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    Thermoelectric module and a method of fabricating the same
    72.
    发明授权
    Thermoelectric module and a method of fabricating the same 失效
    热电模块及其制造方法

    公开(公告)号：US06391676B1

    公开(公告)日：2002-05-21

    申请号：US09200972

    申请日：1998-11-30

    申请人： Michimasa Tsuzaki ,  Nobuteru Maekawa ,  Narimasa Iwamoto ,  Junji Imai ,  Hiroaki Okada ,  Teruaki Komatsu ,  Shinya Murase ,  Hiroyuki Inoue ,  Masayuki Sagawa ,  Yuri Sakai

    发明人： Michimasa Tsuzaki ,  Nobuteru Maekawa ,  Narimasa Iwamoto ,  Junji Imai ,  Hiroaki Okada ,  Teruaki Komatsu ,  Shinya Murase ,  Hiroyuki Inoue ,  Masayuki Sagawa ,  Yuri Sakai

    IPC分类号： H01L2100

    CPC分类号： H01L35/325 ,  H01L35/32 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A thermoelectric module is capable of successfully reducing the heat stress for increased reliability. The module includes a plurality of thermoelectric chips of P-type and N-type arranged in a matrix between sets of first and second contacts to form a series electrical circuit. The chips are arranged to give at least three chip arrays each having a limited number of the chips. A first carrier is provided on one side of the chips to carry the first contacts and to include first bridges each integrally joining two adjacent first contacts to define first discrete couples for electrical connection of the chips in each chip array. The first carrier further includes at least two inter-array bridges which are solely responsible for electrical interconnection between the adjacent chip arrays. On the opposite side of the chips, there are formed a plurality of second bridges each integrally joining the two adjacent second contacts to give second discrete couples for electrical connection of the two adjacent chips in each of the chip arrays. Thus, the inter-array bridges are formed only on one side of the chips for interconnection of the first contacts between the adjacent chip arrays. Therefore, the heat stress applied to the end of the chip array where the two adjacent chip arrays are interconnected can be well relieved on the side of the second contacts in which the second discrete couples are kept totally isolated from each other.

    摘要翻译： 热电模块能够成功地降低热应力以提高可靠性。 该模块包括在第一和第二触点组之间以矩阵形式布置的多个P型和N型热电芯片，以形成串联电路。 芯片被布置成给出至少三个芯片阵列，每个芯片阵列具有有限数量的芯片。 第一载体设置在芯片的一侧以承载第一触点并且包括每个一体地连接两个相邻的第一触点的第一桥，以限定用于每个芯片阵列中的芯片的电连接的第一离散耦合。 第一载体还包括至少两个排列间桥，其单独负责相邻芯片阵列之间的电互连。 在芯片的相对侧，形成多个第二桥，每个第二桥整体地连接两个相邻的第二触点，以给出第二离散耦合，用于电连接每个芯片阵列中的两个相邻的芯片。 因此，阵列间桥仅形成在芯片的一侧，用于相邻芯片阵列之间的第一触点的互连。 因此，施加到两个相邻芯片阵列相互连接的芯片阵列的端部的热应力可以在第二接触件的一侧彼此完全隔离的第二触头侧得到很好的缓解。

    Recording device and sheet material conveying device
    74.
    发明授权
    Recording device and sheet material conveying device 失效
    记录装置和片材输送装置

    公开(公告)号：US06250827B1

    公开(公告)日：2001-06-26

    申请号：US09290406

    申请日：1999-04-13

    申请人： Takashi Nojima ,  Koh Hasegawa ,  Shinya Asano ,  Hiroyuki Inoue ,  Akira Kida ,  Takeshi Iwasaki ,  Noriko Kawasaki

    发明人： Takashi Nojima ,  Koh Hasegawa ,  Shinya Asano ,  Hiroyuki Inoue ,  Akira Kida ,  Takeshi Iwasaki ,  Noriko Kawasaki

    IPC分类号： B41J339

    CPC分类号： B41J29/02

    摘要： A recording device comprises a drive mechanism section for effecting recording on a recording object material, and an exterior cover for covering the drive mechanism section, the exterior cover having a plurality of cover members separated by at least one partition surface, wherein for two cover members to be combined with each other out of the cover members, a partition surface of one cover member is provided with a projection which functions as a fulcrum when the other cover member pivots on an axis parallel to the partition surface, and partition surfaces of the two cover members are coupled to each other by an engagement structure which engages when the two cover members move away from each other, on one side with respect to the axis, while being coupled by fastening with a screw on the other side.

    摘要翻译： 记录装置包括用于对记录对象材料进行记录的驱动机构部分和用于覆盖驱动机构部分的外盖，所述外盖具有由至少一个分隔表面分开的多个盖部件，其中对于两个盖部件 另外，一个盖部件的分隔面相互配合，当另一个盖部件在与分隔面平行的轴线上转动时，设置有作为支点的突出部， 盖构件通过接合结构彼此联接，该接合结构当两个盖构件在相对于轴线的一侧相互远离时相互接合，同时通过在另一侧上用螺钉紧固而联接。

    Imaging device
    75.
    发明授权
    Imaging device 有权
    成像设备

    公开(公告)号：US06177667B1

    公开(公告)日：2001-01-23

    申请号：US09134603

    申请日：1998-08-14

    申请人： Kazuhiro Fujita ,  Ikuo Maeda ,  Hiroyuki Inoue ,  Goichi Akanuma

    发明人： Kazuhiro Fujita ,  Ikuo Maeda ,  Hiroyuki Inoue ,  Goichi Akanuma

    IPC分类号： G02B1700

    CPC分类号： G02B3/0037 ,  B41J2/451 ,  G02B3/005 ,  G02B5/045 ,  H04N1/03 ,  H04N1/0306

    摘要： An imaging device includes a lens array in which lenses are arranged in a line, the lenses being optically equivalent, a roof mirror array having roof mirrors arranged in a line parallel to a direction in which axes of the lenses of the lens array are arranged, and an aperture member having apertures arranged so as to correspond to the lenses of the lens array. The center of an interval between axes of adjacent lenses of the lens array corresponds to a ridge line of the roof mirror array, and wherein at least two roof mirrors are provided with respect to each of the lenses of the lens array.

    摘要翻译： 一种成像装置包括透镜阵列，其中透镜被排列成一行，该透镜是光学上相同的，一个屋顶反射镜阵列，其具有与透镜阵列的透镜的轴线平行的方向排列的行列， 以及孔径构件，其具有排列成与透镜阵列的透镜相对应的孔。 透镜阵列的相邻透镜的轴线之间的间隔的中心对应于屋顶反射镜阵列的脊线，并且其中相对于透镜阵列的每个透镜设置至少两个屋顶反射镜。

    Sheet supply apparatus
    78.
    发明授权
    Sheet supply apparatus 失效
    供纸装置

    公开(公告)号：US06045220A

    公开(公告)日：2000-04-04

    申请号：US392221

    申请日：1995-02-22

    申请人： Takehiko Kiyohara ,  Soichi Hiramatsu ,  Hideki Yamaguchi ,  Hiroyuki Inoue ,  Takashi Nojima ,  Hitoshi Nakamura ,  Akira Kida ,  Hideaki Kawakami ,  Takeshi Iwasaki

    发明人： Takehiko Kiyohara ,  Soichi Hiramatsu ,  Hideki Yamaguchi ,  Hiroyuki Inoue ,  Takashi Nojima ,  Hitoshi Nakamura ,  Akira Kida ,  Hideaki Kawakami ,  Takeshi Iwasaki

    IPC分类号： B65H3/52 ,  B41J2/01 ,  B65H3/06

    CPC分类号： B65H3/5215 ,  B65H2402/5441

    摘要： A sheet supply apparatus has a sheet supporting unit for supporting a plurality of sheets, a sheet supply device for feeding out the sheets supported by the sheet supporting unit, and a separator which can be elastically flexed to change an inclination angle thereof when the separator is urged by a sheet fed out by the sheet supply device for separating the sheet which rides over the separator from the other sheets. The separator is disposed in an inclined condition so that a tip end of an abutment surface, against which the sheets are to be urged and over which the sheet rides, of the separator before flexed is inclined with respect to a normal plane perpendicular to a sheet feeding direction by a predetermined angle toward the sheet supporting unit.

    摘要翻译： 片材供给装置具有用于支撑多个片材的片材支撑单元，用于输出由片材支撑单元支撑的片材的片材供应装置，以及当分离器是分离器时可弹性弯曲以改变其倾斜角度的分离器 由片材供给装置输出的片材推动，用于将从隔板上分离的片材与其他片材分离。 分离器设置成倾斜状态，使得在弯曲之前分隔件的板被抵靠在其上并且垫片穿过的邻接表面的顶端相对于垂直于片材的法向平面倾斜 向纸张支撑单元向预定角度输送方向。

    Method of fabricating a thermoelectric module
    80.
    发明授权
    Method of fabricating a thermoelectric module 失效
    制造热电模块的方法

    公开(公告)号：US5950067A

    公开(公告)日：1999-09-07

    申请号：US973095

    申请日：1998-03-19

    申请人： Nobuteru Maegawa ,  Hiroaki Okada ,  Michimasa Tsuzaki ,  Yuri Sakai ,  Katsuyoshi Shimoda ,  Teruaki Komatsu ,  Shinya Murase ,  Hiroyuki Inoue ,  Masayuki Sagawa

    发明人： Nobuteru Maegawa ,  Hiroaki Okada ,  Michimasa Tsuzaki ,  Yuri Sakai ,  Katsuyoshi Shimoda ,  Teruaki Komatsu ,  Shinya Murase ,  Hiroyuki Inoue ,  Masayuki Sagawa

    IPC分类号： H01L35/32 ,  H01L35/34 ,  H01L21/324

    CPC分类号： H01L35/32 ,  H01L35/325 ,  H01L35/34 ,  Y10S257/93

    摘要： A method of fabricating a thermoelectric module in which a plurality of thermoelectric chips are arranged in a matrix between first and second dielectric substrates and electrically connected in series so as to heat one of the substrates and cool the other substrate. Elongated thermoelectric bars of P-type and N-type to be cut into the chips are employed together with a first conductive plate having a plurality of first contacts arranged in a matrix pattern. Adjacent first contacts spaced along the row are interconnected by horizontal bridges. The method of the present invention comprises the steps of integrating the first conductive plate to the first substrate to support the first conductive plate thereby; placing a plurality of the bars of the P-type and N-type on the first contacts along the rows in such a manner that the P-type bars alternate with the N-type bars in a spaced relation along the column; bonding each bar on its one face to the first contacts; cutting each bar into the chips and cutting the horizontal bridges simultaneously to allocate the chips on the individual first contacts; placing a plurality of second contacts of a second substrate onto the chips to form a series electric circuit of the chips in combination with the first contacts, and bonding the second substrate supporting the second contacts to the first substrate.

    摘要翻译： PCT No.PCT / JP97 / 01797 Sec。 371日期：1998年3月19日 102（e）1998年3月19日PCT PCT 1997年6月3日PCT公布。 公开号WO97 / 45882 日期1997年12月4日一种制造热电模块的方法，其中多个热电芯片以矩阵形式布置在第一和第二电介质基板之间并串联电连接以加热其中一个基板并冷却另一个基板。 将要切割成芯片的P型和N型的细长热电棒与具有以矩阵图案排列的多个第一触头的第一导电板一起使用。 沿着行间隔的相邻的第一接触件通过水平桥互连。 本发明的方法包括以下步骤：将第一导电板与第一基板集成，从而支撑第一导电板; 沿着行将P型和N型的多个条放置在第一触点上，使得P型条以与柱相隔的关系与N型条交替; 将其一个面上的每个条连接到第一触点; 将每个棒切割成芯片并同时切割水平桥，以将芯片分配在单独的第一触点上; 将第二基板的多个第二触点放置在芯片上以与第一触点组合形成芯片的串联电路，以及将支撑第二触点的第二基板接合到第一基板。