摘要:
A random number generating device includes: a pulse voltage generator configured to generate a pulse voltage having an amplitude of 26 mV or more; a random noise generating element including source and drain regions formed at a distance from each other on a semiconductor substrate, a tunnel insulating film formed on a portion of the semiconductor substrate located between the source region and the drain region, and a gate electrode formed above the tunnel insulating film and to which the pulse voltage is applied, the random noise generating element configured to generate a random noise contained in a current flowing between the source region and the drain region; and a random number generating unit configured to generate a random number signal based on the random noise.
摘要:
A complementary metal oxide semiconductor (CMOS) circuit having integrated functional devices such as nanowires, carbon nanotubes, magnetic memory cells, phase change memory cells, ferroelectric memory cells or the like. The functional devices are integrated with the CMOS circuit. The functional devices are bonded (e.g. by direct bonding, anodic bonding, or diffusion bonding) to a top surface of the CMOS circuit. The functional devices are fabricated and processed on a carrier wafer, and an attachment layer (e.g. SiO2) is deposited over the functional devices. Then, the CMOS circuit and attachment layer are bonded. The carrier wafer is removed (e.g. by etching). The functional devices remain attached to the CMOS circuit via the attachment layer. Apertures are etched through the attachment layer to provide a path for electrical connections between the CMOS circuit and the functional devices.
摘要:
A memory circuit that retains stored data upon power down includes a volatile data storage circuit; and at least one nonvolatile memory coupled within the volatile data storage circuit, wherein the at least one nonvolatile memory includes a high resistive state and a low resistive state. The volatile data storage circuit can include cross-coupled inverters, cross-coupled NAND gates, or another volatile data storage circuit. The nonvolatile memories can include a spin-injection magnetic tunnel junction memory, a magnetic tunnel junction memory, a metal insulator phase change memory, an organic memory, or some other memory with two resistive states.
摘要:
A control circuit for providing a control signal to build a logic circuit includes a latch circuit including first and second inverted logic gates; a first variable resistive memory provided between an output of the first inverted logic gate and an input of the second inverted logic gate, the first variable resistive memory configured to store a resistance value in accordance with a write signal; and a resistive element provided between an input of the first inverted logic gate, wherein the output of the second inverted logic gate serves to transmit the control signal.
摘要:
A semiconductor device according to the invention is constructed as below. A charge accumulating layer which contains a magnetic substance is formed directly on a semiconductor substrate, and a gate insulating film is formed on the charge accumulating layer. Further, a gate electrode is formed on the gate insulating film, and source and drain regions formed in surface portions of the semiconductor substrate such that the gate electrode is interposed therebetween. Another semiconductor device according to the invention is constructed as below. A first gate insulating film formed on a semiconductor substrate, and a charge accumulating layer which contains a magnetic substance is formed on the first gate insulating film. Further, a second gate insulating film is formed on the charge accumulating layer, and a gate electrode is formed on the second gate insulating film. Source and drain regions formed in surface portions of the semiconductor substrate such that the gate electrode is interposed therebetween.
摘要:
A device structure provides improved efficiency of light emission from a light emitting element made of silicon while rendering such emission electrically controllable. Silicon in the light emitting element comprises fine microcrystals, which are miniaturized sufficiently to cause a quantum size effect. The microcrystals may be 10 nanometers (nm) or less in grain size. A dielectric film of 5 nm thick or less is formed containing therein such microcrystals. The microcrystal structure section is disposed between p- and n-type semiconductor layers. These layers are brought into electrical contact with the microcrystal structure only, while causing the remaining portions to be electrically insulative by a dielectric film or the like. Elementary particles of the opposite polarities, e.g. electrons and holes, are injected by tunnel effect into the microcrystals resulting in emission of light rays with increased efficiency.