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公开(公告)号：US20180045663A1
公开(公告)日：2018-02-15
申请号：US15674127
申请日：2017-08-10
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
CPC classification number: G01N27/128 , G01N33/0016 , G01N33/0031
Abstract: Disclosed is a micro sensor. Particularly, a first sensor electrode is provided on a first side of a substrate, a second sensor electrode is provided on a second side of the substrate, and the substrate is provided with an etching hole penetrating from the first side to the second side of the substrate. A sensing material provided between the first sensor electrode and the second sensor electrode is inserted in the etching hole. When detecting gas, the micro sensor can minimize influence of moisture in air.
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公开(公告)号：US20160035489A1
公开(公告)日：2016-02-04
申请号：US14816182
申请日：2015-08-03
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK
Abstract: The present invention relates to a multi-layered aluminum oxide capacitor comprising an aluminum substrate; a plurality of aluminum oxide layer formed in at least a portion of on both sides or one side of the substrate with respect to the aluminum substrate; and a plurality of electrode layers formed on the aluminum oxide layers. According to the present invention, manufacturing process is more simplified since Al2O3 insulation layer is formed by anodizing the aluminum layer without forming an extra insulation layer after forming the aluminum layer, so that the manufacturing cost can be reduced, and also a multi-layered capacitor having a high capacitance and a high reliability can be provided by stacking capacitors comprising a plurality of aluminum oxide layers using a more simplified process according to the present invention.
Abstract translation: 本发明涉及包含铝基板的多层氧化铝电容器; 多个氧化铝层，相对于铝基板在基板的两侧或一侧的至少一部分上形成; 以及形成在氧化铝层上的多个电极层。 根据本发明，由于通过在形成铝层之后不形成额外的绝缘层来阳极氧化铝层来形成Al 2 O 3绝缘层，所以制造工艺更简化，从而可以降低制造成本，并且还可以使用多层电容器 可以通过使用根据本发明的更简化的工艺堆叠包含多个氧化铝层的电容器来提供高电容和高可靠性。
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公开(公告)号：US20240426871A1
公开(公告)日：2024-12-26
申请号：US18684829
申请日：2022-07-29
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
Abstract: Proposed is a vertical probe card capable of effectively testing the electrical characteristics of a test object without a body thereof being elastically bent or curved in a convex shape in the horizontal direction by pressure applied to opposite ends thereof.
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公开(公告)号：US20240274564A1
公开(公告)日：2024-08-15
申请号：US18567363
申请日：2022-06-03
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
IPC: H01L23/00
CPC classification number: H01L24/13 , H01L24/11 , H01L2224/1111 , H01L2224/11462 , H01L2224/13012 , H01L2224/13014 , H01L2224/13018 , H01L2224/13082 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/1318 , H01L2224/13181 , H01L2224/13184
Abstract: The present invention relates to a micro bump, which is capable of coping with a narrow pitch between terminals and preventing an increase in current density and thermal energy density at a bump connection portion, and to an interposer for electrical connection having same, a semiconductor package, a multi-layer stacked semiconductor device, and a display. The micro bump may be manufactured using: an electrically conductive material part forming step of forming an electrically conductive material part inside a through hole provided in a body made of an anodized film; and a bonding material part forming step of forming a bonding material part on at least a portion of an upper portion and a lower portion of the electrically conductive material part.
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公开(公告)号：US20240159795A1
公开(公告)日：2024-05-16
申请号：US18284066
申请日：2022-03-22
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Chang Hee HONG
IPC: G01R1/04
CPC classification number: G01R1/0466
Abstract: Proposed is an electrically conductive contact pin, including a pin portion including a first contact portion, a second contact portion, and an elastic portion between the first contact portion and the second contact portion, a fixing portion provided outside the pin portion, and a connecting portion provided between the pin portion and the fixing portion to connect the pin portion and the fixing portion to each other.
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Patent Agency Ranking
公开(公告)号：US20240118335A1
公开(公告)日：2024-04-11
申请号：US18485252
申请日：2023-10-11
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Young Heum EOM
CPC classification number: G01R31/2635 , G01R1/0416 , H05K1/118 , H05K2201/10106
Abstract: Proposed are a test device and a manufacturing method of the test device capable of testing a test object that is provided with an electrode which has a size and/or a pitch distance ranging from 1 to 100 micrometers (μm).
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公开(公告)号：US20240094248A1
公开(公告)日：2024-03-21
申请号：US18275217
申请日：2022-01-27
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Chang Hee HONG
IPC: G01R1/067
CPC classification number: G01R1/06716 , G01R1/06733
Abstract: An electrically conductive contact pin which prevents a fatigue fracture in a void part by distributing stress concentration in the void part is provided. The electrically conductive contact pin includes: a first surface; a second surface facing the first surface; a lateral surface for connecting the first surface and the second surface; and a void part formed inside the electrically conductive contact pin by passing through the first surface and the second surface along the length direction of the electrically conductive contact pin. The void part includes: a center void part; and an end void part communicating with the center void part and extending toward an end side of the electrically conductive contact pin, wherein the width of the end void part is narrower than the width of the center void part.
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公开(公告)号：US20240038569A1
公开(公告)日：2024-02-01
申请号：US18037081
申请日：2021-12-08
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Jeong Hyuk LEE
IPC: H01L21/683
CPC classification number: H01L21/6835 , H01L2221/68354 , H01L2221/68322
Abstract: A micro device, a micro device alignment apparatus, and an alignment method using the same are proposed. In a micro device that has to be aligned with at least any one surface of front and rear surfaces of the micro device when mounted on a substrate and simultaneously be aligned with any one direction of the micro device when mounted on the substrate, there is provided the micro device, the micro device alignment apparatus, and the alignment method using the same so that surface alignment and direction alignment are simultaneously performed for a plurality of micro devices that is not aligned with at least any one surface of the front and rear surfaces and simultaneously is not aligned with any one direction.
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公开(公告)号：US20230352229A1
公开(公告)日：2023-11-02
申请号：US18298936
申请日：2023-04-11
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Tae Hwan SONG
CPC classification number: H01F27/2804 , H01F27/29 , H01F41/041 , H01F2027/2809
Abstract: Proposed are an inductor and a manufacturing method thereof. More particularly, proposed are an inductor capable of mass production by simplifying the manufacturing process while satisfying the needs for miniaturization and low resistance, and a manufacturing method thereof.
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公开(公告)号：US20230160926A1
公开(公告)日：2023-05-25
申请号：US17919742
申请日：2021-04-20
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
IPC: G01R1/073
CPC classification number: G01R1/07342 , G01R1/07378
Abstract: Proposed is a probe card. The probe card according to the present disclosure includes: a circuit board; a probe head having a guide plate, and through which a plurality of probes pass; and a connection member electrically connecting the circuit board and the probes to each other, wherein an insulating part of the connection member and the guide plate are made of an anodic aluminum oxide film formed by anodizing a metal as a base material.
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