pipe that connects the vaporizer and the condenser; and a flow path suppression means for suppressing a cooling wind that flows between an area over the evaporative vessel and the upper surface.
摘要翻译： 本发明的冷却装置是布置在具有上表面的底盘中的冷却装置，包括：制冷剂; 蒸发器，其包括具有弯曲表面形状的侧面的蒸发容器，并且通过使制冷剂将其相位从液相状态转变为气相状态来进行吸热; 通过使制冷剂将其相位从气相状态转变为液相状态而进行热辐射的冷凝器; 连接蒸发器和冷凝器的管道; 以及流路抑制装置，用于抑制在蒸发容器上方的区域和上表面之间流动的冷却风。
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66.发明申请公开(公告)号：US20140043752A1
公开(公告)日：2014-02-13
申请号：US14061655
申请日：2013-10-23
申请人： BULL SAS
IPC分类号： H05K7/20
CPC分类号： H05K7/208 , G06F1/20 , H05K7/20781
摘要： A cooling device of a computer rack equipped with a back panel including an evacuation zone, toward the exterior of the rack, of air having circulated over electric power components arranged within the computer rack and a rear door in the thickness of which air cooling means is arranged. The cooling device also includes a supporting frame on which the rear door is mounted, molded to surround the air evacuation zone of the computer rack, and removable positioning means of the supporting frame against the back panel of the computer rack.
摘要翻译： 计算机机架的冷却装置，其具有背面板，该背面板包括排出区域，朝向机架外部，具有在布置在计算机机架内的电力部件上循环的空气;以及后部门，其厚度为空气冷却装置 安排。 冷却装置还包括支撑框架，后门安装在该支撑框架上，模制成围绕计算机机架的排气区域，支撑框架的可拆卸定位装置抵靠着计算机机架的后面板。
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公开(公告)号：US20110127014A1
公开(公告)日：2011-06-02
申请号：US12323261
申请日：2008-11-25
IPC分类号： F28D15/00
CPC分类号： H05K7/208 , G06F1/20 , G06F1/206 , G06F2200/201
摘要： A globally cooled computer system for providing liquid cooling to a plurality of electrical components. The globally cooled computer system includes an electronics unit having a plurality of electronics components attached to a plurality of cards and a card cage for providing structural support to the cards, a fluid management unit for pressurizing fluid within the electronics unit, a reservoir for collecting fluid from the electronics unit, a tubing system for distributing the fluid between the electronics unit and the fluid management unit, and a pressure equalization system connecting the electronics unit and the reservoir to equalize internal pressures between them.
摘要翻译： 一种全球冷却的计算机系统，用于向多个电气部件提供液体冷却。 全球冷却的计算机系统包括具有附接到多个卡的多个电子部件和用于向卡提供结构支撑的卡笼的电子单元，用于对电子单元内的流体加压的流体管理单元，用于收集流体的储存器 来自电子单元的用于在电子单元和流体管理单元之间分配流体的管道系统以及连接电子单元和储存器以均衡其间的内部压力的压力均衡系统。
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68.发明申请公开(公告)号：US20100033933A1
公开(公告)日：2010-02-11
申请号：US12536996
申请日：2009-08-06
CPC分类号： H05K7/208 , F28D15/0233 , F28F2245/02 , F28F2245/04 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： According to an embodiment, there is provided a heat spreader including an evaporation portion, a first condenser portion, a working fluid, and a first flow path. The evaporation portion is arranged in a first position. The first condenser portion is arranged in a second position, the second position being the first position. The working fluid evaporates from a liquid phase to a gas phase in the evaporation portion, and condenses from the gas phase to the liquid phase in the first condenser portion. The first flow path is made of a nanomaterial, has hydrophobicity on a surface, and causes the working fluid condensed to the liquid phase in the first condenser portion to flow to the evaporation portion.
摘要翻译： 根据一个实施例，提供了一种散热器，其包括蒸发部分，第一冷凝器部分，工作流体和第一流动路径。 蒸发部分布置在第一位置。 第一冷凝器部分布置在第二位置，第二位置是第一位置。 工作流体在蒸发部分中从液相蒸发到气相，并在第一冷凝器部分中从气相冷凝成液相。 第一流路由纳米材料制成，在表面上具有疏水性，并且使在第一冷凝器部分中冷凝到液相的工作流体流向蒸发部分。
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公开(公告)号：US20060250755A1
公开(公告)日：2006-11-09
申请号：US11334269
申请日：2006-01-18
申请人： Charles Tilton , Donald Tilton , Randal Palmer , Tony Hyde
发明人： Charles Tilton , Donald Tilton , Randal Palmer , Tony Hyde
IPC分类号： H02B1/00
CPC分类号： H05K7/208 , G06F1/20 , G06F1/206 , G06F2200/201
摘要： A globally cooled computer system for providing liquid cooling to a plurality of electrical components. The globally cooled computer system includes an electronics unit having a plurality of electronics components attached to a plurality of cards and a card cage for providing structural support to the cards, a fluid management unit for pressurizing fluid within the electronics unit, a reservoir for collecting fluid from the electronics unit, a tubing system for distributing the fluid between the electronics unit and the fluid management unit, and a pressure equalization system connecting the electronics unit and the reservoir to equalize internal pressures between them.
摘要翻译： 一种全球冷却的计算机系统，用于向多个电气部件提供液体冷却。 全球冷却的计算机系统包括具有附接到多个卡的多个电子部件和用于向卡提供结构支撑的卡笼的电子单元，用于对电子单元内的流体加压的流体管理单元，用于收集流体的储存器 来自电子单元的用于在电子单元和流体管理单元之间分配流体的管道系统以及连接电子单元和储存器以均衡其间的内部压力的压力均衡系统。
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公开(公告)号：US20240349463A1
公开(公告)日：2024-10-17
申请号：US18756775
申请日：2024-06-27
发明人： Yongqi QIU , Jiyang LI
IPC分类号： H05K7/20
CPC分类号： H05K7/208 , H05K7/20309 , H05K7/20318 , H05K7/20327 , H05K7/20354
摘要： This application provides a heat exchange device and a heat exchange system. The heat exchange device has a first heat exchange mode, and includes a housing, a partition plate, an evaporator, and a compressor. The partition plate divides space inside the housing into an internal circulation cavity and an external circulation cavity. The evaporator and the compressor are located in the internal circulation cavity. A first valve group is disposed between an inlet of the compressor and an outlet of the evaporator. When the first heat exchange mode is used for heat exchange, the evaporator is communicated with the compressor by using the first valve group. In this application, the compressor is disposed in the internal circulation cavity, so that a temperature difference between the compressor and the evaporator is small, thereby reducing a slugging risk of the compressor.
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