摘要:
A random number generating device includes a semiconductor device including a source region, a drain region, a channel region provided between the source region and the drain region, and an insulating portion provided on the channel region, the insulating portion including a trap insulating film having traps based on dangling bonds and expressed by Six(SiO2)y(Si3N4)1-yMz (M is an element other than Si, O, and N, x≧0, 1≧y≧0, z≧0, the case where x=0 and y=1 and z=0 is excluded), conductivity of the channel region varying randomly depending on the amount of charge caught in the traps, and a random number generating unit connected to the semiconductor device and generating random numbers based on a random variation in the conductivity of the channel region.
摘要翻译:随机数发生装置包括:半导体器件,包括源区域,漏极区域,设置在源极区域和漏极区域之间的沟道区域;以及绝缘部分,设置在沟道区域上,绝缘部分包括捕获绝缘膜, 基于悬挂键并由六(SiO 2)y(Si 3 N 4)1-yMz表示的陷阱(M是除Si,O和N之外的元素,x≥0,1≥y≥0,z≥0, x = 0且y = 1,z = 0),根据陷阱中捕获的电荷量随机地变化的信道区域的电导率和连接到半导体器件的随机数生成单元,并基于 通道区域的电导率随机变化。
摘要:
A complementary metal oxide semiconductor (CMOS) circuit having integrated functional devices such as nanowires, carbon nanotubes, magnetic memory cells, phase change memory cells, ferroelectric memory cells or the like. The functional devices are integrated with the CMOS circuit. The functional devices are bonded (e.g. by direct bonding, anodic bonding, or diffusion bonding) to a top surface of the CMOS circuit. The functional devices are fabricated and processed on a carrier wafer, and an attachment layer (e.g. SiO2) is deposited over the functional devices. Then, the CMOS circuit and attachment layer are bonded. The carrier wafer is removed (e.g. by etching). The functional devices remain attached to the CMOS circuit via the attachment layer. Apertures are etched through the attachment layer to provide a path for electrical connections between the CMOS circuit and the functional devices.
摘要:
A memory circuit that retains stored data upon power down includes a volatile data storage circuit; and at least one nonvolatile memory coupled within the volatile data storage circuit, wherein the at least one nonvolatile memory includes a high resistive state and a low resistive state. The volatile data storage circuit can include cross-coupled inverters, cross-coupled NAND gates, or another volatile data storage circuit. The nonvolatile memories can include a spin-injection magnetic tunnel junction memory, a magnetic tunnel junction memory, a metal insulator phase change memory, an organic memory, or some other memory with two resistive states.
摘要:
A control circuit for providing a control signal to build a logic circuit includes a latch circuit including first and second inverted logic gates; a first variable resistive memory provided between an output of the first inverted logic gate and an input of the second inverted logic gate, the first variable resistive memory configured to store a resistance value in accordance with a write signal; and a resistive element provided between an input of the first inverted logic gate, wherein the output of the second inverted logic gate serves to transmit the control signal.
摘要:
A semiconductor device according to the invention is constructed as below. A charge accumulating layer which contains a magnetic substance is formed directly on a semiconductor substrate, and a gate insulating film is formed on the charge accumulating layer. Further, a gate electrode is formed on the gate insulating film, and source and drain regions formed in surface portions of the semiconductor substrate such that the gate electrode is interposed therebetween. Another semiconductor device according to the invention is constructed as below. A first gate insulating film formed on a semiconductor substrate, and a charge accumulating layer which contains a magnetic substance is formed on the first gate insulating film. Further, a second gate insulating film is formed on the charge accumulating layer, and a gate electrode is formed on the second gate insulating film. Source and drain regions formed in surface portions of the semiconductor substrate such that the gate electrode is interposed therebetween.
摘要:
A device structure provides improved efficiency of light emission from a light emitting element made of silicon while rendering such emission electrically controllable. Silicon in the light emitting element comprises fine microcrystals, which are miniaturized sufficiently to cause a quantum size effect. The microcrystals may be 10 nanometers (nm) or less in grain size. A dielectric film of 5 nm thick or less is formed containing therein such microcrystals. The microcrystal structure section is disposed between p- and n-type semiconductor layers. These layers are brought into electrical contact with the microcrystal structure only, while causing the remaining portions to be electrically insulative by a dielectric film or the like. Elementary particles of the opposite polarities, e.g. electrons and holes, are injected by tunnel effect into the microcrystals resulting in emission of light rays with increased efficiency.