公开(公告)号：US11569405B2

公开(公告)日：2023-01-31

申请号：US16686973

申请日：2019-11-18

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Steven M. Shank ,  Vibhor Jain ,  Anthony K. Stamper ,  John J. Ellis-Monaghan ,  John J. Pekarik

IPC: H01L31/103 ,  H01L31/18 ,  H01L31/028

Abstract: Structures including a photodetector and methods of fabricating such structures. The photodetector is positioned over the top surface of the substrate. The photodetector includes a portion of a semiconductor layer comprised of a semiconductor alloy, a p-type doped region in the portion of the semiconductor layer, and an n-type doped region in the portion of the semiconductor layer. The p-type doped region and the n-type doped region converge along a p-n junction. The portion of the semiconductor layer has a first side and a second side opposite from the first side. The semiconductor alloy has a composition that is laterally graded from the first side to the second side of the portion of the semiconductor layer.

公开(公告)号：US11545548B1

公开(公告)日：2023-01-03

申请号：US17361848

申请日：2021-06-29

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Steven M. Shank ,  Anthony K. Stamper ,  Venkata N. R. Vanukuru

IPC: H01L29/76 ,  H01L29/94 ,  H01L31/062 ,  H01L29/06 ,  H01L27/118 ,  H01L21/762 ,  H01L27/088

Abstract: Structures for a semiconductor device including airgap isolation and methods of forming a semiconductor device structure that includes airgap isolation. The structure includes a trench isolation region, an active region of semiconductor material surrounded by the trench isolation region, and a field-effect transistor including a gate within the active region. The structure further includes a dielectric layer over the field-effect transistor, a first gate contact coupled to the gate, and a second gate contact coupled to the gate. The first and second gate contacts are positioned in the dielectric layer over the active region, and the second gate contact is spaced along a longitudinal axis of the gate from the first gate contact. The structure further includes an airgap including a portion positioned in the dielectric layer over the gate between the first and second gate contacts.

公开(公告)号：US20220416020A1

公开(公告)日：2022-12-29

申请号：US17361848

申请日：2021-06-29

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Steven M. Shank ,  Anthony K. Stamper ,  Venkata N.R. Vanukuru

IPC: H01L29/06 ,  H01L27/118 ,  H01L27/088 ,  H01L21/762

Abstract: Structures for a semiconductor device including airgap isolation and methods of forming a semiconductor device structure that includes airgap isolation. The structure includes a trench isolation region, an active region of semiconductor material surrounded by the trench isolation region, and a field-effect transistor including a gate within the active region. The structure further includes a dielectric layer over the field-effect transistor, a first gate contact coupled to the gate, and a second gate contact coupled to the gate. The first and second gate contacts are positioned in the dielectric layer over the active region, and the second gate contact is spaced along a longitudinal axis of the gate from the first gate contact. The structure further includes an airgap including a portion positioned in the dielectric layer over the gate between the first and second gate contacts.

公开(公告)号：US20220223688A1

公开(公告)日：2022-07-14

申请号：US17684498

申请日：2022-03-02

Applicant: GlobalFoundries U.S. INC.

Inventor： Steven M. Shank ,  Anthony K. Stamper ,  Vibhor Jain ,  John J. Ellis-Monaghan

IPC: H01L29/08 ,  H01L29/78

Abstract: The disclosure provides a field effect transistor (FET) stack with methods to form the same. The FET stack includes a first transistor over a substrate. The first transistor includes a first active semiconductor material including a first channel region between a first set of source/drain terminals, and a first gate structure over the first channel region. The first gate structure includes a first gate insulator of a first thickness above the first channel region. A second transistor is over the substrate and horizontally separated from the first transistor. A second gate structure of the second transistor may include a second gate insulator of a second thickness above a second channel region, the second thickness being greater than the first thickness. A shared gate node may be coupled to each of the first gate structure and the second gate structure.

公开(公告)号：US11322357B2

公开(公告)日：2022-05-03

申请号：US16806383

申请日：2020-03-02

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Siva P. Adusumilli ,  Anthony K. Stamper ,  Michel J. Abou-Khalil ,  John J. Ellis-Monaghan ,  Bojidha Babu

IPC: H01L21/265 ,  H01L21/762 ,  H01L21/324 ,  H01L29/04

Abstract: Structures including electrical isolation and methods of forming a structure including electrical isolation. A first polycrystalline layer is located in a substrate, and a second polycrystalline layer is positioned between the first polycrystalline layer and a top surface of the substrate. The substrate includes a first portion of the single-crystal semiconductor material that is positioned between the second polycrystalline layer and the top surface of the substrate. The substrate includes a second portion of the single-crystal semiconductor material that is positioned between the first polycrystalline layer and the second polycrystalline layer. The first polycrystalline layer has a thickness. The second polycrystalline layer has a portion with a thickness that is greater than the thickness of the first polycrystalline layer.

公开(公告)号：US11282883B2

公开(公告)日：2022-03-22

申请号：US16713423

申请日：2019-12-13

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： John J. Ellis-Monaghan ,  Steven M. Shank ,  Vibhor Jain ,  Anthony K. Stamper ,  John J. Pekarik

IPC: H01L31/113 ,  H01L27/146

Abstract: Structures including a photodiode and methods of fabricating such structures. A trench extends from a top surface of a substrate to a depth into the substrate. The photodiode includes an active layer positioned in the trench. Trench isolation regions, which are located in the substrate, are arranged to surround the trench. A portion of the substrate is positioned in a surrounding relationship about the active layer and between the active layer and the trench isolation regions.

公开(公告)号：US11271079B2

公开(公告)日：2022-03-08

申请号：US16743584

申请日：2020-01-15

Applicant: GLOBALFOUNDRIES U.S. INC.

Inventor： Anthony K. Stamper ,  Steven M. Shank ,  John J. Pekarik ,  Vibhor Jain ,  John J. Ellis-Monaghan

IPC: H01L29/16 ,  H01L21/02 ,  H01L27/12 ,  H01L21/762

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a wafer with crystalline silicon and trap rich polysilicon layer and methods of manufacture. The structure includes: semiconductor-on-insulator (SOI) wafer composed of a lower crystalline semiconductor layer, a polysilicon layer over the lower crystalline semiconductor layer, an upper crystalline semiconductor layer over the polysilicon layer, a buried insulator layer over the upper crystalline semiconductor layer, and a top crystalline semiconductor layer over the buried insulator layer.

公开(公告)号：US11195715B2

公开(公告)日：2021-12-07

申请号：US16821228

申请日：2020-03-17

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Siva P. Adusumilli ,  Cameron Luce ,  Ramsey Hazbun ,  Mark Levy ,  Anthony K. Stamper ,  Alvin J. Joseph

IPC: H01L21/02 ,  H01L21/762 ,  H01L21/324

Abstract: Methods of forming structures with electrical isolation. A dielectric layer is formed over a semiconductor substrate, openings are patterned in the dielectric layer that extend to the semiconductor substrate, and a semiconductor material is epitaxially grown from portions of the semiconductor substrate that are respectively exposed inside the openings. The semiconductor material, during growth, defines a semiconductor layer that includes first portions respectively coincident with the openings and second portions that laterally grow from the first portions to merge over a top surface of the dielectric layer. A modified layer containing a trap-rich semiconductor material is formed in the semiconductor substrate.

公开(公告)号：US11177345B1

公开(公告)日：2021-11-16

申请号：US16893855

申请日：2020-06-05

Applicant: GLOBALFOUNDRIES U.S. INC.

Inventor： Henry L. Aldridge, Jr. ,  Anthony K. Stamper ,  Jeonghyun Hwang ,  Johnatan A. Kantarovsky

IPC: H01L29/08 ,  H01L29/66 ,  H01L29/417 ,  H01L29/737

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to heterojunction bipolar transistors and methods of manufacture. The structure includes: a first semiconductor layer including a device region; a second semiconductor layer under the first semiconductor layer; a layer of conductive material between the first semiconductor layer and the second semiconductor layer; at least one contact extending to and contacting the layer of conductive material; and a device in the device region above the layer of conductive material.

公开(公告)号：US11158535B2

公开(公告)日：2021-10-26

申请号：US16598064

申请日：2019-10-10

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Steven M. Shank ,  Anthony K. Stamper ,  Siva P. Adusumilli ,  Ian McCallum-Cook ,  Michel J. Abou-Khalil

IPC: H01L29/04 ,  H01L29/32 ,  H01L21/265 ,  H01L21/763 ,  H01L29/06 ,  H01L21/324 ,  H01L21/762 ,  H01L29/36 ,  H01L29/10

Abstract: Semiconductor structures including electrical isolation and methods of forming a semiconductor structure including electrical isolation. Shallow trench isolation regions extend from a top surface of a semiconductor substrate into the semiconductor substrate. The semiconductor substrate contains single-crystal semiconductor material, and the shallow trench isolation regions are positioned to surround an active device region of the semiconductor substrate. A polycrystalline layer is formed in the semiconductor substrate. The polycrystalline layer has a first section beneath the active device region and a second section beneath the plurality of shallow trench isolation regions. The first section of the polycrystalline layer is located at a different depth relative to the top surface of the semiconductor substrate than the second section of the polycrystalline layer.