公开(公告)号：US20230223184A1

公开(公告)日：2023-07-13

申请号：US18094982

申请日：2023-01-09

Applicant: CYNTEC CO., LTD.

Inventor： SEN-HUEI CHEN ,  YuLun Chang

IPC: H01F27/29 ,  H01F27/28 ,  H01F27/24 ,  H01F41/06

CPC classification number: H01F27/29 ,  H01F27/2823 ,  H01F27/24 ,  H01F41/06

Abstract: A magnetic device, a body; and an insulated conductive wire which comprises a metal wire and an insulating layer encapsulating the metal wire, wherein the insulated conductive wire comprises a coil and a first terminal part, wherein an outer surface of the internal metal part of a first portion of the first terminal part is exposed from the insulating layer for forming an electrode, wherein a second portion of the first terminal part is disposed in the body, and an outer surface of the internal metal part of the second portion of the terminal part is exposed from the insulating layer.

公开(公告)号：US11688533B2

公开(公告)日：2023-06-27

申请号：US17517144

申请日：2021-11-02

Applicant: Cyntec Co., Ltd.

Inventor： Hsiu-Yu Chang ,  Chao-Ting Lin

IPC: H01C1/142 ,  H01C7/00

CPC classification number: H01C1/142 ,  H01C7/003

Abstract: A chip resistor structure includes a substrate; a pair of first electrodes disposed opposite to each other on a first surface of the substrate at a first interval; a resistance layer disposed between the pair of first electrodes on the first surface; a spacer layer made of a material having a composition different from that of the resistance layer, disposed over the pair of first electrodes; a protective layer overlying the resistance layer; and a plating layer electroplated onto the pair of first electrodes and the spacer layer, and having ends extending beyond the pair of first electrodes terminate at least over the spacer layer. The plating layer may be joined with or spaced from or climb up to the protective layer on or above the spacer layer.

公开(公告)号：US11676758B2

公开(公告)日：2023-06-13

申请号：US16820918

申请日：2020-03-17

Applicant: CYNTEC CO., LTD.

Inventor： Wenyu Lin ,  TsungHao Lu ,  Hao Chun Chang

IPC: H01F27/22 ,  H01F27/32 ,  H01F27/29 ,  H01F27/28 ,  H01F27/24 ,  H01F27/02 ,  H05K1/18 ,  H01L25/07

CPC classification number: H01F27/327 ,  H01F27/022 ,  H01F27/22 ,  H01F27/24 ,  H01F27/2823 ,  H01F27/2852 ,  H01F27/29 ,  H05K1/18 ,  H01L25/072 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10515

Abstract: A magnetic device comprising a magnetic body, a coil disposed in the magnetic body and at least one thermal conductive layer, wherein a first portion of the at least one thermal conductive layer encapsulates at least one portion of the coil and a second portion of the at least one thermal conductive layer is exposed from the magnetic body, wherein the at least one thermal conductive layer forms a continuous thermal conductive path from the coil to the outside of the magnetic body for dissipating heat generated from the coil.

公开(公告)号：US20230014778A1

公开(公告)日：2023-01-19

申请号：US17671561

申请日：2022-02-14

Applicant: CYNTEC CO., LTD.

Inventor： Chun-Tiao Liu ,  Hsieh-Shen Hsieh ,  Shao-Wei Chang ,  JINPING ZHOU

IPC: H01F27/28 ,  H01F27/26 ,  H01F27/32 ,  H01F27/30

Abstract: A magnetic component structure with thermal conductive filler, including two magnetic cores combining together to form an inner accommodating space and at least one core opening, two plate portions connect each other through an inner leg structure and two outer leg structures, a bobbin sleeving on the inner leg structure, a coil winding on the bobbin, a bobbin housing surrounding the bobbin and the coil winding and form winding opening facing the at least one core opening, gaps are formed between the encasing structure constituted by the bobbin housing and the bobbin sleeving and the magnetic cores, a thermal conductive filler formed between the bobbin and the bobbin housing and encapsulating at least parts of the coil winding, and a cooling surface contacts the magnetic cores and the thermal conductive filler, the thermal conductive filler extends outwardly to contact the cooling surface through the opening and the winding opening.

公开(公告)号：US11551857B2

公开(公告)日：2023-01-10

申请号：US16382204

申请日：2019-04-12

Applicant: CYNTEC CO., LTD.

Inventor： Min-Feng Chung ,  Meihua Chen ,  Po-I Wu

IPC: H01F27/36 ,  H05K9/00 ,  H01F27/29 ,  H01F27/32 ,  H01F41/10 ,  H01F41/12

Abstract: At least one shielding layer made of conductive material is formed on a body of a magnetic device to prevent magnetic fields from leaking to the outside of the magnetic device so as to reduce EMI and the size of the magnetic device.

公开(公告)号：US20220399754A1

公开(公告)日：2022-12-15

申请号：US17837058

申请日：2022-06-10

Applicant: CYNTEC CO., LTD.

Inventor： Kuan Yu Chiu

IPC: H02J50/00 ,  H02J7/00 ,  H02J50/10 ,  H02J50/40

Abstract: a wireless charger having coils disposed in a recess of a metallic case of the wireless charger, wherein a heat-conducting material is disposed in the recess to encapsulate the coils with the first heat-conducting material being in contact with the coils, a sidewall, and a bottom surface of the recess.

公开(公告)号：US20220351894A1

公开(公告)日：2022-11-03

申请号：US17731266

申请日：2022-04-28

Applicant: CYNTEC CO., LTD.

Inventor： Cheng-Hao Chang ,  Shing Tak Li

IPC: H01F27/28 ,  H01F27/02 ,  H01F27/245 ,  H01F27/32 ,  H01F41/12 ,  H01F41/04

Abstract: A coupled inductor has two coils made by film or a lithography processes, wherein a first coil is disposed on a top surface of a magnetic sheet and a second coil is disposed on the bottom surface of the magnetic sheet, for controlling the variations of the alignments of the two coils in a smaller range.

公开(公告)号：US11415601B2

公开(公告)日：2022-08-16

申请号：US16708349

申请日：2019-12-09

Applicant: CYNTEC CO., LTD.

Inventor： Tzu-Hao Hung ,  Ying-Da Luo

IPC: G01R1/20 ,  G01R19/00 ,  H01C1/14 ,  H01C7/06

Abstract: A resistor having low temperature coefficient of resistance includes a resistive part and two conductive parts connected to opposite sides of the resistive part. One conductive part has a through slot and a sensing portion between the through slot and the resistive part. The through slot has two inter-connected sections. Each section extends and ends with a closed end and has a parallel component, parallel to a main current direction defined on the resistor, and a perpendicular component, perpendicular to the main current direction. Another resistor having low temperature coefficient of resistance includes a resistive part and two conductive parts connected to two sides of the resistive part respectively. Each conductive part has a protrusion block, extending outward perpendicular to a main current direction defined on the resistor, and a sensing portion at the protrusion block.

公开(公告)号：US11355276B2

公开(公告)日：2022-06-07

申请号：US16432937

申请日：2019-06-06

Applicant: CYNTEC CO., LTD.

Inventor： Tsung-Chan Wu ,  Roger Hsieh ,  Yi-Min Huang ,  Lan-Chin Hsieh ,  Yu-Ching Kuo

IPC: H01F27/28 ,  H01F27/255 ,  H01F17/04 ,  H01F41/12

Abstract: An electronic device including a core, at least a wire and a magnetic material is provided. The core includes a pillar, a top board and a bottom board. The pillar is disposed between the top board and the bottom board. A winding space is formed among the top board, the bottom board and the pillar. The wire is wound around the pillar and located in the winding space. The magnetic material fills the winding space to encapsulate the wire. The magnetic material includes a resin and a magnetic powder, wherein an average particle diameter of the magnetic powder is smaller than 20 μm.

公开(公告)号：US20210217556A1

公开(公告)日：2021-07-15

申请号：US17148537

申请日：2021-01-13

Applicant: CYNTEC CO., LTD.

Inventor： Kuan Yu Chiu ,  Ching Hsiang Yu ,  Min-Feng Chung

IPC: H01F38/14 ,  H02J7/02 ,  H02J50/10 ,  H02J50/40 ,  H02J7/00 ,  H01F27/32 ,  H01F27/28 ,  H01F27/34

Abstract: A structure of coils for a wireless charger comprises a plurality of coils, wherein the plurality of coils are stacked into a plurality of layers of coils with each layer comprising at least two coils, wherein at least two electronic devices are capable of being placed over the plurality of coils for charging the at least two electronic devices.