公开(公告)号：US20120249718A1

公开(公告)日：2012-10-04

申请号：US13439147

申请日：2012-04-04

申请人： Jin-seung Sohn ,  Sang-hun Lee ,  In-kyeong Yoo ,  Eun-hyoung Cho

发明人： Jin-seung Sohn ,  Sang-hun Lee ,  In-kyeong Yoo ,  Eun-hyoung Cho

IPC分类号： B41J2/435 ,  B05D5/06 ,  G02B1/10 ,  G02B5/09 ,  G02B27/14

CPC分类号： G02B1/005 ,  G02B5/1809 ,  G02B5/1861 ,  G02B27/102 ,  G02B27/1086

摘要： A color printing paper includes a substrate having a printing region and a plurality of photonic crystal patterns formed on the printing region. The plurality of photonic crystal layer patterns have different respective optical reflection characteristics. The printing method includes selecting pixels including a plurality of photonic crystal layer patterns that express at least one of a red color, a green color, and a blue color, and changing optical reflection characteristics of at least a portion of the plurality of photonic crystal layer patterns of the selected pixels.

摘要翻译： 彩色打印纸包括具有打印区域和形成在打印区域上的多个光子晶体图案的基板。 多个光子晶体层图案具有不同的相应的光学反射特性。 打印方法包括选择包括表示红色，绿色和蓝色中的至少一种的多个光子晶体层图案的像素，以及改变多个光子晶体层的至少一部分的光学反射特性 所选像素的图案。

公开(公告)号：US07795692B2

公开(公告)日：2010-09-14

申请号：US11657587

申请日：2007-01-25

申请人： Joo-ho Lee ,  Hae-seok Park ,  Sang-hun Lee ,  Duck-hwan Kim ,  Sang-chul Sul

发明人： Joo-ho Lee ,  Hae-seok Park ,  Sang-hun Lee ,  Duck-hwan Kim ,  Sang-chul Sul

IPC分类号： H01L29/06 ,  H01L31/00

CPC分类号： H03H3/02 ,  H03H9/02118 ,  H03H9/173 ,  H03H2003/021

摘要： A resonator including a substrate, and a resonating unit having an active region that causes resonances and a non-active region that does not cause resonances, and having a first electrode, a piezoelectric film, and a second electrode layered in turn on the substrate. At least one of the first and the second electrodes is formed, so that at least a portion of a non-active region portion thereof has a thickness different from that of an active region portion thereof.

摘要翻译： 包括基板的谐振器和具有引起谐振的有源区域和不引起谐振的非有源区域的谐振单元，以及依次层叠在基板上的第一电极，压电膜和第二电极。 形成第一和第二电极中的至少一个，使得其非活性区域部分的至少一部分的厚度与其有源区域部分的厚度不同。

公开(公告)号：US07597550B2

公开(公告)日：2009-10-06

申请号：US11475182

申请日：2006-06-27

申请人： Sang-hun Lee ,  Jong-won Lee ,  Sang-bae Lee

发明人： Sang-hun Lee ,  Jong-won Lee ,  Sang-bae Lee

IPC分类号： B29C45/40

CPC分类号： B29C45/40

摘要： An molding apparatus includes a core having a recessed part corresponding to a protruding part of a molded article, an ejector pin movably provided in the core to eject the molded article, an ejector sleeve movably provided in the core to push the protruding part of the molded article, and an ejector actuating part to move the ejector pin and the ejector sleeve together to a separation position where the protruding part of the molded article is separated from the recessed portion of the core, to bring the ejector sleeve into a stop position so that the ejector sleeve does not protrude from the core, and to move the ejector pin from the separation position to a removal position where the molded article is spaced apart from the core by a predetermined distance. Accordingly, the molding apparatus is capable of preventing damage caused on an ejector sleeve.

摘要翻译： 一种成型装置，具有芯部，该芯部具有与模制品的突出部相对应的凹部，可移动地设置在芯部中以推出模制品的推出销，可移动地设置在芯中以推动模制品的突出部分的推出器套筒 物品和喷射器致动部件，以将顶出销和推出器套筒一起移动到模制品的突出部分与芯部的凹部分离的分离位置，以使顶出器套筒处于停止位置，使得 推出器套筒不从芯部突出，并且将顶出销从分离位置移动到模制品与芯部间隔预定距离的移除位置。 因此，成型设备能够防止在顶出套筒上造成的损坏。

公开(公告)号：US20090116144A1

公开(公告)日：2009-05-07

申请号：US12123492

申请日：2008-05-20

申请人： Joo-ho LEE ,  Kook-hyun Sunwoo ,  Eun-sik Kim ,  Kyoung-won Na ,  Sang-hun Lee

发明人： Joo-ho LEE ,  Kook-hyun Sunwoo ,  Eun-sik Kim ,  Kyoung-won Na ,  Sang-hun Lee

IPC分类号： G11B5/33

CPC分类号： G11B5/33 ,  G11B5/1278 ,  G11B5/17 ,  G11B5/3116 ,  G11B5/3123 ,  G11B5/3163

摘要： Provided are a perpendicular magnetic recording head and a method of manufacturing the same. The perpendicular magnetic recording head includes a main pole including a pole tip applying a recording magnetic field to a recording medium, a coil surrounding the main pole in a solenoid shape such that recording magnetic field for recording information to a recording medium is generated at the pole tip, and a return yoke forming a magnetic path for the recording magnetic field together with the main pole and surrounding a portion of the coil passing above the main pole. The number of times that the coil passes above the main pole is smaller than the number of times that the coil passes below the main pole.

摘要翻译： 提供一种垂直磁记录头及其制造方法。 垂直磁记录头包括：主极，其包括向记录介质施加记录磁场的极尖;围绕主极的螺线管形状的线圈，以便在磁极处产生记录信息到记录介质的磁场 尖端和返回磁轭与主极一起形成用于记录磁场的磁路并围绕通过主极上方的线圈的一部分。 线圈通过主极以上的次数小于线圈通过主极以下的次数。

公开(公告)号：US20050233566A1

公开(公告)日：2005-10-20

申请号：US10981417

申请日：2004-11-04

申请人： Sung-kwan Paek ,  Se-chuel Park ,  Sang-hun Lee

发明人： Sung-kwan Paek ,  Se-chuel Park ,  Sang-hun Lee

IPC分类号： C25D5/48 ,  C23C30/00 ,  C25D7/12 ,  H01L21/44 ,  H01L21/50 ,  H01L23/48 ,  H01L23/495 ,  H01L23/50

CPC分类号： H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48599 ,  H01L2224/48664 ,  H01L2224/49171 ,  H01L2224/85464 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A lead frame having a structure that can discharge hydrogen adsorbed during deposition and can reduce a galvanic potential difference between plating layers and a method of manufacturing the same are provided. The method includes forming a Ni plating layer formed of Ni or a Ni alloy on a base metal layer formed of a metal, forming a Pd plating layer formed of Pd or an Pd alloy on the Ni plating layer, heat-treating the Ni plating layer and the Pd plating layer, and forming a protective plating layer on the heat-treated Pd plating layer.

摘要翻译： 提供一种具有能够排出沉积期间吸附的氢并能够降低镀层之间的电位差的结构的引线框及其制造方法。 该方法包括在由金属形成的基底金属层上形成由Ni或Ni合金形成的Ni镀层，在Ni镀层上形成由Pd或Pd合金形成的Pd镀层，对Ni镀层进行热处理 和Pd镀层，并且在热处理的Pd镀层上形成保护镀层。

公开(公告)号：US20050184366A1

公开(公告)日：2005-08-25

申请号：US11063353

申请日：2005-02-23

申请人： Sang-hun Lee ,  Sung-kwan Paek ,  Se-chuel Park

发明人： Sang-hun Lee ,  Sung-kwan Paek ,  Se-chuel Park

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/60 ,  H01L23/495

CPC分类号： H01L23/49582 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Provided is a method for manufacturing a lead frame and a semiconductor package having a semiconductor chip for connecting to an outer board and having a base metal layer formed of iron and nickel as main elements. The method includes preparing the base metal layer of a lead frame, forming one or more plating layers on the base metal layer, mounting the semiconductor chip on the lead frame, molding the semiconductor chip and at least a portion of the lead frame, bending the lead frame to form the lead frame in a predetermined shape, and heat-treating the lead frame for forming a diffusion layer in order to protect the lead frame from corrosion.

摘要翻译： 提供了一种用于制造引线框架和半导体封装的方法，其具有用于连接到外部板并具有由铁和镍形成的基底金属层作为主要元件的半导体芯片。 该方法包括制备引线框架的母金属层，在基底金属层上形成一个或多个镀层，将半导体芯片安装在引线框架上，模制半导体芯片和引线框架的至少一部分， 引线框架以形成预定形状的引线框架，并且对引线框架进行热处理以形成扩散层，以保护引线框架免受腐蚀。