公开(公告)号：US20200286841A1

公开(公告)日：2020-09-10

申请号：US16843803

申请日：2020-04-08

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Adel A. Elsherbini ,  Sasha Oster

IPC: H01L23/66 ,  H01L21/48 ,  H01L23/498

Abstract: In various embodiments, disclosed herein are systems and methods directed to the fabrication of a coreless semiconductor package (e.g., a millimeter (mm)-wave antenna package) having an asymmetric build-up layer count that can be fabricated on both sides of a temporary substrate (e.g., a core). The asymmetric build-up layer count can reduce the overall layer count in the fabrication of the semiconductor package and can therefore contribute to fabrication cost reduction. In further embodiments, the semiconductor package (e.g., a millimeter (mm)-wave antenna packages) can further comprise dummification elements disposed near one or more antenna layers. Further, the dummification elements disposed near one or more antenna layers can reduce image current and thereby increasing the antenna gain and efficiency.

公开(公告)号：US20200280121A1

公开(公告)日：2020-09-03

申请号：US16369452

申请日：2019-03-29

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Aleksandar Aleksov ,  Telesphor Kamgaing ,  Gilbert W. Dewey ,  Hyung-Jin Lee

IPC: H01Q1/22 ,  H01L23/00 ,  H01L23/66 ,  H01L25/065 ,  H01L23/552 ,  H01L25/00

Abstract: Embodiments may relate to an semiconductor package. The semiconductor package may include a die coupled with the face of the package substrate. The semiconductor package may further include a waveguide coupled with the face of the package substrate adjacent to the die, wherein the waveguide is to receive an electromagnetic signal from the die and facilitate conveyance of the electromagnetic signal in a direction parallel to the face of the package substrate. Other embodiments may be described or claimed.

公开(公告)号：US10734236B2

公开(公告)日：2020-08-04

申请号：US16399703

申请日：2019-04-30

Applicant: INTEL CORPORATION

Inventor： Sasha N. Oster ,  Fay Hua ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Henning Braunisch ,  Johanna M. Swan

IPC: H01L21/4763 ,  H01L21/285 ,  H01L21/768 ,  H01L21/033 ,  B82Y40/00 ,  H01L23/66 ,  H01L25/16 ,  H05K1/16 ,  H05K3/28 ,  H01L23/538 ,  H01L21/48 ,  H05K1/02 ,  H05K3/34

Abstract: Embodiments include devices and methods, including a method for processing a substrate. The method includes providing a substrate including a first portion and a second portion, the first portion including a feature, the feature including an electrically conductive region, the second portion including a dielectric surface region. The method also includes performing self-assembled monolayer (SAM) assisted structuring plating to form a structure comprising a metal on the dielectric surface region, the feature being formed using a process other than the SAM assisted structuring plating used to form the structure, and the structure being formed after the feature. Other embodiments are described and claimed.

公开(公告)号：US10680788B2

公开(公告)日：2020-06-09

申请号：US16127800

申请日：2018-09-11

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Emanuel Cohen ,  Sasha N. Oster

IPC: H04L5/14 ,  H04B3/52 ,  H04B3/23 ,  H04W72/04 ,  H04B1/44

Abstract: Embodiments of the present disclosure may relate to a transceiver to transmit and receive concurrently radio frequency (RF) signals via a dielectric waveguide. In embodiments, the transceiver may include a transmitter to transmit to a paired transceiver a channelized radio frequency (RF) transmit signal via the dielectric waveguide. A receiver may receive from the paired transceiver a channelized RF receive signal via the dielectric waveguide. In embodiments, the channelized RF receive signal may include an echo of the channelized RF transmit signal. The transceiver may further include an echo suppression circuit to suppress from the channelized RF receive signal the echo of the channelized RF transmit signal. In some embodiments, the channelized RF transmit signal and the channelized RF receive signal may be within a frequency range of approximately 30 gigahertz (GHz) to approximately 1 terahertz (THz), and the transceiver may provide full-duplex millimeter-wave communication.

公开(公告)号：US10595410B2

公开(公告)日：2020-03-17

申请号：US15283352

申请日：2016-10-01

Applicant: Intel Corporation

Inventor： Fay Hua ,  Brandon M. Rawlings ,  Georgios C. Dogiamis ,  Telesphor Kamgaing

IPC: H05K1/16 ,  H01L21/48 ,  H01L23/498 ,  H01L25/16 ,  H05K1/11 ,  H05K3/42 ,  H05K3/00 ,  H05K3/38 ,  H05K3/40

Abstract: Embodiments are generally directed to non-planar on-package via capacitor. An embodiment of an embedded capacitor includes a first plate that is formed in a package via; a dielectric layer that is applied on the first plate; and a second plate that is formed in a cavity in the dielectric layer, wherein the first plate and the second plate are non-planar plates.

公开(公告)号：US10439671B2

公开(公告)日：2019-10-08

申请号：US15771865

申请日：2015-12-21

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Vijay K. Nair

IPC: H04B1/44 ,  H01Q21/06 ,  H01Q3/42 ,  H01Q21/22 ,  H04B1/401 ,  H01Q3/36 ,  H01Q23/00

Abstract: Embodiments of the invention include a communication module that includes a die having a transceiver and a phase shifter die that is coupled to the die. The phase shifter includes a power combiner and splitter. The communication module also includes a substrate that is coupled to the phase shifter die. The substrate includes an antenna unit with steerable beam forming capability for transmitting and receiving communications.

公开(公告)号：US20190288404A1

公开(公告)日：2019-09-19

申请号：US16432651

申请日：2019-06-05

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Adel A. Elsherbini

IPC: H01Q21/22 ,  H01Q21/06 ,  H01Q23/00 ,  H01L23/00 ,  H01Q21/00 ,  G06K19/077

Abstract: Embodiments described herein generally relate to phased array antenna systems or packages and techniques of making and using the systems and packages. A phased array antenna package may include a distributed phased array antenna comprising (1) a plurality of antenna sub-arrays, which may each include a plurality of antennas, (2) a plurality of Radio Frequency Dies (RFDs), each of the RFDs located proximate and electrically coupled by a trace of a plurality of traces to a corresponding antenna sub-array of the plurality of antenna sub-arrays, and (3) wherein each trace of the plurality of traces configured to electrically couple an antenna of the plurality of antennas to the RFD located proximate the antenna, wherein each trace of the plurality of traces is configured to transmit millimeter wave (mm-wave) radio signals, and wherein the plurality of traces are each of a substantially uniform length.

公开(公告)号：US10404499B2

公开(公告)日：2019-09-03

申请号：US15388564

申请日：2016-12-22

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Emanuel Cohen ,  Sasha N. Oster ,  Telesphor Kamgaing

IPC: H04B10/90 ,  H04L25/03 ,  H04J1/08

Abstract: Embodiments of the present disclosure may relate to a transmitter that includes a baseband dispersion compensator to perform baseband dispersion compensation on an input signal. Embodiments may also include a receiver that includes a radio frequency (RF) dispersion compensator to perform RF dispersion compensation. Embodiments may also include a dielectric waveguide coupled with the transmitter and the receiver, the dielectric waveguide to convey the RF signal from the transmitter to the receiver. Other embodiments may be described and/or claimed.

公开(公告)号：US10327268B2

公开(公告)日：2019-06-18

申请号：US15745908

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Adel A. Elsherbini ,  Emanuel Cohen

IPC: H01Q9/16 ,  H04W76/10 ,  H01L23/66 ,  H01L25/065 ,  H01L25/16 ,  H01Q1/22 ,  H04B1/48 ,  H01L23/00 ,  H04Q1/02 ,  H05K7/14 ,  H01Q3/30 ,  H04B1/38

Abstract: A microelectronic package is described with a wireless interconnect for chip-to-chip communication. In one example, the package includes an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components, a radio coupled to the integrated circuit chip to receive data from the integrated circuit chip and modulate the data onto a radio frequency carrier, and an antenna on the package substrate coupled to the radio to send the modulated data over the carrier to an external device.

公开(公告)号：US20190149243A1

公开(公告)日：2019-05-16

申请号：US16224008

申请日：2018-12-18

Applicant: Intel Corporation

Inventor： Hyung-Jin Lee ,  Cho-ying Lu ,  Henning Braunisch ,  Telesphor Kamgaing ,  Georgios Dogiamis ,  Richard Dischler

IPC: H04B10/516 ,  H04B10/61 ,  H04B10/2575

Abstract: Embodiments herein may relate to an interconnect that includes a transceiver, where the transceiver is configured to receive a data stream, convert the data stream to a quadrature amplitude modulation (QAM) mapping/shaping signal, where the QAM mapping/shaping signal is a frequency component of the data stream, convert the QAM mapping/shaping signal to a Hilbert transform signal, where the Hilbert transform signal includes a reverse order of an in-phase component of the QAM mapping/shaping signal and a reverse order of a quadrature component of the QAM mapping/shaping signal, convert the Hilbert transform signal to a QAM mapping/shaping signal, where the QAM mapping/shaping signal is a single sideband (SSB) time domain mm wave signal, where the SSB time domain mm wave signal is the Hilbert transform signal converted to a time domain signal, and communicate the SSB time domain mm wave signal over a waveguide using a waveguide interconnect.