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    TEMPERATURE SENSOR ELEMENT
    65.
    发明申请
    TEMPERATURE SENSOR ELEMENT 有权

    公开(公告)号：US20220065708A1

    公开(公告)日：2022-03-03

    申请号：US17419567

    申请日：2020-03-04

    申请人： SUMITOMO CHEMICAL COMPANY, LIMITED

    发明人： Megumi HAYASAKA ,  Yuichiro KUNAI

    IPC分类号： G01K7/22 ,  C08L79/08 ,  H01C7/04 ,  H01C1/14

    摘要： There is provided a temperature sensor element including a pair of electrodes and a temperature-sensitive film disposed in contact with the pair of electrodes, in which the temperature-sensitive film includes a fluorine atom and the temperature-sensitive film includes a matrix resin and a plurality of conductive domains contained in the matrix resin, and the conductive domains includes a conductive polymer.

    Composition of Phthalonitrile Resin Matrix for Polymer Composite Materials, Method for Fabrication Thereof, Method for Manufacturing of Polymer Composite Material, and Material Obtained by this Method
    69.
    发明申请
    Composition of Phthalonitrile Resin Matrix for Polymer Composite Materials, Method for Fabrication Thereof, Method for Manufacturing of Polymer Composite Material, and Material Obtained by this Method 有权

    公开(公告)号：US20220017712A1

    公开(公告)日：2022-01-20

    申请号：US17292348

    申请日：2019-11-07

    申请人： Institute of New Carbon Materials and Technologies

    发明人： Boris Anatolievich BULGAKOV ,  Aleksandr Vladimirovich BABKIN ,  Alexey Valerievich KEPMAN ,  Viktor Vasilievich AVDEEV

    IPC分类号： C08J5/24 ,  C08L79/08 ,  C08G73/06 ,  C08K5/523 ,  C08J5/06 ,  C08J5/04 ,  C08K5/42 ,  C08K5/17

    摘要： This invention is related to a resin matrix composition intended for production of a polymer composite material (PCM) or prepregs for PCM, to variants of methods for producing resin matrix compositions, to a method for curing the resin matrix composition, to a polymer composite material and method for its fabrication. The resin matrix composition includes: (1) polymerizable mixture containing one or more bis-phthalonitrile monomers with the general formula: where X, Y, Z are each independently selected from the group consisting of H, F, Cl, Br and CH3, taken in the amount of 20-94 wt % of the polymerizable mixture weight; one or more reactive plasticizers-antipyrenes with the general formula: where group can be in the meta- or para-position relative the oxygen atom bonded to the benzene ring, and R is selected from an aryl, oxyaryl, alkyl, or oxyalkyl group, or plasticizers-antipyrenes with the general formula: where R is selected from an aryl, oxyaryl, alkyl, or oxyalkyl group, taken in the amount of 5-80 wt % of the total polymerizable mixture weight; one or more active diluents with the general formula: where R can be in meta- or para-position relative to the oxygen bonded to the benzene ring, and stands for H, CN, NH2 or N(C3H3)2, in the amount from 1 to 50% of the total polymerizable mixture weight. The resin matrix composition also includes (2) curing agent in the amount from 1 to 20% of the total polymerizable mixture weight selected from aromatic diamines or bisphenols that have boiling points of at least 180° C. under vacuum of 0.1 mm Hg. The total content of the polymerizable mixture and the curing agent is from 60 to 100 wt % of the total resin matrix weight. The invention allows to increase the thermal stability of the resin matrix and obtain composite material which after curing possesses increased thermal stability at temperatures up to 450° C., have melting points or glass transition temperatures of no more than 50° C., provide melt viscosities below 800 mPa·s at temperatures from 100 to 180° C. and below 300 mPa·s at temperatures from 120 to 180° C.