摘要:
A pixel data compression/decompression system, medium, and method, including determining the similarity between a first pixel data and a second pixel data adjacent to the first pixel data, selecting one of a first compression mode, where a difference between a compression ratio of the first pixel data and a compression ratio of the second pixel data is high, and a second compression mode, where a difference between a compression ratio of the first pixel data and a compression ratio of the second pixel data is low, based on the similarity, and compressing the first pixel data and the second pixel data based on the selected compression mode.
摘要:
Provided are a method and apparatus for correcting an error of a gyro sensor, and more particularly, a method and apparatus for correcting an error of a gyro sensor installed in a mobile robot.
摘要:
The present invention relates to a side illumination lens and a luminescent device using the same, and provides a body, a total reflection surface with a total reflection slope with respect to a central axis of the body, and a linear and/or curved refractive surface(s) formed to extend from a periphery of the total reflection surface; and a luminescent device including the lens. According to the present invention, a lens with total internal reflection surfaces with different slopes, and a linear and/or curved refractive surface(s) allows light emitted forward from a luminescent chip to be guided to a side of the lens. Further, a linear surface(s) formed in a direction perpendicular or parallel to a central axis of a lens and a curved surface are formed on an edge of the lens so that a process of fabricating the lens is facilitated, thereby reducing a defective rate and fabrication costs of the lens.
摘要:
A refrigerator is disclosed, comprising, a partition member configured to partition a front opening of a cooling chamber into a plurality of small openings, and an assembly guide formed between the partition member and a refrigerator main body and configured to guide the coupling of the partition member, whereby the partition member can fast easily be coupled to an accurate position and a malfunction and a leakage of cold air can be avoided.
摘要:
A memory module having a start-type topology and a method of fabricating the same are provided. The memory module includes a substrate. Memory devices are mounted on the substrate in at least two rows and at least two columns. A star-type topology is disposed to be electrically connected to the memory devices. One or more pairs of adjacent ones of the memory devices have a point-symmetric structure.
摘要:
A storage device for a refrigerator includes a storage box defining a storage chamber storing food therein and installed removably in a storage space, an opening/closing unit for opening/closing partly or fully the storage chamber, and a guide unit for guiding the opening/closing of the storage chamber by the opening/closing unit. An apparatus/method is provided.
摘要:
A surround sound virtualization apparatus and method. The surround sound virtualization apparatus may include an audio decoder to perform head-related transfer function (HRTF) filtering, and a time delay unit to provide a time delay to a plurality of output signals of the audio decoder.
摘要:
A phase change memory device includes a bottom electrode on a substrate, a phase change material pattern on the bottom electrode, and a top electrode on the phase change material pattern. The phase change material pattern includes at least 50 percent antimony (Sb).
摘要:
Provided are a method and apparatus for performing power consumption based handover between hybrid networks. The method includes listing candidate networks based on a traffic class and terminal power consumption expected for each of the hybrid networks, and selecting a network for the handover according to the traffic class and a user preference from among the listed candidate networks. Accordingly, power can be saved, and simultaneously a network can be effectively selected.
摘要:
Embodiments of the invention include a stacked board-on-chip (BOC) package having a mirroring structure and a dual inline memory module (DIMM) on which the stacked BOC package is mounted. A bottom surface of a first semiconductor chip faces a bottom surface of a second semiconductor chip. An interposer electrically connects first and second packages, respectively comprising the first and second semiconductor chips, to each other. The DIMM is obtained by electrically connecting BOC packages to each other on upper and lower substrates of a printed circuit board. Since a height of the stacked BOC packages is greater than a height of a conventional stacked BOC package, the DIMM has a minimum stub length and an optimal topology. Hence, the DIMM can have a signal with excellent fidelity by reducing a load upon a signal line, and installation or wiring of components within the DIMM 300 requires less effort.