公开(公告)号：US20250093717A1

公开(公告)日：2025-03-20

申请号：US18014176

申请日：2022-02-28

Applicant: BOE Technology Group Co., Ltd.

Inventor： Wei LI ,  Xiaofeng ZHANG ,  Yanqing CHEN ,  Zhao ZHANG ,  Biqi LI

IPC: G02F1/1362 ,  G02F1/1335

Abstract: Disclosed is a display panel including a first substrate which includes a first base substrate and a black matrix layer disposed on the first base substrate, and a second substrate which includes a second base substrate and multiple first signal lines disposed on the second base substrate. The black matrix layer includes multiple first body structures corresponding to the multiple first signal lines and a first compensation structure is provided on one side of at least one first body structure. In a curved surface where the first substrate is located, the first body structure and the first compensation structure extend along the second direction and are arranged along the fourth direction. An orthographic projection of any one of the first signal lines on the second substrate is located within a range of orthographic projections of a corresponding first body structure and a first compensation structure on the second substrate.

公开(公告)号：US20250006873A1

公开(公告)日：2025-01-02

申请号：US18260656

申请日：2022-06-20

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Wei LI ,  Mingxing WANG ,  Xiao ZHANG ,  Minghua XUAN ,  Can ZHANG ,  Can WANG ,  Dongliang ZHANG ,  Qian JIN ,  Xiang LI ,  Jingjing ZHANG ,  Jinfei NIU

IPC: H01L33/50 ,  H01L33/00 ,  H01L33/32 ,  H01L33/62

Abstract: A chip structure is provided. The chip structure includes: a chip wafer unit and a color conversion layer unit arranged on a light-exit side of the chip wafer unit. The chip wafer unit includes a plurality of sub-pixel light-emitting function layers. The color conversion layer unit includes color conversion layers arranged on the light-exit side of the chip wafer unit. The chip structure further includes: an attaching layer, arranged between the chip wafer unit and the color conversion layer unit and configured to attach the chip wafer unit and the color conversion layer unit.

公开(公告)号：US20240413274A1

公开(公告)日：2024-12-12

申请号：US18261680

申请日：2022-05-31

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Wei LI ,  Mingxing WANG ,  Qian SUN ,  Huajie YAN ,  Zhiqiang JIAO ,  Xuan LIANG ,  Qian JIN ,  Xiang LI ,  Can WANG ,  Minghua XUAN ,  Can ZHANG

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/00 ,  H01L33/06 ,  H01L33/32 ,  H01L33/56

Abstract: A chip structure is provided. The chip structure includes a chip wafer unit and a color conversion layer substrate unit arranged on a light-exit side of the chip wafer unit. The chip wafer unit includes a plurality of sub-pixel light-emitting functional layers. The color conversion layer substrate unit includes a color conversion layer arranged on the light-exit side of the chip wafer unit. The chip wafer unit further includes a first bonding layer, arranged between the sub-pixel light-emitting functional layers and the color conversion layer, and configured to bond the chip wafer unit and the color conversion layer substrate unit.

公开(公告)号：US20240284711A1

公开(公告)日：2024-08-22

申请号：US18018563

申请日：2022-02-23

Applicant: Beijing BOE Display Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

Inventor： Ning CONG ,  Can ZHANG ,  Minghua XUAN ,  Jinfei NIU ,  Can WANG ,  Wei LI ,  Jingjing ZHANG ,  Xiaochuan CHEN

IPC: H10K59/121 ,  H10K59/12

CPC classification number: H10K59/1216 ,  H10K59/1201

Abstract: A display substrate, a preparation method therefor, and a display device. A display substrate includes a plurality of conductive layers disposed on a silicon-based substrate (101), a conductive layer includes a first sub-electrode plate (110) and a second sub-electrode plate (120), the first sub-electrode plate (110) and the second sub-electrode plate (120) form a first storage capacitor of a MOM capacitance structure, and another conductive layer comprises a third sub-electrode plate (130) and a fourth sub-electrode plate (140), the third sub-electrode plate (130) and the fourth sub-electrode plate (140) form a second storage capacitor of a MOM capacitance structure; the first sub-electrode plate (110) and the fourth sub-electrode plate (140) constitute a third storage capacitor of a MIM capacitance structure, and/or the second sub-electrode plate (120) and the third sub-electrode plate (130) constitute a fourth storage capacitor of a MIM capacitance structure.

公开(公告)号：US20240251322A1

公开(公告)日：2024-07-25

申请号：US17917946

申请日：2021-12-14

Applicant: BOE Technology Group Co., Ltd.

Inventor： Li HAN ,  Wei LI ,  Feng QU ,  Biqi LI

IPC: H04W36/32 ,  H04B7/185 ,  H04W36/30

CPC classification number: H04W36/32 ,  H04B7/18541 ,  H04W36/30

Abstract: Disclosed is a satellite communication handover method, which includes: determining a scene where a user equipment is located according to a measurement report of the user equipment, determining a handover parameter corresponding to the scene, and sending a handover command is sent to the user equipment to instruct the user equipment to perform handover when the user equipment satisfies a first handover condition which is based on the handover parameter.

公开(公告)号：US20240170503A1

公开(公告)日：2024-05-23

申请号：US18283823

申请日：2022-10-31

Applicant: Ordos Yuansheng Optoelectronics Co., Ltd. ,  BOE Technology Group Co., Ltd.

Inventor： Haoyi XIN ,  Wei LI ,  Yanfeng LI ,  Jingjing XU ,  Min ZHANG ,  Rui FAN ,  Chenrong QIAO ,  Xiao YAN ,  Zhao LIU ,  Jing LI ,  Jianxiong FAN ,  Shangpeng LIU ,  Haidong SU

IPC: H01L27/12 ,  G02F1/1362

CPC classification number: H01L27/1248 ,  G02F1/136209 ,  G02F1/136222 ,  G02F1/136286 ,  H01L27/124

Abstract: An array substrate, a liquid crystal display panel and a display apparatus. The array substrate comprises: a substrate (10), a first insulating layer (20), a second insulating layer (30), a third insulating layer (40), a planarization layer (50), a first electrode layer (90A), a fourth insulating layer (70) and a second electrode layer (90B), the third insulating layer comprises a first interlayer insulating layer (40A), a second interlayer insulating layer (40B) and a third interlayer insulating layer (40C), which are sequentially stacked; the first interlayer insulating layer is located on the side of the second interlayer insulating layer close to the substrate (10), the third interlayer insulating layer is located on the side of the second interlayer insulating layer away from the substrate; the material of the first interlayer insulating layer and third interlayer insulating layer comprises silicon oxide, the material of the second interlayer insulating layer comprises silicon nitride.

公开(公告)号：US20240162607A1

公开(公告)日：2024-05-16

申请号：US17786213

申请日：2021-09-26

Applicant: Beijing BOE Technology Development Co., Ltd. ,  BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Zongmin LIU ,  Wei LI ,  Junwei GUO ,  Xichao FAN ,  Feng QU ,  Biqi LI

IPC: H01Q3/36 ,  H03H11/16

CPC classification number: H01Q3/36 ,  H03H11/16

Abstract: The present disclosure provides a phase shifter, a driving method for the phase shifter, and an antenna system, and belongs to the field of communication technologies. The present disclosure provides a phase shifter, including: a control module, a digital-to-analog conversion module and a phase shift structure; the control module is configured to generate a plurality of correction signals according to phase shift degrees of the phase shift structure; the digital-to-analog conversion module is configured to generate a driving signal according to the correction signals; and the phase shift structure is configured to shift a phase of a microwave signal passing therethrough according to the driving signal.

公开(公告)号：US20230413618A1

公开(公告)日：2023-12-21

申请号：US18034393

申请日：2020-12-24

Applicant: Hefei Xinsheng Optoelectronics Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

Inventor： Jingang FANG ,  Luke DING ,  Jun LIU ,  Wei LI ,  Jun CHENG

IPC: H10K59/126 ,  H10K59/12 ,  H10K71/00 ,  H10K59/131

CPC classification number: H10K59/126 ,  H10K59/131 ,  H10K71/00 ,  H10K59/1201

Abstract: Disclosed are a display panel, a manufacturing method therefor, and a display apparatus. The display panel comprises: a base substrate (10); a padding layer (20) arranged at one side of the base substrate (10); a thin film transistor structure layer (30) arranged at one side of the base substrate (10); a planar layer (40) arranged at the side of the thin film transistor structure layer (30) away from the base substrate (10); an organic electroluminescent device (50) arranged at the side of the planar layer (40) away from the base substrate (10), the organic electroluminescent device (50) comprising an anode (51), an effective light emission layer (52), and a cathode (53) in a layered arrangement; an auxiliary electrode (60) arranged on the side of the thin film transistor structure layer (30) away from the base substrate (10).

公开(公告)号：US20230163157A1

公开(公告)日：2023-05-25

申请号：US17634287

申请日：2021-03-11

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Can WANG ,  Wei LI ,  Lijun YUAN ,  Jingjing ZHANG ,  Can ZHANG ,  Jinfei NIU ,  Ning CONG ,  Minghua XUAN ,  Xiaochuan CHEN ,  Xue DONG ,  Qi QI

IPC: H01L27/15

CPC classification number: H01L27/156

Abstract: A display substrate and a display device are provided. The display substrate includes light emitting diode chips, each light emitting diode chip includes light emitting units which respectively emit light of different colors, each light emitting unit includes a first electrode, a light emitting layer, a base and a second electrode, and the base and the second electrode are respectively located at both sides of the light emitting layer. In each light emitting diode chip, the light emitting units share the base and the first electrode, the light emitting layers of the light emitting units emit light of the same color, and at least one light emitting unit further includes a first color conversion layer located at a side of the base away from the light emitting layer, so as to convert first color light emitted by the light emitting layer into second color light.

公开(公告)号：US20230133139A1

公开(公告)日：2023-05-04

申请号：US17418121

申请日：2020-12-30

Applicant: Hefei Xinsheng Optoelectronics Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

Inventor： Yang ZHANG ,  Liangchen YAN ,  Bin ZHOU ,  Qinghe WANG ,  Leilei CHENG ,  Wei LI ,  Tao SUN

IPC: H10K59/122 ,  H10K59/121 ,  H10K59/12 ,  H10K59/80

Abstract: Disclosed are a preparation method thereof, a display panel, and a display device. The drive backboard comprises: a pixel circuit disposed on a base substrate; an anode disposed on a side of the pixel circuit facing away from the base substrate and electrically connected to the pixel circuit; and a first insulating layer disposed between the base substrate and the anode; the first insulating layer is provided with a groove surrounding the pixel circuit, the anode covers the first insulating layer, and an edge of the anode extends to an inner wall of the groove.