公开(公告)号：US20050272351A1

公开(公告)日：2005-12-08

申请号：US11138302

申请日：2005-05-27

申请人： Toru Mizuno ,  Tomomi Asakura ,  Toshinobu Miyakoshi ,  Yuji Saito ,  Tsugihiro Hasebe

发明人： Toru Mizuno ,  Tomomi Asakura ,  Toshinobu Miyakoshi ,  Yuji Saito ,  Tsugihiro Hasebe

IPC分类号： B08B1/00 ,  B24B19/16 ,  B24B49/00 ,  H01L21/00 ,  H01L21/52 ,  H01L21/60 ,  H01L21/683

CPC分类号： H01L21/67144 ,  B08B1/008 ,  B24B19/16 ,  H01L21/67028 ,  H01L21/6838 ,  H01L24/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01082 ,  Y10T29/53178 ,  Y10T29/53191

摘要： A cleaning apparatus according to the invention is used for an electronic component mounting machine, includes a abrading unit for abrading the suction surface of the mounting nozzle; and a drive unit for moving the abrading unit in a predetermined direction, the abrading unit being formed by a ceramics structure, and a grain size of a contact surface of the abrading unit ranges from P1000 to P5000, the contact surface of the abrading unit coming into contact with the suction surface of the mounting nozzle.

摘要翻译： 根据本发明的清洁装置用于电子部件安装机，包括用于研磨安装喷嘴的吸附表面的研磨单元; 以及用于沿预定方向移动研磨单元的驱动单元，所述研磨单元由陶瓷结构形成，并且所述研磨单元的接触表面的晶粒尺寸范围为P1000至P5000，所述研磨单元的接触表面接近 与安装喷嘴的吸入表面接触。

公开(公告)号：US20050264602A1

公开(公告)日：2005-12-01

申请号：US11138396

申请日：2005-05-27

申请人： Toru Mizuno

发明人： Toru Mizuno

IPC分类号： B41J2/01 ,  B41J2/165

CPC分类号： B41J2/165

摘要： An ink jet printer is provided with an ink jet head, a recovery device, a timer, and a controller. The ink jet head discharges ink. The recovery device executes a recovery action to recover an ink discharging ability of the ink jet head. The timer measures time since a last recovery action of the recovery device. The controller selects an interval based on a printing history of the ink jet printer and controls the recovery device to execute the recovery action when the time measured by the timer becomes equal to the selected interval. The recovery action is performed at an appropriate timing.

摘要翻译： 喷墨打印机设置有喷墨头，恢复装置，定时器和控制器。 喷墨头排出墨水。 恢复装置执行恢复动作以恢复喷墨头的喷墨能力。 计时器测量自恢复设备的最后一次恢复操作以来的时间。 控制器基于喷墨打印机的打印历史来选择间隔，并且当定时器测量的时间等于所选择的间隔时，控制恢复装置执行恢复动作。 恢复动作在适当的时机进行。

公开(公告)号：US20050241143A1

公开(公告)日：2005-11-03

申请号：US10521457

申请日：2003-08-18

申请人： Toru Mizuno ,  Masatoshi Ito ,  Masaaki Kaneko ,  Hiroshi Ikeda

发明人： Toru Mizuno ,  Masatoshi Ito ,  Masaaki Kaneko ,  Hiroshi Ikeda

IPC分类号： H05K13/04 ,  H01L21/52 ,  H01L21/60 ,  H05K13/08

CPC分类号： H01L24/81 ,  H01L24/16 ,  H01L24/75 ,  H01L2224/16221 ,  H01L2224/75 ,  H01L2224/75353 ,  H01L2224/7565 ,  H01L2224/759 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H05K13/0404 ,  Y10T29/49133 ,  Y10T29/53174

摘要： Provided is a mounting apparatus which enables high levels of both maintenance/improvement of product quality and reduction of product cost by reliably preventing accidental contact of a mounting part with a mounting target part while enhancing the productivity. In S1, a contact detection start position Hs0 is set. In S2, a chip holding tool chucks an electronic part. In S3, S4, the tool is moved to a transfer position A, and then the tool is lowered to the Hs0 from the transfer position A. In S5, after the tool is lowered to the Hs0, the lowering speed is changed to a contact detection speed. In S6, it is determined whether or not the electronic part has come into contact with a substrate. If the result of the determination is YES, in S7, the lowering of the tool is stopped. In S8, the actual contact position Hc is measured. In S9, the next contact detection start position Hs1 is set, and Hs1 is set to Hs0 (Hs0-Hs1) so that the later steps reflect this setting. In S10, S11, after the electronic part is joined to the substrate by ultrasonic bonding, the tool is transferred to the transfer position A. In S12, it is determined whether or not a stop command is issued. If the result is YES, this flow is ended. If NO, the procedure returns to S2, and bonding is repeated.

摘要翻译： 提供了一种安装装置，其通过可靠地防止安装部件与安装对象部件的意外接触同时提高生产率，从而能够高度维持/提高产品质量并降低产品成本。 在S1中，设置接触检测开始位置Hs 0。 在S 2中，芯片保持工具卡住电子部件。 在S 3，S 4中，将工具移动到传送位置A，然后将工具从传送位置A下降到Hs 0。在S 5中，在工具下降到Hs 0之后，下降速度 改为接触检测速度。 在S6中，确定电子部件是否与基板接触。 如果确定结果为是，则在S 7中，停止工具的降低。 在S 8中，测量实际接触位置Hc。 在S 9中，下一个接触检测开始位置Hs1被置位，并且Hs1被设置为Hs0（Hs0-Hs1），以便稍后的步骤反映该设置。 在S10，S11中，在通过超声波接合将电子部件接合到基板之后，将工具传送到转印位置A.在S12中，判定是否发出停止指令。 如果结果为YES，则此流程结束。 如果为“否”，则返回到S 2，重复接合。

公开(公告)号：US06931717B2

公开(公告)日：2005-08-23

申请号：US10682731

申请日：2003-10-10

申请人： Toru Mizuno ,  Tomomi Asakura ,  Masatoshi Ito ,  Masaaki Kaneko ,  Toshinobu Miyagoshi

发明人： Toru Mizuno ,  Tomomi Asakura ,  Masatoshi Ito ,  Masaaki Kaneko ,  Toshinobu Miyagoshi

IPC分类号： B23P19/00 ,  H01L21/00 ,  H01L21/60 ,  H05K13/04

CPC分类号： H05K13/0812 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/53061 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191 ,  Y10T29/53261

摘要： A mounting apparatus capable of coping with high density mounting, narrower pitch mounting, cavity mounting and the like. In the apparatus, displacement amounts of a chip that is picked up from a wafer by a pick-up nozzle to be held by the pick-up nozzle, with respect to a reference attitude, are obtained, and when the chip is delivered to a mounting nozzle for actually mounting the chip onto a substrate, the displacement amounts are corrected while taking the displacement amounts into consideration, so that the mounting nozzle always holds the chip in a fixed attitude.

摘要翻译： 一种能够应对高密度安装，窄间距安装，腔体安装等的安装装置。 在该装置中，获得由相对于基准姿势由拾取喷嘴保持的拾取喷嘴从晶片上取出的芯片的位移量，并且当芯片被输送到 用于将芯片实际安装到基板上的安装喷嘴，考虑到位移量来校正位移量，使得安装喷嘴始终将芯片保持在固定的姿态。

公开(公告)号：US06595845B1

公开(公告)日：2003-07-22

申请号：US09708049

申请日：2000-11-08

申请人： Toru Mizuno ,  Ikuo Hattori ,  Akihiko Sugama ,  Toshikatsu Matsuya ,  Yoshiaki Ise

发明人： Toru Mizuno ,  Ikuo Hattori ,  Akihiko Sugama ,  Toshikatsu Matsuya ,  Yoshiaki Ise

IPC分类号： B23F2103

CPC分类号： B28D1/041 ,  B28D1/121 ,  Y10T408/81

摘要： The present invention relates to an outer-diameter blade, an inner-diameter blade and cutting machines which respectively use the outer-diameter blade and the inner-diameter blade for cutting hard material, such as metal, ceramics, semiconductor single crystal, glass, quartz crystal, stone, asphalt or concrete, and a core drill and a core-drill processing machine which drives the core drill for forming a hole in the hard material.

摘要翻译： 本发明涉及分别使用外径刀片和内径刀片切割金属，陶瓷，半导体单晶，玻璃等硬质材料的外径刀片，内径刀片和切割机， 石英，石料，沥青或混凝土，以及用于在硬质材料上形成孔的芯钻和芯钻加工机。

公开(公告)号：US06539275B1

公开(公告)日：2003-03-25

申请号：US09321229

申请日：1999-05-27

申请人： Toru Mizuno ,  Toshiaki Otsuki ,  Shoichi Sagara ,  Yasuhiro Saitou

发明人： Toru Mizuno ,  Toshiaki Otsuki ,  Shoichi Sagara ,  Yasuhiro Saitou

IPC分类号： G05B19416

CPC分类号： G05B19/416

摘要： A controller for a machine capable of performing acceleration/deceleration control to which an optimal tangential acceleration within an allowable maximum acceleration for each axis is applied. A first interpolation section receives data obtained by analysis of a program by a command analysis section, an makes interpolating calculation in every first sampling period to output it into an intermediate memory. A tangential acceleration calculating section determines a tangential acceleration based on each segment and the allowable maximum acceleration for each axis to output it into the intermediate memory. A deceleration target velocity calculating section prepares an acceleration/deceleration pattern for a plurality of segments stored in the intermediate memory, to output it to the intermediate memory. An acceleration/deceleration control section performs acceleration/deceleration control based on the data in the intermediate memory so that the tangential velocity at an end point of each segment is not higher than the deceleration target velocity, and calculates velocity for each second sampling period. A second interpolation section defines a smooth curve based on the output from the acceleration/deceleration control section and the data taken out from the intermediate memory, and outputs a point on the smooth curve for each second sampling period.

摘要翻译： 一种用于能够执行加速/减速控制的机器的控制器，在每个轴的允许的最大加速度内施加最佳切向加速度。 第一内插部分接收通过命令分析部分对程序的分析获得的数据，在每个第一采样周期进行内插计算，以将其输出到中间存储器。 切向加速度计算部基于每个分段确定切向加速度，并且确定每个轴的允许的最大加速度以将其输出到中间存储器。 减速目标速度计算部分为存储在中间存储器中的多个段准备加速/减速模式，将其输出到中间存储器。 加速/减速控制部分基于中间存储器中的数据执行加速/减速控制，使得每个段的终点处的切向速度不高于减速目标速度，并且计算每个第二采样周期的速度。 第二插值部根据来自加减速控制部的输出和从中间存储器取出的数据来定义平滑曲线，并且在第二采样周期的平滑曲线上输出点。

公开(公告)号：US5264815A

公开(公告)日：1993-11-23

申请号：US527076

申请日：1990-05-21

申请人： Tatuo Umeya ,  Hidetoshi Suzuki ,  Toru Mizuno ,  Tokio Tadano ,  Takashi Shioura

发明人： Tatuo Umeya ,  Hidetoshi Suzuki ,  Toru Mizuno ,  Tokio Tadano ,  Takashi Shioura

IPC分类号： H01F27/06 ,  H01F5/04 ,  H01F17/04 ,  H01F27/29 ,  H01F27/26 ,  H01F27/30

CPC分类号： H01F27/292 ,  H01F17/041 ,  H01F5/04 ,  Y10T24/3431 ,  Y10T24/44923

摘要： A combination of a fastener with an electronic component, wherein the electronic component includes a bobbin having an axial portion, windings around the axial portion of the bobbin, external terminals projecting from the bobbin, around each of which external terminals a termination of one of the windings is coiled, a mold covering the bobbin in a manner to allow portions of the external terminals to be projected outwardly from the mold, the mold being formed of electrically insulating resin material, and a pair of cores assembled to the mold so as to be opposed to each other. The fastener fitted on the electronic component includes a first engaging member engaged in assembly with the cores to clamp the cores, a second engaging member engaged in assembly with a portion of the mold, and an interconnecting member interconnecting the first and second engaging members.

摘要翻译： 紧固件与电子部件的组合，其中所述电子部件包括具有轴向部分的绕线管，围绕所述线轴的轴向部分绕组，从所述绕线管突出的外部端子，每个所述外部端子的端接部分 绕组被卷绕，模具以允许外部端子的一部分从模具向外突出的方式覆盖线轴，模具由电绝缘树脂材料形成，并且一对芯体组装到模具上，以便于 相互对立 安装在电子部件上的紧固件包括：第一接合构件，其与芯组装成与夹紧芯部接合;第二接合构件与模具的一部分接合;以及互连构件，其将第一和第二接合构件互连。

公开(公告)号：US4416226A

公开(公告)日：1983-11-22

申请号：US383835

申请日：1982-06-01

申请人： Minoru Nishida ,  Tadashi Hattori ,  Shinichi Mukainakano ,  Toru Mizuno ,  Tukasa Goto

发明人： Minoru Nishida ,  Tadashi Hattori ,  Shinichi Mukainakano ,  Toru Mizuno ,  Tukasa Goto

IPC分类号： F02P9/00 ,  F02P23/04 ,  F02P23/00

CPC分类号： F02P9/007 ,  F02P23/04

摘要： A laser ignition apparatus includes a laser oscillator which generates at least two successive pulse-shaped laser beams during each compression stroke of the engine. A first pulse-shaped laser beam is generated by a Q switching action of the laser oscillator and thus has a high peak output and a second pulse-shaped laser beam is generated without the Q switching action and has a low peak output but a larger pulse duration than the first laser beam. The first and second pulse-shaped laser beams are guided and directed into the combustion chamber of the engine and the first laser beam of a high energy density causes the breakdown of the air-fuel mixture in the combustion chamber to develop a plasma and the second laser beam further increases the energy of the plasma thereby to ensure the setting fire of the air-fuel mixture.

摘要翻译： 激光点火装置包括激光振荡器，其在发动机的每个压缩冲程期间产生至少两个相继的脉冲形激光束。 通过激光振荡器的Q切换动作产生第一脉冲形激光束，因此具有高峰值输出，并且产生第二脉冲形状的激光束而没有Q开关动作，并具有低峰值输出但较大的脉冲 持续时间比第一激光束。 第一和第二脉冲激光束被引导并引导到发动机的燃烧室中，并且高能量密度的第一激光束导致燃烧室中的空气 - 燃料混合物的破坏以形成等离子体，而第二激光 激光束进一步增加等离子体的能量，从而确保空气 - 燃料混合物的点燃。