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公开(公告)号：US10648925B2
公开(公告)日：2020-05-12
申请号：US15828632
申请日：2017-12-01
Applicant: KLA-Tencor Corporation
Inventor： Eugene Shifrin , Bjorn Brauer , Sumit Sen , Ashok Mathew , Sreeram Chandrasekaran , Lisheng Gao
IPC: G06K9/00 , G01N21/95 , G01N21/956 , H01L21/66
Abstract: Defects from a hot scan can be saved, such as on persistent storage, random access memory, or a split database. The persistent storage can be patch-based virtual inspector virtual analyzer (VIVA) or local storage. Repeater defect detection jobs can determined and the wafer can be inspected based on the repeater defect detection jobs. Repeater defects can be analyzed and corresponding defect records to the repeater defects can be read from the persistent storage. These results may be returned to the high level defect detection controller.
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72.发明授权公开(公告)号：US10648924B2
公开(公告)日：2020-05-12
申请号：US15396800
申请日：2017-01-02
Applicant: KLA-Tencor Corporation
Inventor： Jing Zhang , Grace Hsiu-Ling Chen , Kris Bhaskar , Keith Wells , Nan Bai , Ping Gu , Lisheng Gao
Abstract: Methods and systems for generating a high resolution image for a specimen from one or more low resolution images of the specimen are provided. One system includes one or more computer subsystems configured for acquiring one or more low resolution images of a specimen. The system also includes one or more components executed by the one or more computer subsystems. The one or more components include a model that includes one or more first layers configured for generating a representation of the one or more low resolution images. The model also includes one or more second layers configured for generating a high resolution image of the specimen from the representation of the one or more low resolution images.
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公开(公告)号：US10599944B2
公开(公告)日：2020-03-24
申请号：US13685808
申请日：2012-11-27
Applicant: KLA-Tencor Corporation
Inventor： Hucheng Lee , Junqing Huang , Lisheng Gao
Abstract: The disclosure is directed to providing visual feedback for inspection algorithms and difference filters used to process test and reference images from an inspection system. A user interface may be configured for displaying information and accepting user commands. A computing system communicatively coupled to the user interface may be configured to receive at least one set of test and reference images collected by the inspection system. The computing system may be further configured to provide at least one visual representation of the test and reference images via the user interface to show effects of an inspection algorithm and/or difference filter.
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公开(公告)号：US10514685B2
公开(公告)日：2019-12-24
申请号：US14736250
申请日：2015-06-10
Applicant: KLA-Tencor Corporation
Inventor： Hucheng Lee , Lisheng Gao , Govindarajan Thattaisundaram
IPC: G05B19/418
Abstract: Systems and methods for monitoring stability of a wafer inspection recipe over time are provided. One method includes collecting inspection results over time. The inspection results are generated by at least one wafer inspection tool while performing the wafer inspection recipe on wafers at different points in time. The method also includes identifying abnormal variation in the inspection results by comparing the inspection results generated at different times to each other. In addition, the method includes determining if the abnormal variation is attributable to the wafers, the wafer inspection recipe, or one or more of the at least one wafer inspection tool thereby determining if the wafer inspection recipe is stable over time.
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公开(公告)号：US10395359B2
公开(公告)日：2019-08-27
申请号：US15624649
申请日：2017-06-15
Applicant: KLA-Tencor Corporation
Inventor： Junqing Huang , Hucheng Lee , Kenong Wu , Lisheng Gao
Abstract: Methods and systems for detecting defects on a wafer using adaptive local thresholding and color filtering are provided. One method includes determining local statistics of pixels in output for a wafer generated using an inspection system, determining which of the pixels are outliers based on the local statistics, and comparing the outliers to the pixels surrounding the outliers to identify the outliers that do not belong to a cluster of outliers as defect candidates. The method also includes determining a value for a difference in color between the pixels of the defect candidates and the pixels surrounding the defect candidates. The method further includes identifying the defect candidates that have a value for the difference in color greater than or equal to a predetermined value as nuisance defects and the defect candidates that have a value for the difference in color less than the predetermined value as real defects.
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Patent Agency Ranking
公开(公告)号：US10339262B2
公开(公告)日：2019-07-02
申请号：US15351813
申请日：2016-11-15
Applicant: KLA-Tencor Corporation
Inventor： Junqing Huang , Soren Konecky , Hucheng Lee , Kenong Wu , Lisheng Gao
Abstract: A method includes identifying a first set of a first care area with a first sensitivity threshold, the first care area associated with a first design of interest within a block of repeating cells in design data; identifying an additional set of an additional care area with an additional sensitivity threshold, the additional care area associated with an additional design of interest within the block of repeating cells in design data; identifying one or more defects within the first set of the first care areas in one or more images of a selected region of a sample based on the first sensitivity threshold; and identifying one or more defects within the additional set of the additional care areas in the one or more images of the selected region of the sample based on the additional sensitivity threshold.
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公开(公告)号：US10132760B2
公开(公告)日：2018-11-20
申请号：US15643333
申请日：2017-07-06
Applicant: KLA-Tencor Corporation
Inventor： Pavel Kolchin , Richard Wallingford , Lisheng Gao , Grace H. Chen , Markus B. Huber , Robert M. Danen
IPC: G01N21/95
Abstract: Disclosed are methods and apparatus for optimizing a mode of an inspection tool. A first image or signal for each of a plurality of first apertures of the inspection tool is obtained, and each first image or signal pertains to a defect area. For each of a plurality of combinations of the first apertures and their first images or signals, a composite image or signal is obtained. Each composite image or signal is analyzed to determine an optimum one of the combinations of the first apertures based on a defect detection characteristic of each composite image. In one aspect, determining an optimum one of the combinations of the first apertures includes selecting a set of one or more individual apertures that result in the highest signal to noise ratio for the defect area, and the method includes setting the optimum combination of the first apertures on the inspection tool and inspecting a sample using such optimum combination of the first apertures.
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公开(公告)号：US09715725B2
公开(公告)日：2017-07-25
申请号：US14563845
申请日：2014-12-08
Applicant: KLA-Tencor Corporation
Inventor： Yong Zhang , Tao Luo , Chaohong Wu , Stephanie Chen , Lisheng Gao
CPC classification number: G06T7/001 , G06T7/33 , G06T2207/30148
Abstract: Methods and systems for detecting defects on a wafer are provided. One method includes altering one or more design clips based on how the one or more design clips will appear in output generated by a wafer inspection process for a wafer. The method also includes aligning the one or more altered design clips to the output generated for the wafer during the wafer inspection process. In addition, the method includes detecting defects on the wafer based on the output aligned to the one or more altered design clips.
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公开(公告)号：US20160321800A1
公开(公告)日：2016-11-03
申请号：US15140438
申请日：2016-04-27
Applicant: KLA-Tencor Corporation
Inventor： Govindarajan Thattaisundaram , Hucheng Lee , Lisheng Gao
IPC: G06T7/00 , G01N21/95 , G01N21/956
CPC classification number: G01N21/9501 , G01N21/95607 , G01N2021/8883 , G01N2021/95676 , G01N2201/06113 , G01N2201/0683 , G01N2201/10 , G06T7/001 , G06T2207/10056 , G06T2207/30148
Abstract: Methods and systems for detecting defects on a specimen are provided. One system includes one or more computer subsystems configured for acquiring images generated by an imaging subsystem at multiple instances of a pattern of interest (POI) within a die formed on the specimen. The multiple instances include two or more instances that are located at aperiodic locations within the die. The computer subsystem(s) are also configured for generating a POI reference image from two or more of the images generated at the multiple instances of the POI within the die. The computer subsystem(s) are further configured for comparing the images generated at the multiple instances of the POI within the die to the POI reference image and detecting defects in the multiple instances of the POI based on results of the comparing.
Abstract translation: 提供了检测试样缺陷的方法和系统。 一个系统包括一个或多个计算机子系统，其配置用于在形成在样本上的模具内的多个感兴趣模式（POI）实例处获取由成像子系统生成的图像。 多个实例包括位于管芯内非周期位置的两个或多个实例。 计算机子系统还被配置为从在芯片内的POI的多个实例处生成的两个或多个图像中生成POI参考图像。 计算机子系统还被配置为将在模具内的POI的多个实例处产生的图像与POI参考图像进行比较，并且基于比较的结果检测POI的多个实例中的缺陷。
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80.发明申请公开(公告)号：US20160266047A1
公开(公告)日：2016-09-15
申请号：US15158413
申请日：2016-05-18
Applicant: KLA-Tencor Corporation
Inventor： Grace H. Chen , Rudolf Brunner , Lisheng Gao , Robert M. Danen , Lu Chen
CPC classification number: G01N21/8806 , G01N21/8851 , G01N21/9501 , G01N21/956 , G01N21/95623 , G01N2021/8822 , G01N2021/95676 , G01N2201/061 , G01N2201/0638 , G01N2201/068 , G01N2201/12
Abstract: In an optical inspection tool, an illumination aperture is opened at each of a plurality of aperture positions of an illumination pupil area one at a time across the illumination pupil area. For each aperture opening position, an incident beam is directed towards the illumination pupil area so as to selectively pass a corresponding ray bundle of the illumination beam at a corresponding set of one or more incident angles towards the sample and an output beam, which is emitted from the sample in response to the corresponding ray bundle of the incident beam impinging on the sample at the corresponding set of one or more incident angles, is detected. A defect detection characteristic for each aperture position is determined based on the output beam detected for each aperture position. An optimum aperture configuration is determined based on the determined defect detection characteristic for each aperture position.
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