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公开(公告)号:US20220112610A1
公开(公告)日:2022-04-14
申请号:US17425122
申请日:2019-04-05
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Kuan-Ting Wu , Chi Hao Chang , Hsing Hung Hsieh
Abstract: The present disclosure is drawn to covers for electronic devices, methods of making the covers, and electronic devices. In one example, a cover for an electronic device comprising: a metal cover substrate having at least a top surface and a bottom surface; a transparent passivation layer on the top surface of the metal cover substrate; a water-borne graphene coating layer on the transparent passivation layer; and an electrophoretic deposition coating layer on the water-borne graphene coating layer.
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公开(公告)号:US11281257B2
公开(公告)日:2022-03-22
申请号:US16481465
申请日:2017-12-14
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Kuan-Ting Wu , Wei-Chung Chen , Chien-Ting Lin
Abstract: In example implementations, a housing is provided. The housing includes a display housing portion, an input housing portion, and an energy absorbing material that is inserted along an edge of the input housing portion. The input housing portion is movably coupled to the display portion. A top surface of the energy absorbing material lies on a same plane as a top surface of the input housing portion.
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公开(公告)号:US20220007533A1
公开(公告)日:2022-01-06
申请号:US17054562
申请日:2019-03-28
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Kuan-Ting Wu , Chi Hao Chang , Chalam Kashyap
Abstract: The present disclosure is drawn to covers for electronic devices, methods of making the covers, and electronic devices. In one example, a cover for an electronic device comprising: a metal cover substrate; a micro-arc oxidation layer or a non-transparent passivation treatment layer on a surface of the metal cover substrate; an outmold decoration layer on the micro-arc oxidation layer or the non-transparent passivation treatment layer, a chamfered edge including a chamfer at an edge of the metal cover substrate, wherein the chamfer cuts through the micro-arc oxidation layer or the non-transparent passivation treatment layer and the outmold decoration layer to expose the metal cover substrate at the chamfered edge; a transparent passivation layer on the chamfered edge where the metal cover substrate is exposed; and a protective coating on the transparent passivation layer.
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公开(公告)号:US20210363654A1
公开(公告)日:2021-11-25
申请号:US16978733
申请日:2018-06-22
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Kuan-Ting Wu , Ya-Ting Yeh , Chih-Hsiung Liao
IPC: C25D11/24 , C09D5/00 , C09D7/20 , C09D183/04 , C25D11/26 , C25D11/30 , C25D11/34 , C25D11/18 , H05K5/04
Abstract: The present subject matter relates to Nickel-free (Ni-free) sealing of anodized metal substrates. In an example mentation of the present subject matter, an anodized metal substrate is disposed with a first layer of a Ni-free sealing material over a surface of the anodized metal substrate. Further, a second layer of a second sealing material is disposed atop the first layer to sandwich the first layer of Ni-free sealing material between the surface of the anodized metal substrate and the second layer, to form a sealed metal substrate.
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公开(公告)号:US20210363646A1
公开(公告)日:2021-11-25
申请号:US16982694
申请日:2018-07-24
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Chi Hao Chang , Ya-Ting Yeh , Kuan-Ting Wu , Chih-Hsiung Liao
Abstract: The application discloses examples of a device housing of an electronic device comprising a magnesium-alloy substrate. The device housing further comprising a treatment layer applied over the magnesium-alloy substrate and a metallic coating layer applied over the treatment layer to provide a metallic luster. Further, a paint coating layer is disposed over a first portion of the metallic coating layer. Further, a top coating layer is applied over the paint coating layer and a visible second portion of the metallic coating layer.
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公开(公告)号:US20210325935A1
公开(公告)日:2021-10-21
申请号:US16481854
申请日:2018-02-08
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Wei-Chung Chen , Kuan-Ting Wu
Abstract: In an example, a device includes a base unit, a cover unit, and a hinge assembly to couple the cover unit to the base unit The hinge assembly is moveable between a folded position and an unfolded position. The hinge assembly includes a channel, an annular holder disposed in the channel, a shaft engaged with the annular holder, and a hydraulic cylinder coupled to the shaft. The hydraulic cylinder is to move the shaft along a longitudinal axis of the shaft, based on a movement of the hinge assembly between the folded position and the unfolded position, to vary an operating torque of the hinge assembly.
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公开(公告)号:US11112837B2
公开(公告)日:2021-09-07
申请号:US16335828
申请日:2016-12-14
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Kuan-Ting Wu , Wei-Chung Chen
Abstract: In an example, a hinge may include a first hinge component having a first friction surface, and a second hinge component having a second friction surface. The second hinge component may be rotatably engaged with the first hinge component such that the first friction surface and the second friction surface are abutted against each other and are to move relative to one another if the first hinge component and the second hinge component are moved relative to one another. The hinge may include a graphene coating disposed on either of the first friction surface, or the second friction surface.
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公开(公告)号:US11090909B2
公开(公告)日:2021-08-17
申请号:US15758146
申请日:2015-11-04
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Kuan-Ting Wu , Chien Lung Yang , Cheng-Feng Liao
IPC: B32B15/088 , B32B15/14 , B32B37/10 , B21D26/021 , B21D26/055 , B21D26/059 , B29C70/86 , B32B7/12 , B32B15/082 , B32B15/09 , B32B15/20 , B32B27/28 , B32B27/30 , B32B27/34 , B32B27/36 , B32B1/02 , B32B3/28 , B32B15/08 , B29C70/08 , B32B38/18 , B32B37/12 , B29K705/00
Abstract: Examples of forming metal composites are described herein. In an example, a metal sheet is formed into a predetermined shape using superplastic thermal forming technique. Further, a carbon fiber-reinforced polymer sheet is shaped into the predetermined shape by thermal forming. The metal sheet and the carbon fiber-reinforced polymer sheet are coupled by applying an adhesive between the metal sheet and the carbon fiber-reinforced polymer sheet, to form a metal composite.
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公开(公告)号:US11086367B2
公开(公告)日:2021-08-10
申请号:US16648787
申请日:2017-10-10
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Chung-Hua Ku , Chi-Hao Chang , Kuan-Ting Wu
Abstract: Computers are disclosed. An example computer includes a casing including a first casing portion and a second casing portion; a fastener; and a biasing element surrounding the fastener, the fastener to couple the first casing portion and the second casing portion and the biasing element to deter vibrations transmitted from the first casing portion to the fastener from affecting internal components of the computer.
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公开(公告)号:US20210217331A1
公开(公告)日:2021-07-15
申请号:US17042383
申请日:2018-09-27
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Kuan-Ting Wu , Chi Hao Chang , Xuan Shi
Abstract: In an example, a switchable display may include a movable pixel unit having a rotatable motive element. The movable pixel unit may further include a first display unit having a first display characteristic and disposed on a first side of the rotatable motive element. The movable pixel unit may further include a second display unit having a second display characteristic and disposed on a second side of the rotatable motive unit, different from the first side.
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