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公开(公告)号：US11415601B2
公开(公告)日：2022-08-16
申请号：US16708349
申请日：2019-12-09
申请人： CYNTEC CO., LTD.
发明人： Tzu-Hao Hung , Ying-Da Luo
摘要： A resistor having low temperature coefficient of resistance includes a resistive part and two conductive parts connected to opposite sides of the resistive part. One conductive part has a through slot and a sensing portion between the through slot and the resistive part. The through slot has two inter-connected sections. Each section extends and ends with a closed end and has a parallel component, parallel to a main current direction defined on the resistor, and a perpendicular component, perpendicular to the main current direction. Another resistor having low temperature coefficient of resistance includes a resistive part and two conductive parts connected to two sides of the resistive part respectively. Each conductive part has a protrusion block, extending outward perpendicular to a main current direction defined on the resistor, and a sensing portion at the protrusion block.
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公开(公告)号：US11355276B2
公开(公告)日：2022-06-07
申请号：US16432937
申请日：2019-06-06
申请人： CYNTEC CO., LTD.
发明人： Tsung-Chan Wu , Roger Hsieh , Yi-Min Huang , Lan-Chin Hsieh , Yu-Ching Kuo
IPC分类号： H01F27/28 , H01F27/255 , H01F17/04 , H01F41/12
摘要： An electronic device including a core, at least a wire and a magnetic material is provided. The core includes a pillar, a top board and a bottom board. The pillar is disposed between the top board and the bottom board. A winding space is formed among the top board, the bottom board and the pillar. The wire is wound around the pillar and located in the winding space. The magnetic material fills the winding space to encapsulate the wire. The magnetic material includes a resin and a magnetic powder, wherein an average particle diameter of the magnetic powder is smaller than 20 μm.
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公开(公告)号：US20210217556A1
公开(公告)日：2021-07-15
申请号：US17148537
申请日：2021-01-13
申请人： CYNTEC CO., LTD.
发明人： Kuan Yu Chiu , Ching Hsiang Yu , Min-Feng Chung
摘要： A structure of coils for a wireless charger comprises a plurality of coils, wherein the plurality of coils are stacked into a plurality of layers of coils with each layer comprising at least two coils, wherein at least two electronic devices are capable of being placed over the plurality of coils for charging the at least two electronic devices.
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74.再颁专利公开(公告)号：USRE48472E1
公开(公告)日：2021-03-16
申请号：US15689676
申请日：2017-08-29
申请人： CYNTEC CO., LTD.
发明人： Tsung-Chan Wu , Roger Hsieh , Yi-Min Huang , Lan-Chin Hsieh , Yu-Ching Kuo
摘要： A choke includes a single-piece core entirely made of a same material, the single-piece core having two boards and a pillar located between the two boards, a winding space being located among the two boards and the pillar, wherein the pillar has a non-circular and non-rectangular cross section along a direction substantially perpendicular to an axial direction of the pillar, the cross section of the pillar has a first axis and a second axis intersecting with each other at a center of the cross section of the pillar and are substantially perpendicular with each other, the first axis is longer than the second axis, and the cross section of the pillar is substantially symmetrical to both of the first axis and the second axis.
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公开(公告)号：US20210074470A1
公开(公告)日：2021-03-11
申请号：US16936435
申请日：2020-07-23
申请人： CYNTEC CO., LTD.
发明人： Pei-I Wei , Cheng-Hao Chang , Shing Tak Li
摘要： An inductive component is disclosed, the inductive component comprising a metal structure, comprising a bare conductor wire, a first electrode and a second electrode, wherein the first electrode and the second electrode are integrally formed with the bare conductor wire, wherein a first thickness of the first electrode is greater than that of the bare conductor wire and a second thickness of the second electrode is greater than that of the bare conductor wire; and a magnetic body encapsulating the bare conductor wire, at least one portion of the first electrode, and at least one portion of the second electrode, wherein the first lateral surface of the first electrode and the second lateral surface of the second electrode are embedded inside the magnetic body.
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公开(公告)号：US10796842B2
公开(公告)日：2020-10-06
申请号：US16709884
申请日：2019-12-10
申请人： CYNTEC CO., LTD.
摘要： A method to from an inductive component, the method including forming a metal structure having a conductor wire and a lead frame having a first part and a second part space spaced apart from the first part and forming a magnetic body encapsulating the conductor wire, a first portion of the first part and a second portion of the second part of the lead frame adjacent to the conductor wire.
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公开(公告)号：US10529661B2
公开(公告)日：2020-01-07
申请号：US15585168
申请日：2017-05-03
申请人： CYNTEC CO., LTD.
发明人： Chih Hung Wei
IPC分类号： H01L23/522 , H01F17/00 , H01F27/34 , H01L49/02 , H01L21/302
摘要： A conductive element made of magnetic layers each being made of a first magnetic material, a trench is formed in each of the magnetic layer with the bottom surface of the trench being located higher than the bottom surface of the magnetic layer, wherein a second material is disposed in the trench and a conductive layer is disposed over the trench for forming the conductive element.
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公开(公告)号：US10256118B2
公开(公告)日：2019-04-09
申请号：US15972247
申请日：2018-05-07
申请人： CYNTEC CO., LTD.
发明人： Chia Pei Chou , Lang-Yi Chiang , Jih-Hsu Yeh , You Chang Tseng
IPC分类号： H01L23/495 , H01L21/48 , H01L23/498
摘要： A method to form an electrical component, the method comprising: providing a first lead and a second lead; forming a first conductive pillar and a second conductive pillar on a first portion of the top surface of the first lead and a first portion of the top surface of the second lead, respectively, wherein a second portion of the top surface of the first lead, a second portion of the top surface of the second lead, the first conductive pillar, and the second conductive pillar form a 3D space, wherein at least one device is disposed in said 3D space and electrically connected to the at least one device to the first conductive pillar and the second conductive pillar.
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公开(公告)号：US10121583B2
公开(公告)日：2018-11-06
申请号：US14697645
申请日：2015-04-28
申请人： CYNTEC CO., LTD.
发明人： Wei-Chien Chang , Chia-Chi Wu , Lang-Yi Chiang , Tsung-Chan Wu , Jih-Hsu Yeh
摘要： An electromagnetic component including a multi-layer, spiral coil structure embedded in a molded body is disclosed. Each layer of the coil structure makes approximately one and a quarter turns of a winding. Each layer of the coil structure has a loose middle segment, two slim end segments overlapping each other with a spacing therebetween, and tapered neck segments respectively connecting the loose middle segment with the two slim end segments.
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公开(公告)号：US10068693B2
公开(公告)日：2018-09-04
申请号：US14931580
申请日：2015-11-03
申请人： CYNTEC CO., LTD.
发明人： Chun-Chih Lin , Yi-Wei Chen , Yi-Ting Lai , Chu-keng Lin , Cheng-Chang Lee
CPC分类号： H01F27/2804 , H01F27/24 , H01F27/32 , H01F41/041 , H01F2027/2809 , H05K1/0298 , H05K1/09 , H05K1/165 , H05K3/202 , H05K2201/086
摘要： A multi-layer wiring structure includes a first conductive structure, a second conductive structure and an insulating layer. To manufacturing the multi-layer wiring structure, a first conductive structure and a second conductive structure are provided. The first conductive structure and the second conductive structure include a plurality of wiring patterns. Then, the insulating layer is disposed between the first conductive structure and the second conductive structure. The insulting layer is thinner than the first conductive structure or the second conductive structure. The first conductive structure, the insulating layer and the second conductive structure are laminated to form the multi-layer wiring structure. A planar magnetic element having a compact coil manufactured by the method is also provided.
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