摘要:
The present invention relates to a dielectric ceramic composition comprising a main component expressed by a general formula: (Ba1-x-ySrxCay)m(Ti1-zZrz)O3, a first subcomponent comprising Mg oxide, a second subcomponent comprising at least one kind of oxide selected from oxides of Mn and Cr, a third subcomponent comprising R oxide (note R is selected at least one kind from Y, La Ce, Pr, Nd, Sm, Gd, Tb, Dy, Ho and Yb), and a fourth subcomponent comprising an oxide including Si.
摘要:
A process for producing a molded ceiling for a vehicle that, after molding of a molded ceiling, can allow a mill end to be easily separated from a skin material by a nonwoven fabric layer and can easily conduct edge treatment of a base material to improve productivity. In this process for producing a molded ceiling for a vehicle, a base material together with a skin material is set in a mold in which a molding face is formed in a required curved surface, followed by heating and pressing to bond the base material and the skin material to each other and thus to prepare a molded ceiling. A nonwoven fabric layer for facilitating the separation between the base material and the skin material even after molding is previously interposed between the base material and the skin material. A cut, which extends from the backside of the molded ceiling to the base material, is provided, and only the mill end of the base material is separated from the skin material by the nonwoven fabric layer, and an adhesive is coated onto a part from which the mill end of the skin material has been removed. The skin material is wound in and bonded to the edge of the base material to cover the edge with the skin material.
摘要:
A method of manufacturing a pattern can control the shape of a resist mask that forms read terminals in a predetermined pattern with high precision, so that the formation precision of the read terminals is improved and the manufacturing yield of the magnetic head is improved. The method includes: a step of forming a layer to be patterned on a substrate; a step of forming a first mask layer on the layer to be patterned; a step of forming a second mask layer, which has a lower etching rate during a dry etching process than the first mask layer, on the first mask layer; a step of exposing and developing the second-mask layer to form the second mask layer in a predetermined shape; and a step of removing exposed parts of the first mask layer that are exposed from the second mask layer by dry etching and dry etching a part of the first mask layer below the second mask layer from sides thereof to form a column part in the first mask layer that is narrower than the second mask, thereby forming a mask with overhanging parts.
摘要:
A dielectric ceramic composition comprising a main component including BaTiO3, a fourth subcomponent including an oxide of R1 (note that R1 is at least one selected from Y, Ho, Er, Tm, Yb and Lu) and a fifth subcomponent including an oxide of R2 (note that R2 is at least one selected from Dy, Tb, Gd and Eu); wherein a total number of moles of R1 and R2 with respect to 100 moles of the main component is 2 to 6 moles when calculated as a conversion of the R1 and a conversion of the R2, and a ratio of the fifth subcomponent to the total number of moles of R1 and R2 with respect to 100 moles of the main component is in a relationship of 0.5≦R2/(R1+R2)≦0.75 when calculated as a conversion of the R1 and a conversion of the R2. According to the present invention, a high temperature load lifetime and capacity-temperature characteristics can be well balanced even when the dielectric layer of the electronic device is made thin, so that a sufficiently reliable dielectric ceramic composition can be provided.
摘要:
A lever is rotatably mounted on an inner housing of a female connector and assists a fitting operation through engagement of an engagement portion of a locking arm of the female connector with an engagement projection of a male connector and a fitting canceling operation in association with rotation thereof. An opening in the lever allows the tip of a finger of an operator to be brought into contact with an operation access portion of the locking arm so as to press the operation access portion, and a lever locking canceling finger catch portion of the lever is located in a position and formed into a shape which allow the finger of the operator to be hooked thereon such that the tip of the finger is in contact with the operation access portion of the locking arm.
摘要:
A gas sensor is disclosed including a sensor element, an element holder, an atmosphere-side insulator, an atmosphere-side cover, and a pressing member interposed between a shoulder portion of the atmosphere-side cover and a base end face of the atmosphere-side insulator. A heat-transfer restricting support member is associated with at least one of the shoulder portion of the atmosphere-side cover, the base end face of the atmosphere-side insulator and the pressing member to allow the pressing member to be held in contact with the shoulder portion of the atmosphere-side cover and the base end face of the atmosphere-side insulator in a minimum contact surface fore thereby restricting a heat transfer from a distal end of the gas sensor to a base end thereof.
摘要:
A gas sensor includes a sensor element holder, a porcelain insulator, an outer cover disposed on a housing to surround the porcelain insulator, and a sensor element disposed in the housing. The gas sensor also includes outside springs and at least one pair of terminal springs each of which is disposed between the porcelain insulator and the sensor element in abutment with the sensor element. The terminal springs work to form a nip in which a thickness of the sensor element is retained. The outside springs are disposed between the porcelain insulator and the outer cover and have a combined spring constant which is greater than or equal to that of the terminal springs, thereby causing external pressure to be transmitted more to the outside springs than to the terminal springs to suppress vibrations of the porcelain insulator effectively to avoid application of an undesirable impact to the sensor element.
摘要:
An improved structure of a gas sensor designed to withstand physical impact which may result in damage such as cracks to a sensor element built in the gas sensor. Specifically, the gas sensor includes a buffer provided by a clearance between an air cover a porcelain insulator. The clearance is in a range of 1 to 2.5 mm at a minimum. The gas sensor may alternatively have a harder portion in the air cover which has a Vickers hardness of 200 to 400. The gas sensor may alternatively have a rigidity enhancer in the air cover which works to provides an increased rigidity to the air cover.
摘要:
Motion picture data is compression-encoded by a compression encoder with the frame rate changing according to the amount of accumulated data of the buffer, which can adequately change the number of pieces of frame image data to be compression-encoded per unit time, according to the change in the picture of the motion picture. In addition, tracing is done to trace extract image data in the frame image data by using a simple motion vector detected for the frame image data of the motion picture data, a higher layer motion vector detector detects a motion vector of the frame image data by using the simple motion vector in common, and a compression encoder extracts the extract image data based on the results of tracing and compression-encodes it by using the motion vector.
摘要:
A method of manufacturing a surface acoustic wave device formed in one chip and including over a semiconductor substrate at least an IC region and a surface acoustic wave element region that are horizontally disposed, the method including: forming in the IC region over the semiconductor substrate a semiconductor element layer that includes a semiconductor element and an insulation layer covering the semiconductor element and being deposited also in the surface acoustic wave element region; forming over the semiconductor element layer a wire layer that includes a plurality of wires coupled to the semiconductor element and a wire insulating film deposited over the plurality of wires to provide insulation among the wires, the wire insulating film being deposited also over the insulation layer in the surface acoustic wave element region; forming an interlayer insulating film having a flattened surface on the wire insulating film in the IC region and the surface acoustic wave element region; forming a piezoelectric thin film on the interlayer insulating film; and forming a surface acoustic wave element on the piezoelectric thin film in the surface acoustic wave element region.