公开(公告)号：US09618588B2

公开(公告)日：2017-04-11

申请号：US14261939

申请日：2014-04-25

Applicant: Infineon Technologies AG

Inventor： Udo Ausserlechner

IPC: G01R33/09 ,  G01R19/00 ,  G01B7/30

CPC classification number: G01R15/205 ,  G01R19/0092 ,  G01R33/09 ,  G01R33/091

Abstract: Embodiments relate to coreless magnetic field current sensors, systems and methods, such as magnetoresistive sensors, systems and methods, to sense current flow in a conductor via a related magnetic field. In an embodiment, a current sensor system for sensing a current in a conductor from a magnetic field induced thereby, comprising a plurality N of magnetoresistive (MR) sensors arranged on a circle concentric to a center of the conductor and spaced apart from one another by 360 degrees/N, wherein each MR sensor has a sensitivity plane and is responsive to a projection of the magnetic field into the sensitivity plane, the sensitivity planes of the plurality of MR sensors being parallel, and wherein the plurality of MR sensors are arranged relative to the conductor such that the magnetic field has a non-vanishing component parallel to the sensitivity plane; at least one magnetic element arranged to provide a bias magnetic field on the plurality of MR sensors; and circuitry coupled to the plurality of MR sensors to determine the current in the conductor by combining signals from each of the plurality of MR sensors.

公开(公告)号：US09581660B2

公开(公告)日：2017-02-28

申请号：US14539503

申请日：2014-11-12

Applicant: Infineon Technologies AG

Inventor： Udo Ausserlechner

IPC: G01R33/07 ,  H01L43/06 ,  G01L1/12

CPC classification number: G01R33/072 ,  G01L1/12 ,  G01R33/07 ,  G01R33/077 ,  H01L43/065

Abstract: An electronic device is disclosed as a part of a magnetic field sensor or a mechanical stress sensor. The electronic device includes a Hall effect region, a first contact (temporarily functioning as a first supply contact), a second contact (second supply contact), and a third contact (temporarily functioning as a first sense contact) that are arranged in or on a surface of the Hall effect region. The first contact and the third contact are arranged in a substantially symmetrical manner to each other with respect to the second contact. An electrical current distribution within the Hall effect region is influenced by a physical quantity (e.g. magnetic field strength or mechanical stress) to be measured. A sense signal tapped at the third contact is a function of the current distribution, the sense signal thus being indicative of the physical quantity. A corresponding sensing method using the electronic device is also disclosed.

Abstract translation: 电子装置被公开为磁场传感器或机械应力传感器的一部分。 电子设备包括霍尔效应区域，布置在其中或之上的第一触点（暂时用作第一电源触点），第二触点（第二电源触点）和第三触点（暂时用作第一感测触点） 霍尔效应区域的一个表面。 第一触点和第三触点以相对于第二触点彼此基本对称的方式布置。 霍尔效应区域内的电流分布受待测量的物理量（例如磁场强度或机械应力）的影响。 在第三触点处抽头的感测信号是电流分布的函数，因此感测信号表示物理量。 还公开了使用该电子设备的相应的感测方法。

公开(公告)号：US20160356821A1

公开(公告)日：2016-12-08

申请号：US15206881

申请日：2016-07-11

Applicant: Infineon Technologies AG

Inventor： Udo Ausserlechner

IPC: G01R15/20 ,  G01R33/07

CPC classification number: G01R15/202 ,  G01R15/207 ,  G01R33/072

Abstract: Embodiments relate to magnetic field current sensors having sensor elements for sensing at least two magnetic field components, for example Bx and By. The current in a conductor is estimated by Bx and Bx/By, wherein Bx is the primary measurement and Bx/By is a corrective term used to account for position tolerances between the sensor and the conductor. In other embodiments, the corrective term can be dBx/By, where dBx is a difference in between components sensed at different sensor elements. The particular field components can vary in embodiments; for example, the current can be estimated by By and By/Bx, or dBy/Bx or some other arrangement.

Abstract translation: 实施例涉及具有用于感测至少两个磁场分量的传感器元件的磁场电流传感器，例如Bx和By。 导体中的电流由Bx和Bx / By估计，其中Bx是主要测量，Bx / By是用于考虑传感器和导体之间的位置公差的校正项。 在其他实施例中，校正项可以是dBx / By，其中dBx是在不同传感器元件处感测到的分量之间的差异。 特定现场组件可以在实施例中变化; 例如，可以通过By和By / Bx或dBy / Bx或某些其他布置来估计电流。

公开(公告)号：US20160327408A1

公开(公告)日：2016-11-10

申请号：US15211267

申请日：2016-07-15

Applicant: Infineon Technologies AG

Inventor： Udo Ausserlechner

IPC: G01D5/12

CPC classification number: G01D5/12 ,  G01B7/30 ,  G01D5/145

Abstract: Embodiments relate to magnetic field angle sensors that utilize axial and perpendicular sensors collectively to infer a rotational angle. In embodiments, a sensor system comprises at least one axial sensor unit and at least one perpendicular sensor unit arranged in a single sensor package or on a single substrate. The axial and perpendicular sensor data both representative of the rotational position can be used to improve output angle accuracy by, e.g., calibrating the sensor system.

公开(公告)号：US09435662B2

公开(公告)日：2016-09-06

申请号：US14247361

申请日：2014-04-08

Applicant: Infineon Technologies AG

Inventor： Udo Ausserlechner

IPC: G01R33/09 ,  G01D5/16 ,  G01D5/14 ,  G01D5/244

CPC classification number: G01D5/16 ,  G01D5/145 ,  G01D5/24485

Abstract: A magneto-resistive angle sensor includes a first half bridge circuit including a first magneto-resistive element and a second magneto-resistive element, and a second half bridge circuit having a third magneto-resistive element and a fourth magneto-resistive element, wherein the first, second, third, and fourth magneto-resistive element are arranged parallel to a x′/y′-plane of a Cartesian reference system with an x′-axis and y′-axis, both orthogonal to each other. The geometrical gravity centers of the first and the second magneto-resistive elements of the first half bridge circuit and the geometrical gravity centers of the third and the fourth magneto-resistive elements of the second half bridge circuit have an identical x′-coordinate, wherein the sum of the value of the geometrical inertia moment of the first magneto-resistive element around the y′-axis, the negative value of the geometrical inertia moment of the second magneto-resistive element around the y′-axis, the value of the geometrical deviation moment of the third magneto-resistive element in the x′/y′-plane and the negative value of the geometrical deviation moment of the fourth magneto-resistive element in the x′/y′-plane vanishes within a tolerance range. Further, the sum of the value of the geometrical inertia moment of the third magneto-resistive element around the y′-axis, the negative value of the geometrical inertia moment of the fourth magneto-resistive element around the y′-axis, the negative value of the geometrical deviation moment of the first magneto-resistive element in the x′/y′-plane and the value of the geometrical deviation moment of the second magneto-resistive element in the x′/y′ vanishes within a tolerance range.

Abstract translation: 磁阻角度传感器包括包括第一磁阻元件和第二磁阻元件的第一半桥电路以及具有第三磁阻元件和第四磁阻元件的第二半桥电路，其中， 第一，第二，第三和第四磁阻元件平行于具有彼此正交的x'轴和y'轴的笛卡尔参考系的ax'/ y'平面。 第一半桥电路的第一和第二磁阻元件的几何重心和第二半桥电路的第三和第四磁阻元件的几何重心具有相同的x'坐标，其中 围绕y'轴的第一磁阻元件的几何惯性矩的值的总和，围绕y'轴的第二磁阻元件的几何惯性力矩的负值， x'/ y'平面中的第三磁阻元件的几何偏移力矩和第四磁阻元件在x'/ y'平面中的几何偏差力矩的负值在公差范围内消失。 此外，围绕y'轴的第三磁阻元件的几何惯性矩的值的和，围绕y'轴的第四磁阻元件的几何惯性矩的负值，负 x'/ y'平面中的第一磁阻元件的几何偏移力矩的值和第二磁阻元件在x'/ y'中的几何偏差矩的值在公差范围内消失。

公开(公告)号：US20160245674A1

公开(公告)日：2016-08-25

申请号：US15058497

申请日：2016-03-02

Applicant: Infineon Technologies AG

Inventor： Udo Ausserlechner

IPC: G01D11/24 ,  G01D5/14

Abstract: A sensor arrangement includes a sensor element and a magnet module. The sensor element is configured to measure a magnetic field and is positioned within a shaft. The shaft is configured to shield the magnet module and the sensor element. The magnet module is configured to generate the magnetic field. The sensor element is at least partially positioned within the shaft.

Abstract translation: 传感器装置包括传感器元件和磁体模块。 传感器元件被配置为测量磁场并且定位在轴内。 轴构造成屏蔽磁体模块和传感器元件。 磁体模块被配置为产生磁场。 传感器元件至少部分地定位在轴内。

公开(公告)号：US20160245668A1

公开(公告)日：2016-08-25

申请号：US15048398

申请日：2016-02-19

Applicant: Infineon Technologies AG

Inventor： Udo Ausserlechner ,  Mario Motz

IPC: G01D3/028 ,  G01L1/18

CPC classification number: G01L1/18 ,  G01D3/0365 ,  G01L1/26 ,  G01L5/0047

Abstract: A carrier of an electronic circuit, the carrier including a first sensor for determining a first signal based on a sum of a first normal stress component and a second normal stress component, and a second sensor for determining a second signal based on a difference between the first normal stress component and a second normal stress component. Also, a corresponding circuit, method and device.

Abstract translation: 一种电子电路的载体，所述载体包括用于基于第一法向应力分量和第二法向应力分量之和来确定第一信号的第一传感器，以及用于基于第一法向应力分量和第二法向应力分量之和的第二信号确定第二信号的第二传感器 第一正常应力分量和第二法向应力分量。 另外，相应的电路，方法和装置。

公开(公告)号：US09425386B2

公开(公告)日：2016-08-23

申请号：US14672757

申请日：2015-03-30

Applicant: Infineon Technologies AG

Inventor： Udo Ausserlechner

IPC: G01R33/07 ,  H01L43/06 ,  G01D5/14 ,  G01L1/12 ,  H01L43/04

CPC classification number: H01L43/065 ,  G01D5/145 ,  G01L1/12 ,  G01R33/07 ,  G01R33/072 ,  H01L43/04

Abstract: An electronic device includes a number of n Hall effect regions with n>1, wherein the n Hall effect regions are isolated from each other. The electronic device also includes at least eight contacts in or on surfaces of the n Hall effect regions, wherein the contacts include: a first and a second contact of each Hall effect region. A first contact of the (k+1)-th Hall effect region is connected to the second contact of the k-th Hall effect region for k=1 to n−1, and the first contact of the first Hall effect region is connected to the second contact of the n-th Hall effect region. The at least eight contacts include at least two supply contacts and at least two sense contacts. Each Hall effect region includes at most one of the at least two supply contacts and at most one of the at least two sense contacts.

公开(公告)号：US09404990B2

公开(公告)日：2016-08-02

申请号：US14598398

申请日：2015-01-16

Applicant: Infineon Technologies AG

Inventor： Udo Ausserlechner ,  Mario Motz

IPC: G01R33/07 ,  G01R35/00 ,  G01R33/09 ,  G01D3/036 ,  G01L1/12 ,  G01D5/14

CPC classification number: G01R35/00 ,  G01D3/036 ,  G01D5/145 ,  G01L1/12 ,  G01R33/07 ,  G01R33/072 ,  G01R33/091

Abstract: Embodiments relate to reducing offset error in sensor systems. In embodiments, the sensitivity and offset of a sensor depend differently on some parameter, e.g. voltage, such that operating the sensor at two different values of the parameter can cancel the offset error. Embodiments can have applicability to stress sensors, Hall plates, vertical Hall devices, magnetoresistive sensors and others. The offset error can be reduced using a correction factor based on a first offset error of the sensor system when operated in a first phase and a second offset error of the sensor system when operated in second first phase. The sensor system can generate an output signal based on first and second output signals generated when operating in the first and second phases, respectively.

Abstract translation: 实施例涉及减少传感器系统中的偏移误差。 在实施例中，传感器的灵敏度和偏移量取决于某些参数，例如， 电压，使得以两个不同的参数值操作传感器可以消除偏移误差。 实施例可以应用于应力传感器，霍尔板，垂直霍尔装置，磁阻传感器等。 当在第二阶段中操作时，在第一阶段中操作传感器系统的第一偏移误差和传感器系统的第二偏移误差时，可以使用校正因子来减小偏移误差。 传感器系统可以分别基于在第一和第二阶段中操作时产生的第一和第二输出信号来产生输出信号。

公开(公告)号：US09366733B2

公开(公告)日：2016-06-14

申请号：US14250452

申请日：2014-04-11

Applicant: Infineon Technologies AG

Inventor： Udo Ausserlechner

IPC: G01R33/07 ,  G01R33/00 ,  G01R15/20 ,  G01R33/02 ,  H05K3/28 ,  H05K3/30

CPC classification number: G01R33/0047 ,  G01R15/20 ,  G01R15/207 ,  G01R33/02 ,  G01R33/07 ,  G01R33/072 ,  H01L2224/48105 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/01068 ,  H01L2924/01087 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K3/28 ,  H05K3/30 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49133 ,  H01L2924/00

Abstract: Some embodiments herein relate to a sensor package. The sensor package includes a printed circuit board with a laminar current conductor arranged on a first main surface of the printed circuit board. The sensor package also includes a sensor chip adapted to measure a current flowing through the laminar current conductor, wherein the sensor chip comprises a magnetic field sensor. The sensor chip is electrically insulated from the current conductor by the printed circuit board, and is arranged on a second main surface of the printed circuit board opposite to the first main surface. The sensor chip is hermetically sealed between the mold material and the printed circuit board, or is arranged in the printed circuit board and hermetically sealed by the printed circuit board.

Abstract translation: 本文中的一些实施例涉及传感器封装。 传感器封装包括布置在印刷电路板的第一主表面上的层流导体的印刷电路板。 传感器封装还包括适于测量流过层流导体的电流的传感器芯片，其中传感器芯片包括磁场传感器。 传感器芯片通过印刷电路板与电流导体电绝缘，并且布置在与第一主表面相对的印刷电路板的第二主表面上。 传感器芯片气密地密封在模具材料和印刷电路板之间，或者布置在印刷电路板中并被印刷电路板气密地密封。