摘要:
The present invention improves recover percentage at which a mixed chemical solution discharged from a protective film removing device.The protective film removing device includes: a recovery line communicating with an atmosphere surrounding a substrate to recover a mixed chemical solution, an intermediate tank connected to the outlet end of the recovery line, a volatilization preventing liquid supply means for supplying a volatilization preventing liquid having a specific gravity smaller than that of the mixed chemical solution into the intermediate tank in advance, a transfer line having an inlet end connected to the intermediate tank and provided with a valve, a recovery tank connected to an outlet end of the transfer line, a liquid quantity monitoring means for monitoring a quantity of a liquid contained in the intermediate tank, and a control means for opening the valve of the transfer line to transfer the liquid contained in the intermediate tank to the recovery tank when it is decided that the quantity of the liquid contained in the intermediate tank reached a predetermined quantity on the basis of a signal provided by the liquid quantity monitoring means.
摘要:
A coating and developing system prevents wetting its component units with water when the coating and developing system forms a resist film on a substrate and processes the substrate processed by immersion exposure by a developing process. A substrate having a surface coated with a resist film and processed by immersion exposure is placed on a substrate support device and a liquid detector detects at least the liquid formed a liquid film for immersion exposure and remaining on the surface of the substrate. A decision is made as to whether or not the substrate needs to be dried on the basis of the result of detection made by the liquid detector. If it is decided that the substrate needs to be dried, the substrate is dried by a drying means. Thus wetting the interior of the coating and developing system with water can be prevented. Since only substrates that need to be dried are subjected to a drying process, the coating and developing system is able to operate at a high throughput.
摘要:
A rinse method for rinsing a substrate having an exposure pattern thereon developed includes presetting conditions for a rinse process according to surface states of the substrate, measuring a surface state of the substrate, selecting a corresponding condition for the rinse process based on the measured surface state of the substrate, and performing the rinse process under the selected condition.
摘要:
A substrate cleaning device and a substrate cleaning method reduces liquid drops remaining on a substrate to prevent the irregular heating of the substrate by a heating process due to liquid drops or water marks remaining on the substrate. A cleaning liquid is poured through a cleaning liquid pouring nozzle onto the surface of a substrate such that a region onto which the cleaning liquid is poured moves from a central part toward the circumference of the substrate. A gas is jetted radially outward at a region on the surface of the substrate behind a region onto which the cleaning liquid is poured with respect to the rotating direction of the substrate. The gas forces a liquid film of the cleaning liquid flowing on the surface of the substrate to flow in a circumferential direction and a radially outward direction. The cleaning liquid poured out onto the surface of the substrate through the cleaning liquid pouring nozzle is restrained from flowing by a liquid damming member held at a height equal to or lower than that of the nozzle exit of the cleaning liquid pouring nozzle to collect a mass of the cleaning liquid. A high centrifugal force acts on the mass of the cleaning liquid to force the mass of the cleaning liquid to flow outward even if the substrate is rotated at a low rotating speed.
摘要:
A coating and developing system is capable of preventing the contamination of a substrate with particles while the same coats a surface of a substrate with a resist film and develops the resist film after the substrate has been processed by immersion exposure. The coating and developing system includes: a processing block including coating units for forming a resist film on a surface of a substrate and developing units for processing the resist film formed on the substrate with a developer, and an interface block connected to the processing block and an exposure system for carrying out an immersion exposure process. The interface block includes: substrate cleaning units for cleaning the substrate processed by the immersion exposure process, a first carrying mechanism and a second carrying mechanism. The first carrying mechanism carries a substrate processed by immersion exposure to the substrate cleaning unit. The second carrying mechanism carries the substrate cleaned by the substrate cleaning unit. Thus the contamination of the substrate with external particles can be prevented and hence the spread of contamination with particles over the processing units of the processing block and substrates processed by the processing units can be prevented.
摘要:
A developing apparatus for developing a substrate whose surface is coated with a coating solution and then exposed includes a substrate supporting unit for horizontally supporting the substrate, a rotation driving mechanism for rotating the substrate supporting unit forwardly or backwardly with respect to a vertical axis, a developer nozzle, disposed to face a surface of the substrate supported by the substrate supporting unit, having a strip-shaped injection opening extended along a direction extending from a periphery of the substrate toward a central portion thereof, a moving unit for moving the developer nozzle from an outer portion of the substrate toward the central portion thereof, and a controller for controlling operations such that while the substrate is rotated forwardly by the rotation driving mechanism, a developer is supplied through the injection opening to the surface of the substrate by moving the developer nozzle and, then, the substrate is rotated backwardly by the rotation driving mechanism.
摘要:
In a developing processing of a wafer having a resist film low in the dissolving rate in a developing solution formed thereon and subjected to an exposure treatment, a developing solution of a low concentration is supplied first onto a wafer and the wafer is left to stand for a prescribed time to permit a developing reaction to proceed, followed by further supplying a developing solution having a concentration higher than that of the developing solution supplied first onto the wafer, leaving the substrate to stand and subsequently rinsing the wafer, thereby improving the uniformity of the line width in the central portion and the peripheral portion of the wafer.
摘要:
Disclosed are a method and an apparatus comprising a film-cutting means for cutting a lengthy photographic film fed from a film roll into those having a length suitable for a film size included in film information, a conveyer apparatus for changing transport operation for a photographic film strip depending on the film size, a timing-changing means for changing transport timing for the photographic film strip to be fed to a winding section depending on the film size, and a timing-changing means for changing transport timing for a shield paper strip to be fed to the winding section depending on the film size.
摘要:
A coating and developing system for forming a resist film on a substrate by coating the substrate with a liquid resist and developing the resist film after the resist film has been processed by immersion exposure that forms a liquid layer on the surface of the substrate is capable of reducing difference in property among resist films formed on substrates. The coating and developing system includes: a cleaning unit; a carrying means; and a controller. A set time interval is determined such that the substrate is subjected to the immersion exposure process after contact angle drop rate at which contact angle between the cleaning liquid and a surface of the substrate drops has dropped from an initial level at the wetting time point when the surface of the substrate is wetted with the cleaning liquid to a level far lower than the initial level.
摘要:
A developing method including a developing step in which, while a wafer horizontally held by a spin chuck is being rotated, the wafer is developed by supplying a developer onto a surface of the wafer, wherein provided before the developing step is a pre-wetting step in which, simultaneously with the developer being supplied from a first nozzle that is located on a position near a central part of the surface of the rotating wafer, a deionized water as a second liquid is supplied from a second nozzle that is located on a position nearer to an outer peripheral part of the wafer than the first nozzle, to thereby spread out the developer in the rotating direction of the wafer by a wall that is formed by the deionized water flowing to the outer peripheral side of the wafer with the rotation of the wafer.