公开(公告)号：US20220071055A1

公开(公告)日：2022-03-03

申请号：US17004963

申请日：2020-08-27

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  H05K5/06

Abstract: A cold plate that is configurable and for a datacenter liquid cooling system is disclosed. The cold plate includes a first section, a second section, and an intermediate layer, which is changeable and has first channels to enable flow of a coolant through the intermediate layer, and has second channels or at least one adapted second channel to concentrate the coolant or the flow of the coolant to at least one area within the configurable cold plate corresponding to at least a heat generating feature of an associated computing device.

公开(公告)号：US20210267095A1

公开(公告)日：2021-08-26

申请号：US16798216

申请日：2020-02-21

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  G06F1/20

Abstract: A cooling system for a datacenter is disclosed. The datacenter cooling system includes a cooling manifold having a first controllable fluid coupler to receive a coolant from a cooling loop external to the rack and one or more second controllable fluid couplers to distribute the coolant to one or more server cooling manifolds within server trays of a rack within the datacenter.

公开(公告)号：US12193196B2

公开(公告)日：2025-01-07

申请号：US17023695

申请日：2020-09-17

Applicant: Nvidia Corporation

Inventor： Ali Heydari ,  Vladimir Troy

IPC: H05K7/20 ,  G05B13/02 ,  G06N3/045 ,  G06N3/08

Abstract: Systems and methods for cooling a computer environment are disclosed. In at least one embodiment, one or more neural networks can be used to determine one or more temperature control settings associated with one or more servers.

公开(公告)号：US12114469B2

公开(公告)日：2024-10-08

申请号：US17542736

申请日：2021-12-06

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  G05B13/02

CPC classification number: H05K7/20836 ,  G05B13/027 ,  H05K7/20754 ,  H05K7/20763

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a flow controller adapter of a cooling manifold is to interchangeably receive a flow controller of a plurality of flow controllers, wherein a flow controller adapter is associated with a rack-side flow controller and with a tube there between and is configured to be movable within cooling manifold to allow different positions for mating a flow controller with a server-side flow controller of server tray or box.

公开(公告)号：US12069840B2

公开(公告)日：2024-08-20

申请号：US17688290

申请日：2022-03-07

Applicant: Nvidia Corporation

Inventor： Ali Heydari ,  Pardeep Shahi

IPC: H05K7/20

CPC classification number: H05K7/20836 ,  H05K7/20781

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a first interfacing flow controller includes a sensor and is associated with a first server tray of a rack, so that a first interfacing flow controller can receive sensor inputs and can communicate with a second interfacing flow controller by a communication line there between, where a second interfacing flow controller can be associated with a coolant distribution unit (CDU) to cause a balance of coolant flow to be provided from a CDU to one or more second server trays based in part on a change in a coolant flow to a first server tray as indicated by such sensor inputs.

公开(公告)号：US11910576B2

公开(公告)日：2024-02-20

申请号：US17032541

申请日：2020-09-25

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  B60H1/32

CPC classification number: H05K7/20827 ,  B60H1/3202 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20327 ,  H05K7/20381 ,  H05K7/20836

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, an absorption chiller includes a generator vessel to enable removal of heat from fluid returned from at least one computing component of the datacenter.

公开(公告)号：US20230413466A1

公开(公告)日：2023-12-21

申请号：US17845820

申请日：2022-06-21

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/14 ,  H05K7/20 ,  H05K5/02 ,  G06N5/04

CPC classification number: H05K7/1407 ,  H05K7/20836 ,  H05K5/0221 ,  G06N5/04

Abstract: Systems and methods for a datacenter cooling system are disclosed. In at least one embodiment, a quick disconnect (QD) adapter can be associated with a mating rotational coupler of a rack-mounted coolant distribution unit (CDU) by a rotational action on a rotational coupler of a first side of a QD adapter and can be associated with a mating QD coupler of at least one cooling loop by a linear action on a linear coupler of a second side a QD adapter.

公开(公告)号：US11829215B2

公开(公告)日：2023-11-28

申请号：US17107138

申请日：2020-11-30

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: G06F1/20

CPC classification number: G06F1/206

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, an alternate cooling loop with its own fluid source and a liquid-to-liquid heat exchanger is used to provide cooling for the at least one computing component alternatively from a secondary cooling loop that is associated with a primary cooling loop and a chilling facility.

公开(公告)号：US20230371212A1

公开(公告)日：2023-11-16

申请号：US17741108

申请日：2022-05-10

Applicant: Nvidia Corporation

Inventor： Ali Heydari ,  Pardeep Shahi

IPC: H05K7/20

CPC classification number: H05K7/20836 ,  H05K7/202 ,  H05K7/20209 ,  H05K7/20281 ,  H05K7/20409 ,  H05K7/20736

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a primary cooling loop includes at least one primary flow controller to control flow of a primary coolant to a coolant distribution unit (CDU) at a primary flow rate that is determined based in part on heat generated from one or more computing devices that is to be addressed by a secondary coolant, which is to be cooled in a CDU by a primary coolant at a primary flow rate enabled by at least one primary flow controller.

公开(公告)号：US20230301023A1

公开(公告)日：2023-09-21

申请号：US17698387

申请日：2022-03-18

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

CPC classification number: H05K7/20327 ,  H05K7/20836 ,  H05K7/20818

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a cold plate includes folded heat dissipation features to be cooled by at least one two-phase fluid via folded heat dissipation features having first and second channels of different widths; having first mechanical couplings for top portions of such folded heat dissipation features to an upper section of a cold pate; and having second mechanical couplings for bottom portions of the folded heat dissipation features to a lower section of the cold plate.