公开(公告)号：US20150214272A1

公开(公告)日：2015-07-30

申请号：US14685123

申请日：2015-04-13

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Shiu-Ko JangJian ,  Chi-Cherng Jeng ,  Volume Chien ,  Ying-Lang Wang

IPC: H01L27/146

CPC classification number: H01L27/14687 ,  H01L27/1462 ,  H01L27/14623 ,  H01L27/1463 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14685 ,  H01L31/18

Abstract: A backside illumination image sensor structure comprises an image sensor formed adjacent to a first side of a semiconductor substrate, wherein an interconnect layer is formed over the first side of the semiconductor substrate, a backside illumination film formed over a second side of the semiconductor substrate, a metal shielding layer formed over the backside illumination film and a via embedded in the backside illumination film and coupled between the metal shielding layer and the semiconductor substrate.

Abstract translation: 背面照明图像传感器结构包括与半导体衬底的第一侧相邻形成的图像传感器，其中在所述半导体衬底的第一侧上形成有互连层，形成在所述半导体衬底的第二侧上的背面照明膜， 形成在背面照明膜上的金属屏蔽层和嵌入在背面照明膜中并且连接在金属屏蔽层和半导体基板之间的通孔。

公开(公告)号：US09093430B2

公开(公告)日：2015-07-28

申请号：US14059102

申请日：2013-10-21

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： I-Chih Chen ,  Ying-Hao Chen ,  Chi-Cherng Jeng ,  Volume Chien ,  Fu-Tsun Tsai ,  Kun-Huei Lin

IPC: H01L23/48 ,  G06F17/50

CPC classification number: H01L23/5226 ,  G06F17/5077 ,  H01L21/76805 ,  H01L21/76877 ,  H01L21/76897 ,  H01L23/3171 ,  H01L23/481 ,  H01L23/522 ,  H01L23/528 ,  H01L23/5283 ,  H01L23/5329 ,  H01L24/03 ,  H01L24/05 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/94 ,  H01L25/50 ,  H01L2224/03616 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05022 ,  H01L2224/05085 ,  H01L2224/05092 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05184 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05684 ,  H01L2224/16145 ,  H01L2224/29006 ,  H01L2224/29186 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/94 ,  H01L2924/0002 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2924/00012

Abstract: A semiconductor device includes a first layer including a number of first layer metal pads, a second layer formed on top of the first layer, the second layer including a number of second layer metal pads, and vias connecting the first layer metal pads to the second layer metal pads. A surface area overlap between the first layer metal pads and the second layer metal pads is below a defined threshold.

Abstract translation: 半导体器件包括包括多个第一层金属焊盘的第一层，形成在第一层顶部上的第二层，第二层包括多个第二层金属焊盘，以及将第一层金属焊盘连接到第二层金属焊盘的通孔 层金属垫。 第一层金属焊盘和第二层金属焊盘之间的表面积重叠低于规定的阈值。

公开(公告)号：US09024369B2

公开(公告)日：2015-05-05

申请号：US13718688

申请日：2012-12-18

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Shiu-Ko JangJian ,  Chi-Cherng Jeng ,  Volume Chien ,  Ying-Lang Wang

IPC: H01L31/113 ,  H01L31/062 ,  H01L31/18 ,  H01L27/146

CPC classification number: H01L27/14687 ,  H01L27/1462 ,  H01L27/14623 ,  H01L27/1463 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14685 ,  H01L31/18

Abstract: A backside illumination image sensor structure comprises an image sensor formed adjacent to a first side of a semiconductor substrate, wherein an interconnect layer is formed over the first side of the semiconductor substrate, a backside illumination film formed over a second side of the semiconductor substrate, a metal shielding layer formed over the backside illumination film and a via embedded in the backside illumination film and coupled between the metal shielding layer and the semiconductor substrate.

Abstract translation: 背面照明图像传感器结构包括与半导体衬底的第一侧相邻形成的图像传感器，其中在所述半导体衬底的第一侧上形成有互连层，形成在所述半导体衬底的第二侧上的背面照明膜， 形成在背面照明膜上的金属屏蔽层和嵌入在背面照明膜中并且连接在金属屏蔽层和半导体基板之间的通孔。

公开(公告)号：US20140210029A1

公开(公告)日：2014-07-31

申请号：US13754612

申请日：2013-01-30

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： I-I Cheng ,  Chih-Kang Chao ,  Volume Chien ,  Chi-Cherng Jeng ,  Pin Chia Su ,  Chih-Mu Huang

IPC: H01L21/82 ,  H01L27/14

CPC classification number: H01L27/14645 ,  H01L21/82 ,  H01L23/585 ,  H01L27/14 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/1463 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A die includes a first plurality of edges, and a semiconductor substrate in the die. The semiconductor substrate includes a first portion including a second plurality of edges misaligned with respective ones of the first plurality of edges. The semiconductor substrate further includes a second portion extending from one of the second plurality of edges to one of the first plurality of edges of the die. The second portion includes a first end connected to the one of the second plurality of edges, and a second end having an edge aligned to the one of the first plurality of edges of the die.

Abstract translation: 模具包括第一多个边缘以及模具中的半导体衬底。 半导体衬底包括第一部分，其包括与第一多个边缘中的相应边缘不对准的第二多个边缘。 半导体衬底还包括从第二多个边缘之一延伸到管芯的第一多个边缘之一的第二部分。 第二部分包括连接到第二多个边缘中的一个边缘的第一端和具有与模具的第一多个边缘中的一个边缘对准的边缘的第二端。