公开(公告)号：US20080035371A1

公开(公告)日：2008-02-14

申请号：US11882814

申请日：2007-08-06

Applicant: Uei-Ming Jow ,  Min-Lin Lee ,  Shinn-Juh Lai ,  Chin-Sun Shyu ,  Chang-Sheng Chen ,  Ying-Jiunn Lai

Inventor： Uei-Ming Jow ,  Min-Lin Lee ,  Shinn-Juh Lai ,  Chin-Sun Shyu ,  Chang-Sheng Chen ,  Ying-Jiunn Lai

IPC: H05K1/16 ,  G01R31/28

CPC classification number: G01R31/2818 ,  G01R31/2813 ,  G01R31/2839 ,  H05K1/0268 ,  H05K1/0298 ,  H05K1/16 ,  H05K3/46 ,  H05K2203/162 ,  Y10T29/49004

Abstract: A circuit board with embedded components includes a plurality of embedded components and at least one transmission line electrically connected to at least one of the embedded components and having a terminal circuit. Therefore, a measuring device is used to be electrically connected to the transmission line and send out a signal, so as to receive a corresponding reflected signal, and then, compare the received reflected signal with a signal pattern in the database to obtain an electrical parameter of the embedded component.

Abstract translation: 具有嵌入式组件的电路板包括多个嵌入式组件和至少一个电连接到至少一个嵌入式组件并具有终端电路的传输线。 因此，使用测量装置电连接到传输线并发出信号以接收对应的反射信号，然后将接收的反射信号与数据库中的信号模式进行比较，以获得电参数 的嵌入式组件。

公开(公告)号：US07308377B2

公开(公告)日：2007-12-11

申请号：US11591381

申请日：2006-11-01

Applicant: Uei-Ming Jow ,  Chin-Sun Shyu ,  Chang-Sheng Chen ,  Min-Lin Lee ,  Shinn-Juh Lai

Inventor： Uei-Ming Jow ,  Chin-Sun Shyu ,  Chang-Sheng Chen ,  Min-Lin Lee ,  Shinn-Juh Lai

IPC: G01V1/00

CPC classification number: G01R31/2818 ,  G01R31/2805 ,  G01R31/304

Abstract: A test method of an embedded capacitor and test system thereof are provided. The method and system are used to determine an electrical specification of the embedded capacitive component in a circuit board substrate, thereby avoiding executing a follow-up fabricating process for the circuit board substrate not satisfying the desired specification. In the method and system, a geometric size of the embedded capacitor is measured, and a relation value between the electrical parameter and the geometric size and a standard electrical parameter are obtained from a model database, to calculate the electrical parameter of the embedded capacitor. Then, the electrical parameter of the embedded capacitor is compared with the standard electrical parameter, to obtain an error value. Therefore, according to the error value, it may be acquired whether or not the circuit board substrate satisfies set electrical specifications.

公开(公告)号：US06717071B2

公开(公告)日：2004-04-06

申请号：US09809310

申请日：2001-03-16

Applicant: Huey-Ru Chang ,  Min-Lin Lee ,  Ted C. Ho

Inventor： Huey-Ru Chang ,  Min-Lin Lee ,  Ted C. Ho

IPC: H05K111

CPC classification number: H05K1/0222 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2223/6622 ,  H01L2224/16 ,  H05K1/115 ,  H05K1/141 ,  H05K1/162 ,  H05K1/167 ,  H05K3/4069 ,  H05K3/429 ,  H05K2201/09809 ,  H05K2201/10378 ,  H05K2201/10689

Abstract: A coaxial via hole structure used in a carrier is disclosed. The coaxial via hole includes an outer cylinder-shaped conductor, an inner cylinder-shaped conductor and an intermediate fill. The outer cylinder-shaped conductor extends along a first direction. The inner cylinder-shaped conductor is disposed in the outer cylinder-shaped conductor and also extends along the first direction. The intermediate fill is between the outer cylinder-shaped conductor and the inner cylinder-shaped conductor and is made of insulating material or electrical-resistant material. The coaxial via hole structure can be applied as a capacitor or a resistor and has the function of signal shielding.

Abstract translation: 公开了一种在载体中使用的同轴通孔结构。 同轴通孔包括外筒形导体，内圆柱形导体和中间填充物。 外筒形导体沿着第一方向延伸。 内筒形导体设置在外筒状导体中，并且也沿着第一方向延伸。 中间填料位于外筒状导体与内筒状导体之间，由绝缘材料或耐电材料构成。 同轴通孔结构可以作为电容器或电阻器使用，具有信号屏蔽功能。