公开(公告)号：US20200030614A1

公开(公告)日：2020-01-30

申请号：US16589752

申请日：2019-10-01

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Keith W. Seitz ,  Thomas Marzano ,  Marc Gregory Martino

IPC: A61N1/375 ,  A61N1/05 ,  H01G4/40 ,  H01G4/005 ,  A61N1/08 ,  H01R43/00 ,  C22C29/12 ,  H02G3/22 ,  H01G4/30 ,  B23K35/30 ,  H01G2/10 ,  H01G4/35 ,  H01R13/52 ,  H01G4/236 ,  B23K35/32 ,  H01R4/02 ,  H01R13/719 ,  B23K35/02

Abstract: A hermetically sealed filtered feedthrough assembly attachable to an AIMD includes an insulator hermetically sealing the opening of a ferrule with a gold braze. The ferrule includes a peninsula extending into the ferrule opening and the insulator has a cutout matching the peninsula. A sintered platinum-containing paste hermetically seals at least one via hole extending through the insulator. At least one capacitor is disposed on the device side. An active electrical connection electrically connects the capacitor active metallization to the sintered paste. A ground electrical connection electrically connects the capacitor ground metallization disposed within a capacitor ground passageway to the portion of the gold braze along the ferrule peninsula. The dielectric of the capacitor may be less than 1,000 k.

公开(公告)号：US20190255319A1

公开(公告)日：2019-08-22

申请号：US16391801

申请日：2019-04-23

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Thomas Marzano ,  Keith W. Seitz ,  Marc Gregory Martino

IPC: A61N1/08 ,  A61N1/375 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35

Abstract: A filtered feedthrough assembly for an active implantable medical device (AIMD) includes an insulator hermetically sealed to an opening of an electrically conductive ferrule. A ceramic reinforced metal composite of platinum and alumina (CRMC) material is disposed in an insulator via hole surrounding a substantially pure platinum fill. A capacitor disposed on the insulator device side has a capacitor dielectric with a dielectric constant k that is greater than 0 and less than 1000. Coming from the body fluid side to the device side of the AIMD, the capacitor is the first filter capacitor electrically connected to the substantially pure platinum fill. An active electrical connection electrically connects the substantially pure platinum fill to the capacitor active metallization. A ground electrical connection electrically connects the capacitor ground metallization to the ferrule and subsequently to the housing of the AIMD

公开(公告)号：US20190001123A1

公开(公告)日：2019-01-03

申请号：US16121716

申请日：2018-09-05

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Thomas Marzano ,  Keith W. Seitz ,  Marc Gregory Martino

IPC: A61N1/08 ,  H01G4/005 ,  A61N1/37 ,  H01G4/35 ,  H01G4/30 ,  H01G4/12 ,  A61N1/375 ,  H03H1/00

Abstract: A hermetically sealed filtered feedthrough assembly includes an electrically conductive ferrule sealed by a first gold braze to an insulator disposed at least partially within a ferrule opening. A conductive wire is disposed within a via hole disposed through the insulator extending from a body fluid side to a device side. A second gold braze hermetically seals the conductive leadwire to the via hole. A capacitor is disposed on the device side having a capacitor dielectric body with a dielectric constant k that is greater than 0 and less than 1000. The capacitor is the first filter capacitor electrically connected to the conductive leadwire coming from the body fluid side into the device side. An active electrical connection electrically connects the conductive leadwire to the capacitor active metallization. A ground electrical connection electrically connects the capacitor ground metallization to the ferrule and housing of the active implantable medical device.

公开(公告)号：US10046166B2

公开(公告)日：2018-08-14

申请号：US15164945

申请日：2016-05-26

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Thomas Marzano ,  Keith W. Seitz ,  Christine A. Frysz

IPC: H01G4/35 ,  A61N1/375 ,  H01G4/12 ,  H01G4/40 ,  H05K1/11 ,  H05K1/09 ,  H05K5/06 ,  H05K1/03 ,  H05K3/40 ,  A61N1/05 ,  A61N1/08 ,  H01G2/10 ,  H01G4/005 ,  H01R43/00 ,  A61N1/372 ,  C22C29/12 ,  C22C32/00

Abstract: A hermetically sealed feedthrough filter assembly is attachable to an active implantable medical device and includes an insulator substrate assembly and a feedthrough filter capacitor disposed on a device side. A conductive leadwire has a proximal leadwire end extending to a distal leadwire end, wherein the proximal leadwire end is connectable to electronics internal to the AIMD. The distal leadwire end is disposed at least partially through a first passageway of the feedthrough filter capacitor and is in contact with, adjacent to or near a device side conductive fill. A first electrically conductive material makes a three-way electrically connection that electrically connects the device side conductive fill to an internal metallization of the feedthrough filter capacitor and to the distal leadwire end. A second electrically conductive material electrically connects an external metallization of the feedthrough filter capacitor to a ferrule or an AIMD housing.

公开(公告)号：US20180178017A1

公开(公告)日：2018-06-28

申请号：US15894239

申请日：2018-02-12

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Xiaohong Tang ,  William C. Thiebolt ,  Christine A. Frysz ,  Keith W. Seitz ,  Richard L. Brendel ,  Thomas Marzano ,  Jason Woods ,  Dominick J. Frustaci ,  Steven W. Winn

IPC: A61N1/375 ,  A61N1/05 ,  H01G2/10 ,  H01G4/35

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/372 ,  A61N1/375 ,  B22F2998/10 ,  C22C29/12 ,  H01G2/103 ,  H01G4/35 ,  H01R43/00 ,  Y10T156/1052 ,  B22F1/0059 ,  B22F3/10

Abstract: A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.

公开(公告)号：US20180178016A1

公开(公告)日：2018-06-28

申请号：US15844683

申请日：2017-12-18

Applicant: Greatbatch Ltd.

Inventor： Dominick J. Frustaci ,  Keith W. Seitz ,  Thomas Marzano ,  Robert A. Stevenson ,  Christine A. Frysz ,  Richard L. Brendel ,  Jason Woods

IPC: A61N1/375 ,  H01G4/35 ,  H01R13/7195 ,  H01G2/22 ,  H05K1/02 ,  A61N1/05 ,  H01G2/10 ,  A61N1/08 ,  H01G4/40

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  H01G2/103 ,  H01G2/22 ,  H01G4/35 ,  H01G4/40 ,  H01R13/7195 ,  H01R2201/12 ,  H05K1/0231 ,  H05K2201/10015 ,  H05K2201/10189 ,  H05K2201/10303

Abstract: A hermetically sealed feedthrough subassembly attachable to an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first conductive leadwire first end disposed past a device side of an insulator body. A feedthrough filter capacitor is disposed on the device side. A second conductive leadwire is disposed on the device side having a second conductive leadwire first end at least partially disposed within a first passageway of the feedthrough filter capacitor and having a second conductive leadwire second end disposed past the feedthrough filter capacitor configured to be connectable to AIMD internal electronics. The second conductive leadwire first end is at, near or adjacent to the first conductive leadwire first end. A first electrically conductive material forms a three-way electrical connection electrically connecting the second conductive leadwire first end, the first conductive leadwire first end and a capacitor internal metallization.

公开(公告)号：US09757558B2

公开(公告)日：2017-09-12

申请号：US14688302

申请日：2015-04-16

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Robert Shawn Johnson ,  Warren S. Dabney ,  Thomas Marzano ,  Richard L. Brendel ,  Christopher Michael Williams ,  Holly Noelle Moschiano ,  Keith W. Seitz ,  John E. Roberts

IPC: A61N1/08 ,  A61N1/375 ,  A61N1/37 ,  H01G4/35 ,  H01G4/30 ,  H01G4/12 ,  H01G4/005 ,  H03H1/00

CPC classification number: A61N1/08 ,  A61N1/086 ,  A61N1/3718 ,  A61N1/3754 ,  A61N1/3758 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H03H1/0007

Abstract: An AIMD includes a conductive housing, an electrically conductive ferrule with an insulator hermetically sealing the ferrule opening. A conductive pathway is hermetically sealed and disposed through the insulator. A filter capacitor is disposed within the housing and has a dielectric body supporting at least two active and two ground electrode plates interleaved, wherein the at least two active electrode plates are electrically connected to the conductive pathway on the device side, and the at least two ground electrode plates are electrically coupled to either the ferrule and/or the conductive housing. The dielectric body has a dielectric constant less than 1000 and a capacitance of between 10 and 20,000 picofarads. The filter capacitor is configured for EMI filtering of MRI high RF pulsed power by a low ESR, wherein the ESR of the filter capacitor at an MRI RF pulsed frequency or range of frequencies is less than 2.0 ohms.

公开(公告)号：US09463329B2

公开(公告)日：2016-10-11

申请号：US14556239

申请日：2014-12-01

Applicant: Greatbatch Ltd.

Inventor： Christine A. Frysz ,  Robert A. Stevenson ,  Thomas Marzano ,  Xiaohong Tang ,  William C. Thiebolt ,  Keith W. Seitz

IPC: A61N1/00 ,  A61N1/39 ,  A61N1/362 ,  A61N1/08

CPC classification number: A61N1/3968 ,  A61N1/086 ,  A61N1/362 ,  A61N1/3718 ,  A61N1/3754 ,  H03H1/00 ,  H03H7/0107 ,  H03H7/1758 ,  H03H7/1766 ,  H03H2001/0042 ,  H03H2001/005 ,  H03H2001/0085 ,  H03H2007/013

Abstract: A hermetic terminal assembly for an AIMD includes a shielded three-terminal flat-through EMI energy dissipating filter and a hermetically sealed feedthrough configured to be attachable to the ferrule or AIMD housing. The flat-through filter includes a first shield plate, an active electrode plate, and a second shield plate where the shield plates are electrically coupled to a metallization which in turn is coupled either to the ferrule or AIMD housing. The feedthrough includes an alumina substrate comprised of at least 96% alumina and a via hole with a substantially closed pore and substantially pure platinum fill. The platinum fill forms a tortuous and mutually conformal knitline or interface between the alumina substrate and the platinum fill, wherein the platinum fill is electrically coupled to at least one active electrode plate in non-conductive relationship to the at least one first and second shield plates.

Abstract translation: 用于AIMD的密封端子组件包括屏蔽的三端子平通EMI消散滤波器和被配置为可附接到套圈或AIMD壳体的密封馈通。 平通过滤器包括第一屏蔽板，有源电极板和第二屏蔽板，其中屏蔽板电耦合到金属化，金属化层又连接到套圈或AIMD壳体。 馈通包括由至少96％的氧化铝组成的氧化铝衬底和具有基本上闭孔的通孔和基本上纯的铂填充物。 铂填充物在氧化铝基底和铂填充物之间形成曲折且相互共形的编织物或界面，其中铂填充物与非至少一个第一和第二屏蔽板的非导电关系电耦合到至少一个有源电极板 。

公开(公告)号：US09352150B2

公开(公告)日：2016-05-31

申请号：US14864959

申请日：2015-09-25

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Thomas Marzano ,  Keith W. Seitz ,  Steven W. Winn ,  Christine A. Frysz ,  Richard L. Brendel ,  Jason Woods ,  Dominick J. Frustaci ,  Xiaohong Tang ,  William C. Thiebolt

IPC: H01G4/35 ,  A61N1/375 ,  A61N1/08 ,  A61N1/05 ,  H01G2/10 ,  H01R43/00 ,  H01G4/005 ,  H01G4/12 ,  H01G4/40 ,  H02G3/22 ,  A61N1/372 ,  C22C29/12

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

Abstract: A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.

公开(公告)号：US20150314131A1

公开(公告)日：2015-11-05

申请号：US14797123

申请日：2015-07-11

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Xiaohong Tang ,  William C. Thiebolt ,  Christine A. Frysz ,  Keith W. Seitz ,  Richard L. Brendel ,  Thomas Marzano ,  Jason Woods ,  Dominick J. Frustaci ,  Steven W. Winn

IPC: A61N1/375 ,  H01G2/10 ,  H01G4/35

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/372 ,  A61N1/375 ,  B22F2998/10 ,  C22C29/12 ,  H01G2/103 ,  H01G4/35 ,  H01R43/00 ,  Y10T156/1052 ,  B22F1/0059 ,  B22F3/10

Abstract: A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.

Abstract translation: 用于附接到有源可植入医疗装置的气密密封馈通包括构造成气密地密封到套圈或AIMD壳体的电介质衬底。 通孔通过电介质基板从体液侧设置到器件侧。 导电填料设置在通孔内，形成在体液侧和装置侧之间经过导电的填充通孔。 导电插入件至少部分地设置在导电填充物内。 然后，导电填充物和导电插入物与电介质基底共烧，以在体液侧和器件侧之间形成通过电介质基片的气密密封和导电通路。