Multilayer ceramic electronic component

    公开(公告)号:US10395840B1

    公开(公告)日:2019-08-27

    申请号:US16257642

    申请日:2019-01-25

    摘要: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately laminated with respective dielectric layers disposed therebetween, first and second external electrodes disposed on first and second external surfaces of the ceramic body, respectively, the first and second external electrodes each including first and second base electrode layers having at least a portion in contact with first and second external surfaces of the ceramic body, respectively, and first and second plating layers disposed to cover the first and second base electrode layers, respectively, and a water repellent layer disposed to cover both external side surfaces of the first and second plating layers and a surface of the ceramic body.

    Multilayer capacitor and board having the same mounted thereon

    公开(公告)号:US11961682B2

    公开(公告)日:2024-04-16

    申请号:US18143738

    申请日:2023-05-05

    摘要: A multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, the capacitor body having first to sixth surfaces, the first internal electrode being exposed through the third, fifth, and sixth surfaces, and the second internal electrode being exposed through the fourth, fifth, and sixth surfaces, a first side portion and a second side portion, respectively disposed on the fifth surface and the sixth surface of the capacitor body, and a first external electrode and a second external electrode, respectively connected to the third surface and the fourth surface of the capacitor body to be respectively connected to the first internal electrode and the second internal electrode. The first and second side portions include an acicular second phase including a glass including aluminum (Al) and silicon (Si), manganese (Mn), and phosphorus (P).

    Multilayer electronic component
    75.
    发明授权

    公开(公告)号:US11600443B2

    公开(公告)日:2023-03-07

    申请号:US17501331

    申请日:2021-10-14

    摘要: A multilayer electronic component in the example embodiment includes a Si-organic compound layer including a body covering portion disposed on a region of an exterior surface of a body between external electrodes and an extended portion extending from the body covering portion to a region between a plating layer and an additional plating layer of the external electrode, thereby having improved warpage strength and moisture resistance.

    Multilayer capacitor and substrate including the same mounted thereon

    公开(公告)号:US11594375B2

    公开(公告)日:2023-02-28

    申请号:US16778673

    申请日:2020-01-31

    摘要: A multilayer capacitor includes a capacitor body having an active region, upper and lower cover regions, and width margins on opposing sides of the active region. The width margin includes a first region on an internal side thereof adjacent the first and second internal electrodes and a second region on an external side between the first region and a respective external surface of the capacitor body, and the upper and lower cover regions each include a third region on an internal side thereof adjacent the internal electrodes and a fourth region on an external side between the third region and a respective external surface of the capacitor body. The active region, the second region, and the fourth region have a same dielectric constant A, and the first and third regions have a same dielectric constant B, and A and B are different from each other and satisfy 0.5≤B/A.

    Multi-layered ceramic capacitor
    79.
    发明授权

    公开(公告)号:US11495409B2

    公开(公告)日:2022-11-08

    申请号:US16782616

    申请日:2020-02-05

    摘要: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes having different sizes to each other, and having first and second surfaces of the first and second internal electrodes, opposing each other in a stacking direction, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces and connected to the third and fourth surfaces, and opposing each other; and first and second external electrodes. When a margin of the first internal electrode in a longitudinal direction is b, and a margin of the first internal electrode in a width direction is d, a margin of the second internal electrode in a longitudinal direction is a, and a margin of the second internal electrode in a width direction is c, a ratio (a/b) of the margin (a) of the second internal electrode in the longitudinal direction to the margin (b) of the first internal electrode in the longitudinal direction is 0.33 or more (where, a>0 and b>0) or a ratio (c/d) of the margin (c) of the second internal electrode in the width direction to the margin (d) of the first internal electrode in the width direction is 0.33 or more (where, c>0 and d>0).

    Multilayer electronic component
    80.
    发明授权

    公开(公告)号:US11450481B2

    公开(公告)日:2022-09-20

    申请号:US17181331

    申请日:2021-02-22

    IPC分类号: H01G4/005 H01G4/08 H01G4/30

    摘要: A multilayer electronic component includes a body including dielectric layers and internal electrodes alternately disposed in a first direction, and external electrodes disposed on the body to be connected to the internal electrodes. At least one internal electrode of the internal electrodes includes a plurality of disconnected portions penetrating through a respective internal electrode. A disconnected portion of the plurality of disconnected portions includes at least one of a pore or a dielectric substance disposed to connect adjacent dielectric layers to each other. A dielectric filling ratio, defined as a ratio of an overall length of the dielectric substance to an overall length of the disconnected portion on a cross section in the third and first directions, is more than 20% to 80% or less.