Process for preparing a multi-layer wiring board
    72.
    发明授权
    Process for preparing a multi-layer wiring board 失效
    制备多层布线板的工艺

    公开(公告)号:US5593526A

    公开(公告)日:1997-01-14

    申请号:US316376

    申请日:1994-09-30

    摘要: A process for producing a multi-layer wiring board having alternate layers of a glass ceramic material and conductor patterns. The glass ceramic layers are made up of a glass ceramic material including a glass matrix and ceramic particles dispersed in the matrix. The glass ceramic layers are caused to contain hollow or porous silica glass spheres dispersed in the glass ceramic material. The hollow or porous silica glass spheres are covered with a ceramic coating layer containing alumina as a constituent element. Such a structure prevents crystallization of the silica spheres and avoids the resultant rapid increase in the the thermal expansion coefficient of the glass ceramic layers. The structure provided by the process of the invention also precudes the formation of pores in the surfaces of the glass ceramic layers.

    摘要翻译: 一种制造具有玻璃陶瓷材料和导体图案的交替层的多层布线板的方法。 玻璃陶瓷层由玻璃基体和分散在基质中的陶瓷粒子组成的玻璃陶瓷材料构成。 使玻璃陶瓷层含有分散在玻璃陶瓷材料中的中空或多孔石英玻璃球。 中空或多孔二氧化硅玻璃球被包含氧化铝作为构成元素的陶瓷涂层覆盖。 这种结构防止了二氧化硅球的结晶,避免了玻璃陶瓷层的热膨胀系数的迅速增加。 本发明方法提供的结构还预示了在玻璃陶瓷层的表面中形成孔隙。