摘要:
A thermally stable spin valve sensor having an increased GMR ratio by virtue of an AP pinned layer structure in which the first and second pinned layers are separated by an AP coupling layer having a nano-oxide layer formed as an oxidized surface portion of the AP coupling layer. The nano-oxide layer provides an increase in the specular scattering, and in turn, an increase in the GMR ratio.
摘要:
A metrology apparatus includes an actuator with a first actuator stage to controllably move in first and second orthogonal directions, and a second actuator stage adjacent to the first actuator stage to controllably move in a third direction orthogonal to the first and second orthogonal directions. A coupling is coupled to the second actuator stage and to a multi-bar linkage assembly fixed to a second end of a reference structure. The linkage supports a sample holder and transmits appropriate displacements generated by the actuator thereof The second actuator stage and the coupling move the linkage in the third orthogonal direction in a manner that substantially isolates the linkage from any second actuator stage motion in the first and second directions. An objective is fixed to the reference structure and is located between a light source and a position sensor. The position sensor measures first actuator stage motion in the first and second directions.
摘要:
A balanced momentum probe holder in an apparatus for characterizing a sample surface has first and second members each having extensible and retractable distal ends. The distal ends extend or retract substantially simultaneously in response to a signal from a detector thus balancing the momentums of the first and second members and reducing the net momentum of the probe holder to essentially zero. Balancing the momentum of the probe holder reduces parasitic oscillations in the apparatus thus enhancing performance.
摘要:
A force scanning probe microscope (FSPM) and associated method of making force measurements on a sample includes a piezoelectric scanner having a surface that supports the sample so as to move the sample in three orthogonal directions. The FSPM also includes a displacement sensor that measures movement of the sample in a direction orthogonal to the surface and generates a corresponding position signal so as to provide closed loop position feedback. In addition, a probe is fixed relative to the piezoelectric scanner, while a deflection detection apparatus is employed to sense a deflection of the probe. The FSPM also includes a controller that generates a scanner drive signal based on the position signal, and is adapted to operate according to a user-defined input that can change a force curve measurement parameter during data acquisition.
摘要:
A method and apparatus for manipulating the surface of a sample including a cantilever, a first tip mounted on the cantilever, and a second tip mounted on the cantilever, the first and the second tip being configured to combine to form an imaging probe and to separate to form a manipulation probe. The first and second tips are configured to form a first position characterized in that the tips combine to form an imaging tip and the first and the second tip are configured to form a second position characterized in that the tips separate to manipulate particles on a surface of a sample. The tips can be configured to form the first position when a voltage is applied across the tips, and preferable extend downwardly from the cantilever substantially perpendicular thereto.
摘要:
An electrostatic clamping technique for use in clamping substrates in various semiconductor fabrication processes is disclosed. One example takes the form of a substrate support plate which has deposited on its working face two layers of thermally conductive, electrically insulative RTV silicone, between which layers is located an interdigital type printed circuit capacitor energized by a DC source in the kilovolt range. Secured to the back surface of the support plate is a water cooled jacket with the entire assembly adapted for location in the incident ion beam and having good thermal dissipation properties.An alternate embodiment utilized an alumina support plate on which the capacitor of aluminum composition is deposited by vacuum evaporation; the exposed capacitor surface is rendered insulative by oxidation.
摘要:
A substrate processing system in accordance with one embodiment includes a processing chamber and an optical pyrometer assembly to measure an emitted thermal radiation originating substantially from a portion of target surfaces. The optical pyrometer includes a lightpipe that comprises a core and a hollow sheath surrounding the core. The core and the sheath are concentric with one another. The sheath is formed by a chemical vapor deposition process and includes local protrusions within a hollow interior thereof to maintain a position of the core within the sheath. In particular, the local protrusions are formed so as to center at least a distal end portion of the core within the sheath. A temperature of the target surface is determined from an intensity of a portion of the emitted thermal radiation near at least one wavelength.
摘要:
A system for removing flux from openings formed in a substrate that has openings (e.g., sized 20 microns or less) formed therein includes a spay nozzle device that has a spray nozzle arm that is formed at an angle of about 45 degrees or less for discharging fluid towards the openings in the substrate for flux removal. The angle is between about 30 degrees and 45 degrees.
摘要:
A device for spraying substrates comprises a longitudinal extending fluid dispensing head coupled to a supply of fluid and including a perpendicularly extending flange, a spacer having first and second ends, the first end of the spacer coupled to the extending flange of the dispensing head, a nozzle adapted to eject fluid coupled to the second end of the spacer, and a locking nut enclosing the spacer and securely the dispensing head, spacer and nozzle.
摘要:
Fully automated batch production thin film deposition systems configured to deliver uniformity combined with high throughput at a low cost-per-wafer. In some examples, systems of the present disclosure include automated safe wafer handling via low-impact batch transfer via transportable wafer racks loaded with a plurality of wafers. In some examples, systems include a modular pre-heat & cool-down architecture that enables a flexible thermal management solution tailored around particular specifications.