摘要:
A cleaning member includes a core bar, an elastic coating layer, and high-friction coefficient parts provided on both ends of the cleaning member. The high-friction coefficient parts include an elastic material. Outer peripheries of the high-friction coefficient parts are inclined with respect to an axial direction of the core bar. The cleaning member is roller-shaped and is configured to clean a surface of a roller member to be cleaned in contact therewith. A charging device and a process cartridge also include the cleaning member.
摘要:
A magnetic sensor is constituted using magnetic sensor chips mounted on stages supported by interconnecting members and a frame having leads in a lead frame. Herein, the stages are inclined upon plastic deformation of the interconnecting members. When the frame is held in a metal mold and the stages are pressed, the interconnecting members are elastically deformed, so that the magnetic sensor chips are bonded onto the stages placed substantially in the same plane and are then wired with the leads. Thereafter, the stages are released from pressure, so that the interconnecting members are restored from the elastically deformed states thereof. When the magnetic sensor chips are combined together to realize three sensing directions, it is possible to accurately measure three-dimensional bearings of magnetism, and the magnetic sensor can be reduced in dimensions and manufactured with a reduced cost thereof.
摘要:
In recording materials of a video program or the like, the video materials are efficiently and optimally acquired so that processing steps in and after an editing step subsequent to a recording step can be reduced. A recording support information (metadata) on a schedule of and a performer for an imaging operation, and the like, which are determined in advance is recorded in a first recording medium 16 by a program constitution input device 100. The first recording medium 16 is inserted in to an imaging device 200, materials to be recorded are classified and confirmed based on the metadata, and the materials which can constitute a desirable program as potentially as possible are acquired in the recording operation.
摘要:
A lead frame includes a frame body defining an internal region, a plurality of leads extending from the frame body, and first and second stages that are disposed in the internal region. The first and second stages are sloped and are parallel to a first line along which a primary stream of a molten resin runs, so that slope angles of the stages are not substantially changed by the injection of the molten resin into the cavity.
摘要:
A physical quantity sensor includes a pair of physical quantity sensor chips that are inclined with respect to the bottom of an exterior mold package whose side surfaces are each inclined in a thickness direction by an angle ranging from 0° to 5° and are formed in proximity to the outer ends of the physical quantity sensor chips. It is possible to realize the inclination of stages without using molds, wherein absorption devices are used to absorb prescribed portions related to stages, which rotate about axial lines and are thus inclined with respect to a prescribed base. In manufacturing, a thin metal plate having a plurality of lead frames is placed on a base delimited by a clamp; then, intersecting points of intermediate portions formed between the lead frames are subjected to pressing so as to realize the inclination of stages.
摘要:
A semiconductor device is designed such that a semiconductor sensor chip having a diaphragm for detecting pressure variations based on the displacement thereof is fixed onto the upper surface of a substrate having a rectangular shape, which is covered with a cover member so as to form a hollow space embracing the semiconductor sensor chip between the substrate and the cover member. Herein, the substrate is sealed with a molded resin such that chip connection leads packaging leads are partially exposed externally of the molded resin; the chip connection leads are electrically connected to the semiconductor sensor chip and are disposed in line along one side of the semiconductor sensor chip; and the packaging leads are positioned opposite the chip connection leads by way of the semiconductor sensor chip. Thus, it is possible to downsize the semiconductor device without substantially changing the size of the semiconductor sensor chip.
摘要:
A semiconductor package encapsulating a semiconductor chip provides inner leads and outer leads for establishing electrical connections with the substrate. Herein, a lead frame is set into the metal mold, into which a resin is injected and which is clamped in proximity to the outer leads. Thus, the semiconductor package is sealed so as to avoid unwanted formation of resin burrs around lower surfaces of the inner leads. In addition, a semiconductor device is produced using a package in which a semiconductor chip mounted on a stage and terminals are embedded within a resin. Each terminal provides an electrode surface, an interconnecting portion, and an exposed terminal surface. Herein, an isolation portion is formed as an integral part of the package made by the resin and is arranged in the prescribed area between the electrode surface and the exposed terminal surface.
摘要:
The present invention provides acid salts, such as sulfate, hydrochloride, and methanesulfonate, of 4-(1-((4-methylbenzothiophen-3-yl)methyl)benzimidazol-2-ylthio)butanoic acid and the crystals thereof. These benzimidazole derivatives and the crystals thereof have an in vivo chymase inhibitory activity and can be used as a preventive or therapeutic agent for inflammatory diseases, allergic diseases, respiratory diseases, circulatory diseases, or bone/cartilage metabolic diseases.
摘要:
A semiconductor package encapsulating a semiconductor chip provides inner leads and outer leads for establishing electrical connections with the substrate. Herein, a lead frame is set into the metal mold, into which a resin is injected and which is clamped in proximity to the outer leads. Thus, the semiconductor package is sealed so as to avoid unwanted formation of resin burrs around lower surfaces of the inner leads. In addition, a semiconductor device is produced using a package in which a semiconductor chip mounted on a stage and terminals are embedded within a resin. Each terminal provides an electrode surface, an interconnecting portion, and an exposed terminal surface. Herein, an isolation portion is formed as an integral part of the package made by the resin and is arranged in the prescribed area between the electrode surface and the exposed terminal surface.
摘要:
A lead frame includes a frame body defining an internal region; a plurality of leads extending from the frame body; a first stage disposed in the internal region; and a first modified connection lead structure comprising a flexible portion connected to the first stage and a modified connection lead connecting the flexible portion to the frame body. The modified connection lead has sloped side walls that permit a molten resin to flow into and fill up a small gap around the modified connection lead to form a void-free resin mold that encapsulates a sensor chip included in a sensor.