公开(公告)号：US08247247B2

公开(公告)日：2012-08-21

申请号：US12860917

申请日：2010-08-22

申请人： Chih-Ming Lai ,  Ying-Chieh Lu

发明人： Chih-Ming Lai ,  Ying-Chieh Lu

IPC分类号： H01L21/50 ,  H01L21/52 ,  H01L21/56 ,  H01L21/60 ,  H01L33/48 ,  H01L33/62 ,  H01L33/64

CPC分类号： H01L33/642 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/498 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01322 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method for manufacturing an LED module, including steps of: providing a heat conductive plate and an LED die, the heat conductive plate defining a concave groove therein; forming an electrode circuit layer on the heat conductive plate around the concave groove; plating one metal layer on a bottom of the concave groove of the heat conductive plate, and plating another metal layer on the LED die; eutectically bonding the metal layer of the heat conducting plate and the metal layer of the LED die together to form into an eutectic layer; forming electrodes on the LED die, and connecting the electrodes with the electrode circuit layer; and encapsulating the LED die in the concave groove.

摘要翻译： 一种制造LED模块的方法，包括以下步骤：提供导热板和LED管芯，所述导热板在其中限定凹槽; 在所述凹槽周围的所述导热板上形成电极电路层; 在导热板的凹槽的底部上镀覆一层金属层，并在LED芯片上镀覆另一金属层; 将导热板的金属层和LED的金属层共晶接合在一起形成共晶层; 在所述LED管芯上形成电极，并且将所述电极与所述电极电路层连接; 并将LED管芯封装在凹槽中。

公开(公告)号：US08246194B2

公开(公告)日：2012-08-21

申请号：US12768756

申请日：2010-04-28

申请人： Chih-Ming Lai

发明人： Chih-Ming Lai

IPC分类号： F21L13/00

CPC分类号： F21S9/037 ,  F21V5/02 ,  F21V7/0008 ,  F21V13/04 ,  F21W2131/103 ,  F21Y2105/00 ,  F21Y2115/10 ,  F21Y2115/15 ,  Y02B20/72

摘要： An illumination apparatus for lighting a road surface includes a light source mounted on the road surface, an electrical power storage device, a solar cell, and a transparent package. The light source includes at least one light emitting diode and an optical element optically coupled to the light emitting diode. The optical element deflects the light from the light emitting diode to opposite sides of the light source along the road surface. The included angles between the light from the optical element and the road surface are asymmetric at the opposite sides of the light source. The light source and the solar cell are encapsulated in the transparent packing.

摘要翻译： 用于照明路面的照明装置包括安装在路面上的光源，电力存储装置，太阳能电池和透明包装。 光源包括至少一个发光二极管和光耦合到发光二极管的光学元件。 光学元件将来自发光二极管的光沿路面偏转到光源的相对侧。 来自光学元件的光和路面之间的夹角在光源的相对侧是不对称的。 光源和太阳能电池被封装在透明包装中。

公开(公告)号：US08240886B2

公开(公告)日：2012-08-14

申请号：US12649545

申请日：2009-12-30

申请人： Chih-Ming Lai

发明人： Chih-Ming Lai

IPC分类号： F21V13/04 ,  F21V5/04

CPC分类号： F21V7/0016 ,  F21V5/02 ,  F21V5/04 ,  F21V5/08 ,  F21V7/005 ,  F21V7/04 ,  F21W2131/103 ,  F21Y2103/00 ,  F21Y2103/10 ,  F21Y2115/10

摘要： An illumination device for illuminating a road includes a lamp holder and a light source. The lamp holder has an inner surface and a cavity defined by the inner surface. The light source is arranged in the cavity, and light emitted from the light source is redirected by the lamp holder to establish an illuminating area on the road. The illuminating area is consisted of a first angular range and a second angular range which are located at two opposite sides of the lamp holder along a lengthwise direction of the road. The first angular range is directed at an angle Φ1 from a downward vertical line through the lamp holder, and the second angular range is directed at an angle Φ2 from the downward vertical line, wherein, Φ2>Φ1, Φ1≦45°.

摘要翻译： 用于照亮道路的照明装置包括灯座和光源。 灯座具有由内表面限定的内表面和空腔。 光源设置在空腔中，从光源发射的光被灯座重新定向，以在道路上建立照明区域。 照明区域由第一角度范围和第二角度范围组成，该第一角度范围和第二角度范围沿着道路的长度方向位于灯座的两个相对侧。 第一角度范围从与灯座的向下垂直线成角度Φ1，第二角度范围与下垂直线成角度Φ2，其中Φ2>Φ1，Φ1＆nlE; 45°。

公开(公告)号：US08220952B2

公开(公告)日：2012-07-17

申请号：US12790859

申请日：2010-05-31

申请人： Chih-Ming Lai

发明人： Chih-Ming Lai

IPC分类号： B60Q1/00 ,  B60Q1/26 ,  F21L13/00

CPC分类号： F21V29/60 ,  F21S8/083 ,  F21S9/026 ,  F21S9/043 ,  F21V29/763 ,  F21W2131/10 ,  F21Y2115/10 ,  Y02B20/72 ,  Y10S362/80

摘要： An LED lamp includes a lamp post, an illumination unit fixed on the lamp post, and a generator disposed in the lamp post and coupled to the illumination unit electrically. The lamp post defines an airflow passage along a longitudinal direction thereof. The airflow passage communicates with an outer environment. The generator is adapted for converting wind energy to electric energy, and includes a rotary turbine arranged in the airflow passage. The rotary turbine includes a hub and a plurality of blades around the hub. Each of the blades includes a top face and an opposite bottom face. The top face and the bottom face are symmetric to a plane which extends through opposite connecting edges of the top and bottom faces and is perpendicular to a rotary axis of the turbine.

摘要翻译： LED灯包括灯柱，固定在灯柱上的照明单元和设置在灯柱中并且电连接到照明单元的发生器。 灯柱沿其长度方向限定气流通道。 气流通道与外部环境连通。 发电机适用于将风能转换为电能，并包括设置在气流通道中的旋转涡轮机。 旋转涡轮机包括轮毂和围绕轮毂的多个叶片。 每个叶片包括顶面和相对的底面。 顶面和底面与延伸穿过顶面和底面的相对连接边缘并垂直于涡轮的旋转轴线的平面对称。

公开(公告)号：US20120164766A1

公开(公告)日：2012-06-28

申请号：US13050951

申请日：2011-03-18

申请人： Yung-Hui Yeh ,  Chih-Ming Lai ,  Chun-Cheng Cheng

发明人： Yung-Hui Yeh ,  Chih-Ming Lai ,  Chun-Cheng Cheng

IPC分类号： H01L33/00 ,  H01L21/336

CPC分类号： H01L27/1225 ,  H01L27/1251 ,  H01L27/3258

摘要： Methods of fabricating active device array and organic light emitting diode array are provided. A first pattern metal layer is formed over a substrate. An oxide semiconductor layer is formed entirely over the substrate. A first insulation layer covering the first patterned metal layer and the oxide semiconductor layer is formed entirely on the substrate. A second patterned metal layer is formed on the first insulation layer. The oxide semiconductor layer and the first insulation layer is patterned by using the second patterned metal layer as a mask to form a first patterned oxide semiconductor layer and a first patterned insulation layer. A second insulation layer is entirely formed on the substrate. A second patterned oxide semiconductor layer is formed over the second insulation layer. A third patterned metal layer is formed over the second insulation layer.

摘要翻译： 提供制造有源器件阵列和有机发光二极管阵列的方法。 第一图案金属层形成在衬底上。 整个衬底上形成氧化物半导体层。 覆盖第一图案化金属层和氧化物半导体层的第一绝缘层整体形成在基板上。 第二图案化金属层形成在第一绝缘层上。 通过使用第二图案化金属层作为掩模来将氧化物半导体层和第一绝缘层图案化，以形成第一图案化氧化物半导体层和第一图案化绝缘层。 在基板上完全形成第二绝缘层。 第二图案化氧化物半导体层形成在第二绝缘层上。 第三图案化金属层形成在第二绝缘层上。

公开(公告)号：USD651184S1

公开(公告)日：2011-12-27

申请号：US29361060

申请日：2010-05-05

申请人： Chih-Ming Lai ,  Ming-Young Shiao ,  Hong-Bin Yang

设计人： Chih-Ming Lai ,  Ming-Young Shiao ,  Hong-Bin Yang

公开(公告)号：US08079732B2

公开(公告)日：2011-12-20

申请号：US12489371

申请日：2009-06-22

申请人： Jui-Wen Fang ,  Zheng-Jay Huang ,  Shao-Fu Hsu ,  Shu-Hui Hsieh ,  Chih-Ming Lai

发明人： Jui-Wen Fang ,  Zheng-Jay Huang ,  Shao-Fu Hsu ,  Shu-Hui Hsieh ,  Chih-Ming Lai

IPC分类号： F21V7/04

CPC分类号： G02B6/0091 ,  F21S8/00 ,  F21Y2115/10 ,  G02B6/0068 ,  G02B6/0078 ,  G09F13/22 ,  G09F2013/222

摘要： An illuminating device includes a receiving base and at least one light source. The receiving base has at least one receiving space defined therein, and at least one fixing post is positioned adjacent to the corresponding at least one receiving space. The at least one light source is positioned in the at least one receiving space for emitting light. Each light source comprises a light-pervious plate and a LED array located on a side of the light-pervious plate. The light-pervious plate comprises at least one first through hole with the at least one fixing post extending therethrough, the light-pervious plate is fixed to the receiving base in the corresponding receiving space of the receiving base.

摘要翻译： 照明装置包括接收基座和至少一个光源。 接收基座具有限定在其中的至少一个接收空间，并且至少一个固定柱邻近相应的至少一个接收空间定位。 所述至少一个光源位于所述至少一个用于发射光的接收空间中。 每个光源包括透光板和位于透光板一侧的LED阵列。 所述透光板包括至少一个第一通孔，所述至少一个固定柱延伸穿过其中，所述透光板固定到所述接收基座的相应接收空间中的接收基座。

公开(公告)号：US08076741B2

公开(公告)日：2011-12-13

申请号：US12427758

申请日：2009-04-22

申请人： Chih-Ming Lai ,  Yung-Hui Yeh

发明人： Chih-Ming Lai ,  Yung-Hui Yeh

IPC分类号： H01L31/101 ,  H01L27/14

CPC分类号： H01L27/14667 ,  H01L27/1225 ,  H01L27/1446 ,  H01L27/14621 ,  H01L27/14632 ,  H01L29/7869

摘要： A photo sensing element array substrate is provided. The photo sensing element array substrate includes a flexible substrate and a plurality of photo sensing elements. The photo sensing elements are disposed in array on the flexible substrate. Each of the photo sensing elements includes a photo sensing thin film transistor (TFT), an oxide semiconductor TFT and a capacitor. The photo sensing TFT is disposed on the flexible substrate. The oxide semiconductor TFT is disposed on the flexible substrate. The oxide semiconductor TFT is electrically connected to the photo sensing TFT. The capacitor is disposed on the flexible substrate and electrically connected between the photo sensing TFT and the oxide semiconductor TFT. When the photo sensing element array substrate is bent, it remains unaffected from normal operation.

摘要翻译： 提供了感光元件阵列基板。 感光元件阵列基板包括柔性基板和多个感光元件。 感光元件阵列设置在柔性基板上。 每个感光元件包括感光薄膜晶体管（TFT），氧化物半导体TFT和电容器。 感光TFT设置在柔性基板上。 氧化物半导体TFT设置在柔性基板上。 氧化物半导体TFT电连接到感光TFT。 电容器设置在柔性基板上并电连接在感光TFT和氧化物半导体TFT之间。 当感光元件阵列基板弯曲时，它不会受到正常操作的影响。

公开(公告)号：US20110231804A1

公开(公告)日：2011-09-22

申请号：US13116981

申请日：2011-05-26

申请人： Ru-Gun Liu ,  Chih-Ming Lai ,  Wen-Chun Huang ,  Boren Luo ,  I-Chang Shin ,  Yao-Ching Ku ,  Cliff Hou

发明人： Ru-Gun Liu ,  Chih-Ming Lai ,  Wen-Chun Huang ,  Boren Luo ,  I-Chang Shin ,  Yao-Ching Ku ,  Cliff Hou

IPC分类号： G06F17/50

CPC分类号： G06F17/50

摘要： Methods and systems for providing processing parameters in a secure format are disclosed. In one aspect, a method for providing semiconductor fabrication processing parameters to a design facility is disclosed. The method comprises providing a set of processing parameters of a fabrication facility; creating a model from the set of processing parameters; converting the model into a corresponding set of kernels; converting the set of kernels into a corresponding set of matrices; and communicating the set of matrices to the design facility. In another aspect, a method for providing semiconductor fabrication processing parameters is disclosed. The method comprises providing a set of processing parameters of a fabrication facility; creating a processing model from the set of processing parameters; encrypting the processing model into a format for use with a plurality of EDA tools; and communicating the encrypted processing model format to a design facility.

摘要翻译： 公开了以安全格式提供处理参数的方法和系统。 一方面，公开了一种向设计设备提供半导体制造处理参数的方法。 该方法包括提供制造设施的一组处理参数; 从一组处理参数创建模型; 将模型转换为相应的一组内核; 将所述内核集合转换成相应的矩阵集合; 并将该组矩阵传送到设计设施。 另一方面，公开了一种用于提供半导体制造处理参数的方法。 该方法包括提供制造设施的一组处理参数; 从一组处理参数创建一个处理模型; 将处理模型加密成与多个EDA工具一起使用的格式; 并将加密的处理模型格式传送到设计设施。

公开(公告)号：US08011947B2

公开(公告)日：2011-09-06

申请号：US12539999

申请日：2009-08-12

申请人： Chih-Ming Lai ,  Yung-Shun Kao

发明人： Chih-Ming Lai ,  Yung-Shun Kao

IPC分类号： H01R13/627

CPC分类号： H01R13/6272

摘要： A high definition multimedia interface (HDMI) assembly for providing an electrical connection between two electronic devices includes an HDMI port and an HDMI plug. The HDMI port includes a first connection element and a pin portion. The HDMI plug includes a second connection element. The first connection element is pivotably disposed on the HDMI port and includes a hook, and the pin portion is connected to the HDMI port for providing connection between the HDMI port and one of the electronic devices. When the HDMI plug is connected to the HDMI port, the second connection element and the first connection element contact with each other and the hook hooks the HDMI plug.

摘要翻译： 用于在两个电子设备之间提供电连接的高分辨率多媒体接口（HDMI）组件包括HDMI端口和HDMI插头。 HDMI端口包括第一连接元件和引脚部分。 HDMI插头包括第二连接元件。 第一连接元件可枢转地设置在HDMI端口上并且包括钩子，并且该引脚部分连接到HDMI端口，用于提供HDMI端口与电子设备之一之间的连接。 当HDMI插头连接到HDMI端口时，第二连接元件和第一连接元件彼此接触，并且挂钩钩住HDMI插头。