Nitride-based semiconductor element
    73.
    发明授权
    Nitride-based semiconductor element 有权
    氮化物半导体元件

    公开(公告)号:US06713845B2

    公开(公告)日:2004-03-30

    申请号:US10084050

    申请日:2002-02-28

    IPC分类号: H01L2358

    摘要: A nitride-based semiconductor element having excellent element characteristics is obtained by obtaining a nitride-based semiconductor layer having excellent crystallinity without performing a long-time etching process. This nitride-based semiconductor element comprises a mask layer, having a recess portion, formed on a substantially flat upper surface of an underlayer to partially expose the upper surface of the underlayer, a nitride-based semiconductor layer formed on the exposed part of the underlayer and the mask layer while forming a void on the recess portion of the mask layer, and a nitride-based semiconductor element layer, formed on the nitride-based semiconductor layer, having an element region. Thus, the nitride-based semiconductor layer is formed while forming the void on the recess portion of the mask layer when laterally grown on the mask layer, whereby strain of the laterally grown nitride-based semiconductor layer is so relaxed that the nitride-based semiconductor layer is improved in crystallinity. The underlayer is formed in a substantially flat shape, whereby no etching may be performed over a long time dissimilarly to a case of forming recess portions on an underlayer consisting of a nitride-based semiconductor or the like.

    摘要翻译: 通过获得具有优异结晶度的氮化物系半导体层,而不进行长时间蚀刻工艺,可以获得元素特性优异的氮化物系半导体元件。 该氮化物系半导体元件包括具有凹部的掩模层,形成在下层的大致平坦的上表面上以部分地暴露下层的上表面,形成在底层的露出部分上的氮化物系半导体层 以及掩模层,同时在掩模层的凹部上形成空隙,以及形成在具有元件区域的氮化物基半导体层上的氮化物基半导体元件层。 因此,当在掩模层上横向生长时,在掩模层的凹部上形成空隙的同时形成氮化物基半导体层,由此横向生长的氮化物基半导体层的应变如此松弛,使得氮化物基半导体 层的结晶度提高。 底层形成为大致平坦的形状,由此与在由氮化物类半导体等构成的基底上形成凹部的情况不同,长时间不进行蚀刻。

    Method of fabricating semiconductor device

    公开(公告)号:US06624001B2

    公开(公告)日:2003-09-23

    申请号:US10244513

    申请日:2002-09-17

    IPC分类号: H01L2100

    摘要: An AlGaN buffer layer, an undoped GaN layer, an n-GaN contact layer, an n-InGaN crack preventing layer, an n-AlGaN cladding layer, an MQW active layer, and a p-AlGaN cladding layer are formed in this order on a sapphire substrate. A ridge portion is formed in the p-AlGaN cladding layer, and a p-GaN cap layer is formed on an upper surface of the ridge portion. An n-AlGaN first regrown low-temperature buffer layer and an n-AlGaN current blocking layer are formed in this order on a flat portion and on side surfaces of the ridge portion in the p-AlGaN cladding layer. A p-AlGaN second regrown low-temperature buffer layer and a p-GaN contact layer are formed on the n-AlGaN current blocking layer and on the upper surface of the ridge portion.

    Semiconductor device and method of fabricating the same
    75.
    发明授权
    Semiconductor device and method of fabricating the same 有权
    半导体装置及其制造方法

    公开(公告)号:US06534800B1

    公开(公告)日:2003-03-18

    申请号:US09666557

    申请日:2000-09-21

    IPC分类号: H01L3300

    摘要: An AlGaN buffer layer, an undoped GaN layer, an n-GaN contact layer, an n-InGaN crack preventing layer, an n-AlGaN cladding layer, an MQW active layer, and a p-AlGaN cladding layer are formed in this order on a sapphire substrate. A ridge portion is formed in the p-AlGaN cladding layer, and a p-GaN cap layer is formed on an upper surface of the ridge portion. An n-AlGaN first regrown low-temperature buffer layer and an n-AlGaN current blocking layer are formed in this order on a flat portion and on side surfaces of the ridge portion in the p-AlGaN cladding layer. A p-AlGaN second regrown low-temperature buffer layer and a p-GaN contact layer are formed on the n-AlGaN current blocking layer and on the upper surface of the ridge portion.

    摘要翻译: 依次形成AlGaN缓冲层,未掺杂的GaN层,n-GaN接触层,n-InGaN抗裂层,n-AlGaN包层,MQW有源层和p-AlGaN包层 蓝宝石衬底。 在p-AlGaN包层中形成脊部,在该脊部的上表面形成有p-GaN覆盖层。 在p-AlGaN包层的平坦部分和脊部的侧表面上依次形成n-AlGaN第一再生长的低温缓冲层和n-AlGaN电流阻挡层。 在n-AlGaN电流阻挡层和脊部的上表面上形成p-AlGaN第二重新生长的低​​温缓冲层和p-GaN接触层。