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公开(公告)号：US10957477B2
公开(公告)日：2021-03-23
申请号：US16059747
申请日：2018-08-09
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chan Yoon , Dong Hwan Lee , Young Ghyu Ahn , Won Chul Sim
Abstract: An inductor includes a body including a support member having a first through-hole, a second through-hole, a first via-hole and a second via-hole, the first and second via-holes being spaced apart from the first and second through-holes, a first coil unit and a second coil unit disposed on one surface of the support member, a third coil unit and a fourth coil unit facing the one surface of the support member, and an encapsulant encapsulating the support member and the first to fourth coil units and including a magnetic material, and a first external electrode to a fourth external electrode respectively connected to the first to fourth coil units on an external surface of the body. The encapsulant includes a first encapsulant and a second encapsulant having magnetic permeability different from each other.
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公开(公告)号：US20210020371A1
公开(公告)日：2021-01-21
申请号：US16774569
申请日：2020-01-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hwi Dae Kim , Ji Hong JO , Woo Chul Shin , Chan Yoon , Sang Soo Park
Abstract: A multilayer capacitor and a board having the multilayer capacitor mounted thereon are provided. The multilayer capacitor includes a capacitor body including a dielectric layer and first and second internal electrodes, and first and second external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the first and second internal electrodes, respectively. A/B satisfies 0.0016≤A/B
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公开(公告)号：US10535459B2
公开(公告)日：2020-01-14
申请号：US15290172
申请日：2016-10-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chan Yoon , Dong Hwan Lee , Young Ghyu Ahn
IPC: H01F17/00
Abstract: A coil component includes: a body having coil portions disposed therein and exposed to one or more of surfaces of the body opposing each other in a width direction; external electrodes disposed on external surfaces of the body and connected to the coil portions; and insulating layers further disposed on the exposed coil portions.
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公开(公告)号：US10192673B2
公开(公告)日：2019-01-29
申请号：US15457202
申请日：2017-03-13
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chan Yoon , Dong Hwan Lee , Young Ghyu Ahn
Abstract: An inductor includes a body including a coil part therein. The coil part includes a support member and first and second coil patterns respectively formed on an upper surface and a lower surface of the support member, and 1.15≤b/a≤1.45, where a is a length from a central plane between the upper surface and the lower surface of the support member to an upper surface of the body, and b is a length from the central plane of the support member to a lower surface of the body.
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公开(公告)号：US10079089B1
公开(公告)日：2018-09-18
申请号：US15721170
申请日：2017-09-29
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chan Yoon , Dong Hwan Lee , Young Ghyu Ahn
IPC: H01F27/28 , H05K1/18 , H01F27/255
Abstract: A coil electronic component includes: a body; first and second external electrodes disposed on opposite surfaces of the body in a first direction parallel to a mounting surface of the body; a support member disposed in a second direction, perpendicular to the mounting surface of the body and including a protrusion portion extending in the second direction; and a coil disposed on at least one surface of the support member.
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Patent Agency Ranking
公开(公告)号：US10056183B2
公开(公告)日：2018-08-21
申请号：US14621282
申请日：2015-02-12
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chan Yoon , Dong Hwan Lee , Young Ghyu Ahn
CPC classification number: H01F27/292 , H01F1/34 , H01F5/00 , H01F17/0013 , H01F27/02 , H01F2017/0066
Abstract: There are provided a coil component and a board having the same. The coil component may include: a magnetic body including a substrate having two cores, first and second coil parts disposed on one surface of the substrate, and third and fourth coil parts disposed on the other surface of the substrate; a connection part disposed to penetrate through the two cores in the magnetic body and connecting the two cores to each other; and first to fourth external electrodes disposed on outer surfaces of the magnetic body and connected to the first to fourth coil parts.
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公开(公告)号：US20180148854A1
公开(公告)日：2018-05-31
申请号：US15881296
申请日：2018-01-26
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hye Yeon CHA , Dong Hwan LEE , Jung Hyuk JUNG , Chan Yoon , Hye Min Bang , Tae Young KIM
Abstract: There are provided a chip electronic component and a manufacturing method thereof, and more particularly, a chip electronic component having an internal coil structure capable of preventing the occurrence of short-circuits between coil portions and having a high aspect ratio (AR) by increasing a thickness of a coil as compared to a width of the coil, and a manufacturing method thereof.
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公开(公告)号：US09942987B2
公开(公告)日：2018-04-10
申请号：US15229354
申请日：2016-08-05
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chan Yoon , Dong Hwan Lee , Young Ghyu Ahn
CPC classification number: H05K1/181 , H01F17/0013 , H01F17/0033 , H01F27/085 , H01F27/292 , H05K3/3442 , H05K2201/1003 , H05K2201/10636 , Y02P70/611
Abstract: A coil component includes: an internal coil; a magnetic body having the internal coil embedded therein, and having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction; and external electrodes connected to the internal coil and disposed on outer surfaces of the magnetic body. 0
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公开(公告)号：US09900987B2
公开(公告)日：2018-02-20
申请号：US15089805
申请日：2016-04-04
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chan Yoon , Dong Hwan Lee , Young Ghyu Ahn
CPC classification number: H05K1/181 , H01F17/0013 , H01F17/0033 , H01F17/04 , H01F27/292 , H01F2017/048 , H05K2201/1003
Abstract: There are provided a coil component and a board for mounting the same. The coil component includes a magnetic body including first and second coil portions disposed on one surface of a substrate and disposed linearly, based on a central portion of the magnetic body, and third and fourth coil portions disposed on the other surface of the substrate and disposed linearly, based on the central portion of the magnetic body; and first to fourth external electrodes disposed on an external surface of the magnetic body and connected to the first to fourth coil portions. The first coil portion and the third coil portion have a first core portion, and the second coil portion and the fourth coil portion have a second core portion. A peripheral portion disposed outwardly of the first to fourth coil portions has greater permeability than that of the first and second core portions.
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公开(公告)号：US09490062B2
公开(公告)日：2016-11-08
申请号：US14459172
申请日：2014-08-13
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chan Yoon , Dong Hwan Lee , Tae Young Kim
CPC classification number: H01F27/292 , H01F17/0013 , H01F2017/0066
Abstract: A chip electronic component may include: a magnetic body including an insulating substrate; internal conductive pattern parts disposed on at least one surface of the insulating substrate; external electrodes disposed on the magnetic body and connected to the internal conductive pattern parts; and an additional magnetic layer disposed on a bottom surface of the magnetic body and covering portions of the external electrodes disposed on the bottom surface of the magnetic body.
Abstract translation: 芯片电子部件可以包括：包括绝缘基板的磁体; 设置在所述绝缘基板的至少一个表面上的内部导电图案部分; 设置在磁体上并连接到内部导电图案部分的外部电极; 以及设置在磁体的底面上并覆盖设置在磁性体的底面上的外部电极的部分的附加磁性层。
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