摘要:
An integrated circuit device includes a test circuit and at least one flag generator circuit. The test circuit is configured to generate first and second sets of test results in parallel in response to a memory test operation. The first and second sets of test results respectively correspond to first and second memory banks. The test circuit is further configured to merge respective ones of the first set of test results with respective ones of the second set of test results to provide a set of merged test results to respective ones of a set of output terminals of the integrated circuit device. The at least one flag generator circuit is configured to generate a first flag signal that indicates a presence of at least one memory test error in the first set of test results, and a second flag signal that indicates a presence of at least one memory test error in the second set of test results. Based on the set of merged test results and the first and second flag signals, the test circuit may determine which of the memory blocks of the first and second memory banks includes a defective memory cell therein. Related methods are also discussed.
摘要:
A tester and method are provided for testing semiconductor devices. Generally, the tester includes a multitasking Algorithmic Pattern Generator (APG) to concurrently execute multiple programs on multiple test sites using a single pattern generator. In one embodiment, up to eight test programs are run independently and concurrently on eight independent sixteen-pin devices on a 128 pin test site. When the multitasking APG is ready to broadcast to a device, timing system associated with that device only (and not the other devices) are loaded. While the timing system is executing the cycle of the test programs for the device just loaded, the APG continues on to load the other devices. Because of the slow cycle rates required for programming versus reading, the tester is particularly advantageous for testing flash memory. Optionally, for higher throughput, the APG can be run in lock step at up to a maximum operating frequency of the APG during read cycle of flash.
摘要:
Disclosed is a method for testing a memory device, which can test a memory cell block while testing another memory cell block, so as to catch a process defect of the memory device within a short time period, thereby reducing the test time. The method for testing a memory device provided with a bank including N memory cell blocks and sense amplifiers, the method comprising the steps of: a) expressing the N memory cell blocks as a first, a second, . . . , an Nth memory cell block; b) sequentially activating odd-numbered memory cell blocks of the N memory cell blocks one by one in a predetermined time period; c) performing sense, read (or write) and precharge operations for each activated memory cell block; and d) performing steps a) to c) for even-numbered memory cell blocks after tests for all the odd-numbered memory cell blocks are finished.
摘要:
A semiconductor memory device includes a plurality of memory banks, a data pin for inputting and outputting data, and input/output buffers connected to the data pin. Each of the memory banks has a plurality of memory cells for storing the data. The data pin is enabled and disabled by a pin selection signal. The data pin performs a normal data input/output operation when the pin selection signal is enabled and a termination resistor connected to the data pin is off when the pin selection signal is disabled. The input/output buffers make a termination resistor connected to the data pin off when the pin selection signal is disabled.
摘要:
An integrated circuit is provided, the integrated circuit having a test circuit for reading out an error datum from the integrated circuit in accordance with a test mode, wherein the error datum is output via a first and a second data output, and wherein an address and a read command are applied to the integrated circuit to read out the error datum associated with the address via one of the data outputs. The test circuit is configured in such a manner that, when a first read command is applied, the test circuit outputs the error datum at the first data output and switches the second data output to high impedance and, when a second read command is applied, the test circuit outputs the error datum at the second data output and switches the first data output to high impedance.
摘要:
A column address decoding circuit of a semiconductor memory apparatus includes a predecoder configured to combine a column address and a decoding test signal, thereby outputting a decoding address. A main decoder receives the decoding address, thereby outputting a plurality of column select signals.
摘要:
The present invention relates to a system and method for applying a stress to a hierarchical memory structure in parallel, testing the memory structure for weak defects. The present invention includes writing a logic 0 into all the memory cells in a memory structure. All the high address predecoded lines and alternating predecoded lines for the lowest address are enabled. A voltage drop between neighboring wordlines and bitlines is affected. A logic I is written into all the memory cells in the memory structure. An opposite voltage polarity is caused on the bitlines due to the logic 1 in the memory cells. A reverse voltage polarity stress is achieved on the wordlines by flipping the state of the lowest predecoded line (i.e., by changing the input address corresponding to that line.
摘要:
A semiconductor memory device and method thereof are provided. The example semiconductor memory device may include a memory cell array including a plurality of memory cells, an expected data generating unit receiving a plurality of initial expected data through at least one address pad during a memory operation and generating a plurality of expected data based on the plurality of initial expected data, the at least one address pad being separate from a data input/output pad and a parallel bit test circuit generating test result data based on a plurality of read data and the plurality of expected data.
摘要:
Methods and apparatus for increasing front-end testing throughput by allowing simultaneous access to multiple banks are provided. Techniques described herein take advantage of the reduced number of data lines required for transmitting compressed test data. Data lines effectively freed up due to compression of test data read from one bank may be used to carry test data for another bank.
摘要:
A plurality of semiconductor devices are provided on a carrier for testing or burning-in. The carrier is then cut up to provide single chip-on-carrier components or multi-chip-on-carrier components. The carrier is used as a first level package for each chip. Thus, the carrier serves a dual purpose for test and burn-in and for packaging. A lead reduction mechanism, such as a built-in self-test engine, can be provided on each chip or on the carrier and is connected to contacts of the carrier for the testing and burn-in steps. The final package after cutting includes at least one known good die and may include an array of chips on the carrier, such as a SIMM or a DIMM. The final package can also be a stack of chips each mounted on a separate carrier. The carriers of the stack are connected to each other through a substrate mounted along a side face of the stack that is electrically connected to a line of pads along an edge of each carrier.