Systems for printing solder paste and other viscous materials at high resolution

    公开(公告)号:US11446750B2

    公开(公告)日:2022-09-20

    申请号:US16807489

    申请日:2020-03-03

    Abstract: Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.

    METHODS OF FABRICATING A 3D DEVICE USING ABLATION

    公开(公告)号:US20220023016A1

    公开(公告)日:2022-01-27

    申请号:US17493303

    申请日:2021-10-04

    Abstract: A three-dimensional device is fabricated in a layer-by-layer approach using a support material. The support material is deposited in a liquid form on a surface, hardened by cooling or ultraviolet (UV) curing, and selectively ablated to create an area within which the desired structure of the device will be formed. Active material is deposited into this area, and the layer-by-layer process repeated until the three-dimensional device has been completed. Thereafter, any remaining support material is removed by water or other solvent.

    SYSTEMS AND METHODS FOR PRINTING CONFORMAL MATERIALS ON COMPONENT EDGES AT HIGH RESOLUTION

    公开(公告)号:US20210385951A1

    公开(公告)日:2021-12-09

    申请号:US17302449

    申请日:2021-05-03

    Inventor: Michael Zenou

    Abstract: Systems and methods that enable printing of conformal materials and other waterproof coating materials at high resolution. An initial printing of a material on edges of a component is performed at high resolution in a first printing step, and a subsequent printing of the material on remaining surfaces of the component is applied in a second printing step, with or without curing of the material printed on the edges between the two printing steps. The printing of the material may be performed by a laser-assisted deposition or using another dispensing system to achieve a high resolution printing of the material and a high printing speed.

    SYSTEMS AND METHODS FOR NEGATIVE 3D PRINTING MACHINE AT HIGH RESOLUTION

    公开(公告)号:US20210347116A1

    公开(公告)日:2021-11-11

    申请号:US17248220

    申请日:2021-01-14

    Abstract: Methods and apparatus for the fabrication of solid three-dimensional objects from liquid polymerizable materials at high resolution. A material is coated on a film non-digitally, excess material is removed digitally, by laser, leaving an image of a layer to be printed, and the image is then engaged with existing portions of an object being fabricated and exposed to a non-digital UV curing light source. Since the only part of the process that is digital is the material removal, and this part is done by laser, the speed of printing and the robustness of the manufacturing process is improved significantly over conventional additive or 3D fabrication techniques.

    LASER-BASED DROPLET ARRAY JETTING OF HIGH VISCOUS MATERIALS

    公开(公告)号:US20210339462A1

    公开(公告)日:2021-11-04

    申请号:US17305747

    申请日:2021-07-14

    Abstract: Laser jetting of droplets of a viscous material, such as an ink, is performed by coating a layer of ink on a mesh-like transport screen, with the ink being retained within spaces of the mesh-like transport screen. The ink-coated mesh-like transport screen is conveyed to a working area and a laser beam is used to heat the ink within the spaces of the mesh-like transport screen, thereby causing ink droplets to be jetted from the spaces of the mesh-like transport screen. Structures are formed on a receiving substrate arranged near the working area by jetting the ink droplets, either in an aggregation or sequentially, across a gap from the mesh-like transport screen to the receiving substrate and displacing the mesh-like transport screen and the laser beam relative to one another at times between the jetting of the droplets, or by directly printing ink droplets onto the receiving substrate.

    SYSTEMS AND METHODS FOR SOLDER PASTE PRINTING ON COMPONENTS

    公开(公告)号:US20210267067A1

    公开(公告)日:2021-08-26

    申请号:US17247981

    申请日:2021-01-04

    Abstract: Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an electronic component at a first printing unit, and the electronic component is subsequently placed onto a substrate with the portions of viscous material between the electronic component and the substrate. Optionally, a printing unit which prints the dots of material onto the electronic component includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the electronic component by the printing unit. The system may also include imaging units to aid in the overall process.

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