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    Hot melt adhesive based on low melting point polypropylene homopolymers
    73.
    发明授权
    Hot melt adhesive based on low melting point polypropylene homopolymers 有权
    基于低熔点聚丙烯均聚物的热熔胶

    公开(公告)号：US09334431B2

    公开(公告)日：2016-05-10

    申请号：US14284381

    申请日：2014-05-21

    Applicant: Bostik, Inc.

    Inventor： Richard Hamann ,  Lianne Rachow

    IPC: C09J157/02 ,  C09J123/12 ,  C08L91/06

    CPC classification number: C09J157/02 ,  A61F13/49009 ,  A61F13/515 ,  B32B5/022 ,  B32B7/12 ,  B32B27/12 ,  B32B27/32 ,  B32B2255/02 ,  B32B2255/26 ,  B32B2307/31 ,  B32B2307/51 ,  B32B2439/00 ,  B32B2519/00 ,  B32B2555/02 ,  C08L23/142 ,  C08L91/06 ,  C09J11/08 ,  C09J123/12

    Abstract: A hot melt adhesive for use on porous substrates, wherein the hot melt adhesive has a) about 10% to about 70% by weight of a polypropylene homopolymer having a DSC melting point of less than 100° C.; b) about 10% to about 60% of a first tackifying resin having a Ring & Ball Softening Point of about 95° C. to about 140° C.; c) about 0% to about 65% of a second tackifying resin that is different than the first tackifying resin; d) about 5% to about 50% of a plasticizer; e) about 1% to about 40% by weight of a secondary polymer which is either a semi-crystalline polymer or wax with an enthalpy of fusion of greater than 30 Joules/gram; f) about 0.1% to about 5% of a stabilizer or antioxidant; wherein the components total 100% by weight of the composition, and the viscosity of the composition is equal to or less than about 20,000 centipoise (cP) at 163° C. (325° F.).

    Abstract translation: 一种用于多孔基材的热熔粘合剂，其中该热熔粘合剂具有a）约10％至约70％重量的DSC熔点低于100℃的聚丙烯均聚物; b）约10％至约60％的具有约95℃至约140℃的环球软化点的第一增粘树脂; c）与第一增粘树脂不同的约0％至约65％的第二增粘树脂; d）约5％至约50％的增塑剂; e）约1％至约40％重量的二级聚合物，其为半结晶聚合物或具有大于30焦耳/克的熔解焓的蜡; f）约0.1％至约5％的稳定剂或抗氧化剂; 其中组分总计为组合物重量的100％，组合物的粘度在163℃（325°F）下等于或小于约20,000厘泊（cP）。

    NOVEL PROCESS FOR DOSING SUPER ABSORBENT PARTICLES
    74.
    发明申请
    NOVEL PROCESS FOR DOSING SUPER ABSORBENT PARTICLES 审中-公开
    用于制备超吸收颗粒的新方法

    公开(公告)号：US20150313764A1

    公开(公告)日：2015-11-05

    申请号：US14654219

    申请日：2013-12-20

    Applicant: BOSTIK INC. ,  BASF SE

    Inventor： Jean Francois CHARTREL

    IPC: A61F13/15 ,  B32B37/18 ,  A61F13/532

    Abstract: The present invention is directed to a novel process for dosing super absorbent polymer particles into a plurality of particles flows, comprising the steps of: (i) providing super absorbent polymer particles; (ii) imparting a rotation to said particles; and (iii) collecting separate flows of particles, wherein the step (ii) is performed with a rotating mobile (11) provided into a housing (12).Use for manufacturing absorbent article and article thus obtained.

    Abstract translation: 本发明涉及一种用于将高吸收性聚合物颗粒定量成多个颗粒流的新方法，包括以下步骤：（i）提供高吸水性聚合物颗粒; （ii）赋予所述颗粒旋转; 和（iii）收集单独的颗粒流，其中步骤（ii）用设置到壳体（12）中的旋转移动体（11）进行。 用于制造如此获得的吸收制品和制品。

    Solvent-Based Low Temperature Heat Seal Coating
    75.
    发明申请
    Solvent-Based Low Temperature Heat Seal Coating 有权
    溶剂型低温热封涂料

    公开(公告)号：US20150275032A1

    公开(公告)日：2015-10-01

    申请号：US14668586

    申请日：2015-03-25

    Applicant: Bostik, Inc.

    Inventor： Darius K. Deak ,  Thomas Lee Ruppert ,  Elaine Lo

    IPC: C09D167/02 ,  B05D3/14 ,  B05D3/00

    CPC classification number: C09D167/02 ,  B05D3/007 ,  B05D3/142 ,  C08J7/047 ,  C08J2467/00 ,  C09D167/00 ,  C09J7/22 ,  C09J7/35 ,  C09J2467/00 ,  Y10T428/24802 ,  Y10T428/265 ,  Y10T428/31667

    Abstract: A low temperature heat seal coating solution which contains an amorphous or semi-crystalline polyester or co-polyester resin, tackifier, anti-blocking agent, and solvent. The coating solution can be applied to a packaging web such as a foil or film by converters using conventional methods such as gravure, rod, slot die, or printing process. The heal seal coating can be sealed to itself or another substrate to manufacture food packaging bags or pharmaceutical blister packaging. The heat seal temperature can be as low as 70° C. under conventional equipment and conditions in the industry.

    Abstract translation: 含有无定形或半结晶聚酯或共聚酯树脂，增粘剂，防粘连剂和溶剂的低温热封涂层溶液。 通过使用常规方法如凹版印刷，棒，槽模或印刷方法，可以通过转换器将涂布溶液施加到诸如箔或膜的包装纤维网上。 愈合密封涂层可以密封到其自身或另一基底以制造食品包装袋或药物吸塑包装。 在工业常规设备和条件下，热封温度可以低至70℃。

    Hot Melt Adhesive Based On Low Melting Point Polypropylene Homopolymers
    76.
    发明申请
    Hot Melt Adhesive Based On Low Melting Point Polypropylene Homopolymers 有权
    基于低熔点聚丙烯均聚物的热熔胶

    公开(公告)号：US20140350155A1

    公开(公告)日：2014-11-27

    申请号：US14284381

    申请日：2014-05-21

    Applicant: Bostik, Inc.

    Inventor： Richard Hamann ,  Lianne Rachow

    IPC: C09J157/02

    CPC classification number: C09J157/02 ,  A61F13/49009 ,  A61F13/515 ,  B32B5/022 ,  B32B7/12 ,  B32B27/12 ,  B32B27/32 ,  B32B2255/02 ,  B32B2255/26 ,  B32B2307/31 ,  B32B2307/51 ,  B32B2439/00 ,  B32B2519/00 ,  B32B2555/02 ,  C08L23/142 ,  C08L91/06 ,  C09J11/08 ,  C09J123/12

    Abstract: A hot melt adhesive for use on porous substrates, wherein the hot melt adhesive has a) about 10% to about 70% by weight of a polypropylene homopolymer having a DSC melting point of less than 100° C.; b) about 10% to about 60% of a first tackifying resin having a Ring & Ball Softening Point of about 95° C. to about 140° C.; c) about 0% to about 65% of a second tackifying resin that is different than the first tackifying resin; d) about 5% to about 50% of a plasticizer; e) about 1% to about 40% by weight of a secondary polymer which is either a semi-crystalline polymer or wax with an enthalpy of fusion of greater than 30 Joules/gram; f) about 0.1% to about 5% of a stabilizer or antioxidant; wherein the components total 100% by weight of the composition, and the viscosity of the composition is equal to or less than about 20,000 centipoise (cP) at 163° C. (325° F.).

    Abstract translation: 一种用于多孔基材的热熔粘合剂，其中该热熔粘合剂具有a）约10％至约70％重量的DSC熔点低于100℃的聚丙烯均聚物; b）约10％至约60％的具有约95℃至约140℃的环球软化点的第一增粘树脂; c）与第一增粘树脂不同的约0％至约65％的第二增粘树脂; d）约5％至约50％的增塑剂; e）约1％至约40％重量的二级聚合物，其为半结晶聚合物或具有大于30焦耳/克的熔解焓的蜡; f）约0.1％至约5％的稳定剂或抗氧化剂; 其中组分总计为组合物重量的100％，组合物的粘度在163℃（325°F）下等于或小于约20,000厘泊（cP）。

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